0. Power & Hybrid Business Unit, Microelectronics

1. Who Are we?
Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate in any environment.

2. Our aim Through our flexibility and innovation, we aim to be recognised as trusted technology leaders in the aerospace, space, defence, medical and industrial markets.

3. What we do
We research, design and manufacture an innovative range of MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes, Voltage Regulators and Customised Hybrid Microcircuits.

4. Customers and markets we serve
Aerospace Market Segments
Actuation
RADAR
Engine control
Flight subsystems
. Space Market segments
Commercial Satellite - Telecoms, Broadcast, GPS, Weather
Exploratory Missions
Nano and Cube Satellites
Industrial Market segments RF
Energy (oil/gas, renewable)
Audio
Power conversion & management
Customers and markets we serve
Military Market segments
Transportation
Communications
Homeland Defence
Aircraft
UAVs
Motorsport Market segments
Formula 1 KERS
Touring Car KERS
Medical Market segments
Analytical equipment
Oncology equipment
De Fib

5. Our Portfolio Product/ Technology Features Applications Benefits
Discrete Semiconductors
Wide Range of modern & traditional packages
Screening to International standards
Down-hole drilling
Satellites
Defence programs
Choice of silicon to match application
35 year pedigree of supply
RF (VDMOS) MOSFETs
High Gain
Excellent linearity
Jammers
Radios
Broadcast
Never made a part obsolete
Higher performance
Very rugged and reliable
Power Modules
IGBT’s, MOSFET’s, Diodes
High-Rel screening
Hermetic or Plastic Hi-Rel
Aircraft Actuation
Power Factor Correction
Hybrid Motor Drive
Extended reliability
Long term supply
Harsh environment capability
Hybrid Microcircuits
Superior resistor characteristics
MIL-PRF-38534, Class H certified & MIL-STD-883 screening options
Fully customized circuits
High temperature operation
Aero-engine cooling systems
Renewable energy – Solar CPV
Driveline modules
Exhaust after treatment
Reduced size
Improved circuit performance
Enhanced thermal properties
Improved reliability 5

6. Power Modules Space High Temp Solar
Power conversion: Inverters for wind & solar
Motor drive: HEV (on and off road), traction
Actuation: Hydraulic replacement, steering
Discrete product for Satellite subsystems:
Nano and Cube satellites
GPS and Communications constellations
Weather/Scientific monitoring in Space
Motor drive actuation
Control systems
Inverters
Power factor correction
Concentrated Solar energy collection systems - using photo-voltaic cells

7. Automotive KERS Module
Customer Requirement
Power module solution for racing car Kinetic Energy Recovery System (KERS)
Solution
Custom Power Module
Custom configuration for application
Enhanced electrical, temperature and mechanical operation
Value Proposition
High temperature capability through using latest available technologies
Customised solution utilising the latest aerospace technologies to deliver high reliability
in a very harsh environment
Reduced weight through utilising latest materials to deliver a solution that is light yet extremely rugged
Core Competence
Flexibility – Closely working with the customer to realise their stringent technical & environmental requirements
Innovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the spec
Pedigree - 35 years proven understanding of harsh environment requirements for high temperature and high reliability applications
Status
Successfully designed, built and winning races
Currently working with teams on the 2013 season
Proven experience and success at the highest performance level
Now looking to move into more race types
Reason for success?
Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship with customer to understand their application and deliver a winning solution

8. Why Use Microelectronics
Braking Resistors/Heaters
Power & Control
High Power
High Density & Reliability
High Frequency

9. Thick Film Circuit Thick Film Ink Systems Printing – Firing – Lasering
Gold, Silver, High and low Temperature Copper.
Resistor Printing directly in circuit.
Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.
Automatic printing machines cassette to cassette process.
Automatic Laser trimming and continuity testing.
Clean-room facility operating on 3 shifts.

10. Technologies Substrates Thick film on 96% alumina or aluminium nitride
Directly bonded copper (DBC)
Active metal braise on aluminium nitride & silicon nitride
High/Low temperature co-fired ceramic (HTCC/LTCC)
Steel
Aluminium
Thin film
FR4

11. Technologies Component Attach Wire Bonding Packaging
Solder Surface Mount
Polymer Component and die attach
Vacuum soldering (Power Die Attach) up to 400oC
Wire Bonding
Fine wire Au 17um to 33um
Fine wire Al 25um to 33um
Large diameter Al >125um
Packaging
Hermetic sealing
Projection weld & Seam Seal
Ceramic lidding
Glob-top / Silicon conformal coat

12. Microelectronics Assembly
Clean-room assembly operations.
Automated die bonding and wire bonding by pattern recognition.
Re-flow soldering and real time x-ray for void detection.
Aluminium fine wire bonding for high density signal and control circuits.
Large diameter Aluminium wire bonding for power circuits.
Hermetic sealing in inert atmosphere.
Leak detection.
Automatic test facilities.

13. Test, Burn-In and Screening Facilities
Two General Purpose ATEs in Chip & Wire Clean Room.
One reduced capability, DC only, ATE.
One General Purpose ATE for one high volume product.
Two ATEs for surface mount hybrids.
One tray pack system – measure, accept/reject, pack.
One PIC program/test XYZ system.
Screening:
Temperature cycling
Constant acceleration
Burn-in
Fine & Gross Leak Test
Pin D
Bump
Limited range vibration

14. MCM Engine Management Function: Characteristics:
Engine management (FADEC)
Custom ASIC - CPU, SRAM, EPROM, Oscillator
Hi Reliability >20yrs life
Characteristics:
High Temperature Co-fired Ceramic (HTCC)
Chip and Wire (>1000 bonds)
High Density – Reduced size and Weight
Hermetically sealed
Engine mounted
Qualified –55oC to +150oC
Extended high temperature approval testing –55oC to +205 oC.
Completed 1000 hours +205oC
Completed 100 cycles –55oC to 205 oC

15. MCM (Linear) Engine Management – Civil Aviation
Function
3 Precision instrumentation amplifiers
High common mode rejection
Precision gain
3 Precision voltage references
General purpose comparator
Characteristics
High operating temperature -55oC to +150oC
Engine mounted
Thin Film provides high accuracy and stability.
Active Trimming to <0.01% tolerance.
High precision and accuracy achieved with low cost Commercial Off The Shelf Components.
Easily redesigned if amplifiers or reference become obsolete

16. DC/DC Converter – Civil Aviation
Function:
3 Fixed DC Outputs from 14 to 36VDC
28 Watts
Flight computer System
Self Monitoring
Self Diagnostics
Characteristics:
Mixed power and control circuits.
High reliability >20 years life proven through extreme temperature cycling (>3,000 cycles) and HALT testing.
Operating temperature -40oC to +95oC
High packing density.
Relatively low cost.

17. Safety Critical Fuse Function: Current applications:
10 amps continuous current carrying capacity
Fuse activation by external control
Fusing time <5 -40oC to +110oC
Current applications:
Wing ice protections system, heater circuit protection (787 Dreamliner)
Engine de-icing (Joint Strike Fighter) heater protection

18. Power MCM – Civil Aviation
Function:
Part of Wing Ice Protection System
Switching controls power to wing tip or engine heaters (up to 5 amps continuous without heatsinking).
Used in conjunction with thick film solder fuse protection device
Characteristics:
Each module contains 8 MOSFETs with low Rdson (<138m Ohm)
High packing density and low assembly cost (35mm x 20mm)
Good thermal management
High reliability

19. Sonar Transducer Power Driver – Naval Systems
Function:
H Bridge MOSFET Switch to control power to sonar antenna
Intelligent switch with ASIC control and MOSFET drivers.
Characteristics:
Each module contains 4 MOSFETs with low Rdson, drivers and control ASIC
Uses mixed technologies
Good thermal management
High reliability

20. Flight Controls Steel Dynamic Braking Resistors
For Aileron, Elevator and Rudder Actuation
Increased power dissipation by the use of bottom and top heat sinking
Low profile, Low Weight
Design-ins on:
Airbus A400M
A330 MRTT
Boeing 787 EBACS

21. Power Resistor – Motor Speed Control
Design for high temperature environment
Design for high reliability
Low Profile, fits in motor housing
0.7 Ohm Resistance
Curved shape to fit in housing
Test Requirement
Duty Cycle
Number
Power On
Off
Cycles
300W 3 10
100
100W
50,000

22. AIN Heater – Toner Fusing
Function:
Instantaneous heating with individual control of 3 discrete segments
210°C in 2 seconds (1kW)
Precision Temperature Control
Characteristics:
Large size printing
AlN
Hi thermal Conductivity
Resistance to thermal shock
Developed Inks with Fraunhofer Institute

23. Hi Frequency Telecoms Function: Frequencies up to 38GHz Hi Reliability
Direct feed to antenna
Small Package size Characteristics:
Low loss at high frequency
Gold based ink
0.38mm thick substrate down to 0.1% tolerance
Good thermal management
Precise track definition

24. Automotive – Mass Air Flow Sensor

25. Industrial – Ink Jet Print Head

26. Military and Avionics

27. Industrial – Power Module