Presentation on theme: "Who Are we? Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate."— Presentation transcript:
1 Who Are we?Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate in any environment.
2 Our aim Through our flexibility and innovation, we aim to be recognised as trusted technology leaders in the aerospace, space, defence, medical and industrial markets.
3 What we doWe research, design and manufacture an innovative range of MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes, Voltage Regulators and Customised Hybrid Microcircuits.
4 Customers and markets we serve Aerospace Market SegmentsActuationRADAREngine controlFlight subsystems. Space Market segmentsCommercial Satellite - Telecoms, Broadcast, GPS, WeatherExploratory MissionsNano and Cube SatellitesIndustrial Market segmentsRFEnergy (oil/gas, renewable)AudioPower conversion & managementCustomers and markets we serveMilitary Market segmentsTransportationCommunicationsHomeland DefenceAircraftUAVsMotorsport Market segmentsFormula 1 KERSTouring Car KERSMedical Market segmentsAnalytical equipmentOncology equipmentDe Fib
5 Our Portfolio Product/ Technology Features Applications Benefits Discrete SemiconductorsWide Range of modern & traditional packagesScreening to International standardsDown-hole drillingSatellitesDefence programsChoice of silicon to match application35 year pedigree of supplyRF (VDMOS) MOSFETsHigh GainExcellent linearityJammersRadiosBroadcastNever made a part obsoleteHigher performanceVery rugged and reliablePower ModulesIGBT’s, MOSFET’s, DiodesHigh-Rel screeningHermetic or Plastic Hi-RelAircraft ActuationPower Factor CorrectionHybrid Motor DriveExtended reliabilityLong term supplyHarsh environment capabilityHybrid MicrocircuitsSuperior resistor characteristicsMIL-PRF-38534, Class H certified & MIL-STD-883 screening optionsFully customized circuitsHigh temperature operationAero-engine cooling systemsRenewable energy – Solar CPVDriveline modulesExhaust after treatmentReduced sizeImproved circuit performanceEnhanced thermal propertiesImproved reliability5
6 Power Modules Space High Temp Solar Power conversion: Inverters for wind & solarMotor drive: HEV (on and off road), tractionActuation: Hydraulic replacement, steeringDiscrete product for Satellite subsystems:Nano and Cube satellitesGPS and Communications constellationsWeather/Scientific monitoring in SpaceMotor drive actuationControl systemsInvertersPower factor correctionConcentrated Solar energy collection systems - using photo-voltaic cells
7 Automotive KERS Module Customer RequirementPower module solution for racing car Kinetic Energy Recovery System (KERS)SolutionCustom Power ModuleCustom configuration for applicationEnhanced electrical, temperature and mechanical operationValue PropositionHigh temperature capability through using latest available technologiesCustomised solution utilising the latest aerospace technologies to deliver high reliabilityin a very harsh environmentReduced weight through utilising latest materials to deliver a solution that is light yet extremely ruggedCore CompetenceFlexibility – Closely working with the customer to realise their stringent technical & environmental requirementsInnovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the specPedigree - 35 years proven understanding of harsh environment requirements for high temperature and high reliability applicationsStatusSuccessfully designed, built and winning racesCurrently working with teams on the 2013 seasonProven experience and success at the highest performance levelNow looking to move into more race typesReason for success?Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship with customer to understand their application and deliver a winning solution
8 Why Use Microelectronics Braking Resistors/HeatersPower & ControlHigh PowerHigh Density & ReliabilityHigh Frequency
9 Thick Film Circuit Thick Film Ink Systems Printing – Firing – Lasering Gold, Silver, High and low Temperature Copper.Resistor Printing directly in circuit.Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.Automatic printing machines cassette to cassette process.Automatic Laser trimming and continuity testing.Clean-room facility operating on 3 shifts.
10 Technologies Substrates Thick film on 96% alumina or aluminium nitride Directly bonded copper (DBC)Active metal braise on aluminium nitride & silicon nitrideHigh/Low temperature co-fired ceramic (HTCC/LTCC)SteelAluminiumThin filmFR4
11 Technologies Component Attach Wire Bonding Packaging Solder Surface MountPolymer Component and die attachVacuum soldering (Power Die Attach) up to 400oCWire BondingFine wire Au 17um to 33umFine wire Al 25um to 33umLarge diameter Al >125umPackagingHermetic sealingProjection weld & Seam SealCeramic liddingGlob-top / Silicon conformal coat
12 Microelectronics Assembly Clean-room assembly operations.Automated die bonding and wire bonding by pattern recognition.Re-flow soldering and real time x-ray for void detection.Aluminium fine wire bonding for high density signal and control circuits.Large diameter Aluminium wire bonding for power circuits.Hermetic sealing in inert atmosphere.Leak detection.Automatic test facilities.
13 Test, Burn-In and Screening Facilities Two General Purpose ATEs in Chip & Wire Clean Room.One reduced capability, DC only, ATE.One General Purpose ATE for one high volume product.Two ATEs for surface mount hybrids.One tray pack system – measure, accept/reject, pack.One PIC program/test XYZ system.Screening:Temperature cyclingConstant accelerationBurn-inFine & Gross Leak TestPin DBumpLimited range vibration
14 MCM Engine Management Function: Characteristics: Engine management (FADEC)Custom ASIC - CPU, SRAM, EPROM, OscillatorHi Reliability >20yrs lifeCharacteristics:High Temperature Co-fired Ceramic (HTCC)Chip and Wire (>1000 bonds)High Density – Reduced size and WeightHermetically sealedEngine mountedQualified –55oC to +150oCExtended high temperature approval testing –55oC to +205 oC.Completed 1000 hours +205oCCompleted 100 cycles –55oC to 205 oC
15 MCM (Linear) Engine Management – Civil Aviation Function3 Precision instrumentation amplifiersHigh common mode rejectionPrecision gain3 Precision voltage referencesGeneral purpose comparatorCharacteristicsHigh operating temperature -55oC to +150oCEngine mountedThin Film provides high accuracy and stability.Active Trimming to <0.01% tolerance.High precision and accuracy achieved with low cost Commercial Off The Shelf Components.Easily redesigned if amplifiers or reference become obsolete
16 DC/DC Converter – Civil Aviation Function:3 Fixed DC Outputs from 14 to 36VDC28 WattsFlight computer SystemSelf MonitoringSelf DiagnosticsCharacteristics:Mixed power and control circuits.High reliability >20 years life proven through extreme temperature cycling (>3,000 cycles) and HALT testing.Operating temperature -40oC to +95oCHigh packing density.Relatively low cost.
17 Safety Critical Fuse Function: Current applications: 10 amps continuous current carrying capacityFuse activation by external controlFusing time <5 -40oC to +110oCCurrent applications:Wing ice protections system, heater circuit protection (787 Dreamliner)Engine de-icing (Joint Strike Fighter) heater protection
18 Power MCM – Civil Aviation Function:Part of Wing Ice Protection SystemSwitching controls power to wing tip or engine heaters (up to 5 amps continuous without heatsinking).Used in conjunction with thick film solder fuse protection deviceCharacteristics:Each module contains 8 MOSFETs with low Rdson (<138m Ohm)High packing density and low assembly cost (35mm x 20mm)Good thermal managementHigh reliability
19 Sonar Transducer Power Driver – Naval Systems Function:H Bridge MOSFET Switch to control power to sonar antennaIntelligent switch with ASIC control and MOSFET drivers.Characteristics:Each module contains 4 MOSFETs with low Rdson, drivers and control ASICUses mixed technologiesGood thermal managementHigh reliability
20 Flight Controls Steel Dynamic Braking Resistors For Aileron, Elevator and Rudder ActuationIncreased power dissipation by the use of bottom and top heat sinkingLow profile, Low WeightDesign-ins on:Airbus A400MA330 MRTTBoeing 787 EBACS
21 Power Resistor – Motor Speed Control Design for high temperature environmentDesign for high reliabilityLow Profile, fits in motor housing0.7 Ohm ResistanceCurved shape to fit in housingTest RequirementDuty CycleNumberPowerOnOffCycles300W310100100W50,000
22 AIN Heater – Toner Fusing Function:Instantaneous heating with individual control of 3 discrete segments210°C in 2 seconds (1kW)Precision Temperature ControlCharacteristics:Large size printingAlNHi thermal ConductivityResistance to thermal shockDeveloped Inks with Fraunhofer Institute
23 Hi Frequency Telecoms Function: Frequencies up to 38GHz Hi Reliability Direct feed to antennaSmall Package size Characteristics:Low loss at high frequencyGold based ink0.38mm thick substrate down to 0.1% toleranceGood thermal managementPrecise track definition