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Apr. 2007doc.: 15-07-0682-00-004c Slide 1 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Project: IEEE P802.15 Working Group for Wireless.

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Presentation on theme: "Apr. 2007doc.: 15-07-0682-00-004c Slide 1 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Project: IEEE P802.15 Working Group for Wireless."— Presentation transcript:

1 Apr. 2007doc.: 15-07-0682-00-004c Slide 1 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [DC Component Mitigation in the PHY of Chinese WPAN ] Date Submitted: [Apr. 25, 2007 ] Source: [Chenyang Yang, Yafei Tian, Tingting Liu, Liang Li ] Company: [BUAA, Vinno Technologies Inc. ] Address: [2 Xinxi St, Building D, Haidian District, Beijing, China 100085 ] Voice:[86-10-139-11895301], E-Mail:[ cyyangbuaaa@vip.sina.com, yftian@vip.sina.com, ttliu_Buaa@gmail.com, liangli@vinnotech..com] cyyangbuaaa@vip.sina.comyftian@vip.sina.com ttliu_Buaa@gmail.comliangli@vinnotech..com Re: [ IEEE 802.15 SG4c ] Abstract:[Propose a scheme to remove the DC component in the PHY of Chinese WPAN ] Purpose:[To encourage discussion.] Notice:This document has been prepared to assist the IEEE P802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P802.15.

2 Apr. 2007doc.: 15-07-0682-00-004c Slide 2 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. DC Mitigation(1) The former Pre-processing(2) –All chips of each symbol in the head and load of PPDU should be multiplied by –1 or 1 based on the follow PN code serials. Issue –Only DC components of PHY Header and Data field are removed, but the DC components of Preamble and SFD still remain.

3 Apr. 2007doc.: 15-07-0682-00-004c Slide 3 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. DC Mitigation(2) The modified Pre-processing–Remove DC component The DC components of base sequence is –Subtract A DC from each chip directly in the processing, all DC components of PPDU can be mitigated. –The pre-processing(2) in the former scheme isn’t required.

4 Apr. 2007doc.: 15-07-0682-00-004c Slide 4 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Transmit Signal The Transmit waveform and Spectrum

5 Apr. 2007doc.: 15-07-0682-00-004c Slide 5 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Influence of DC mitigation Base sequence without DC remains major features of Chirp sequence –Robust to frequency offset –Good auto-correlation property Peak Sidelobe Ratio < 11dB –Quasi-orthogonal property Any sequence with perfect auto-correlation must have DC component.

6 Apr. 2007doc.: 15-07-0682-00-004c Slide 6 Submission Chenyang Yang, BUAA Liang Li, Vinno Technologies Inc. Thank you!


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