1. Principles of Field Applications and Sales Engineering
new book,
Win IC Designs
Principles of Field Applications and Sales Engineering

2. Outline
1. Purpose of the book 2. Chapters of the book 3. Diagram examples 4. Excerpts 5. Topic examples 6. Writer 7. Ordering information

3. Purpose
This book is based on two decades of diverse experience in the IC (Integrated Circuit) industry. Its purpose is to describe an integrated approach to the practice of field applications and sales engineering.
The IC is more than half a century old. Since the invention of the IC, numerous books have been written about IC design engineering, but no book has been written about IC field applications engineering. This is surprising because deciding what ICs to design (IC definition) depends largely on input from field applications.
This is the first book that describes:
How field applications engineering could best contribute to defining ICs.
How to create strategy for design win of ICs.
How to execute the tactics.

4. Chapters of the Book
1. The role of the field applications and the sales engineer 2. The six stages of design win 3. Determining the IC requirements of a system 4. Win ASIC designs 5. Win memory designs 6. Win microprocessor and MCU designs 7. Using quality and reliability engineering to win designs 8. Price negotiation 9. Supporting distributors and sales representatives 10. Making customer visits effective

5. Hierarchical Information
Example of Diagrams
Hierarchical Information
Much of the information in the book is hierarchical,
thus you can select the level of detail.
Please see the following three slides.

6. opportunity identified
Microprocessor Design Win Checklist
Establish FAE,
Rep, & PME team
Sales makes corporate presentation
FAE writes engineering customer visit report
FAE demos tools
FAE & rep write visit report & raise red flags
Implement vertical sales by having high-level people from both sides
FAE & rep to be present for any questions or concerns when vendor selection is being made
Identify customer decision makers and send invitation
Rep writes business visit report & provides pricing info.
Bring high-level people if sticky business or technical issues
FAE makes engineering presentation
Marketing & CAE write business & engineering proposal
Confirm final decision date
THINGS TO DO
Show samples & starter kits
Submit microprocessor support proposal
“thank you” & list of action items
Have NDA signed
Update & adapt design–win strategy
Get commitment that you will have the last look
Q/A
Set up internal meeting to establish strategy & assign action items
Offer MCU & tools training
Invite corporate executives if needed
Get commitment for follow up visit for a firm reason. E.g., demo tools
Take customer to lunch & get info on competition & further understand motivating factors
FAE creates comparison table vs. Competitions
Discuss software development issues
opportunity identified
vendor selection
1st visit
between visits
2nd visit
3rd visit
promotional agenda
MCU/MPU selection guide
Additional
literature w/
more detail
Tools & documentation
More promotional items. E.g., gifts
Standard engineering & business proposal
Evaluation kit
Component engineering information such as die & packaging info
Specific engineering & business proposal
PowerPoint Presentations
More promotional info such as press release & articles to keep visibility high
THINGS TO PROVIDE
Comparison table & benchmarks generated by CAE (Central App. Eng.)
promotional agenda
General product catalogue (non-MCU products customer could use in this or other applications)
promotional agenda
Application notes
More MPU promotional material. E.g., info on existing systems using same processor

7. Microprocessor Support Proposal (Level 2 Detail)
4. New Designs
HW comparison
Tools demo
Code benchmarking
Evaluation kit
Reference design
Business & engineering support proposal
1. Selection
Roadmap alignment
Technology enhancements
Migration to SoC
Custom microprocessor
High quality & reliability
Fast Q&R corrective action
Global manufacturing
Cost reduction
Customized test/screening
Buffer inventory
Flash programming
JIT Delivery
Assign HW, SW, & tools team
Tools set up and training
HW & SW application notes
Application expertise
Pre-written code
Code conversion
Code debugging
2. Development
3. Production

8. Code Benchmarking (Level 3 Detail)
Explain to your customers that if they would like the proposed embedded microprocessor benchmarked, you would provide this service to them.  The benchmark could be for large parts of the customer’s code or for a critical part of their code that needs to be processed within a specific time.  The code could be in either C (or any high level language) or assembly.  If in C, customer can also evaluate the C compiler’s efficiency.  (C compiler efficiency is the size of the assembly code the compiler generates compared to the size of the assembly code if it was hand-written by an expert assembly language programmer).
If the customer’s application is highly interrupt driven, you could also benchmark multiple interrupts, nested or not nested, from various sources, to benchmark interrupt latency times.
It is said that there are lies, damn lies, and benchmarks.  In order for the benchmarks to be credible and meaningful, your company should ideally belong to a third party consortium that does independent, objective, and unbiased benchmarking. One such organization is The Embedded Microprocessor Benchmark Consortium* (eembc.org). EEMBC’s benchmarks are for commonly used algorithms in consumer, automotive, and networking applications.
If there are benchmarks you can provide to your customer that were performed by EEMBC, provide it.
(*Similar independent benchmarking organizations exist for ASICs. Instead of running code, they design circuits using various ASIC suppliers’ library and then benchmark / simulate the speed and power consumption of these circuits.)

9. Topic Examples 12 areas of FAE expertise
16 entities FAEs interact with
15 ways to find opportunities
6 stages of the design win
5 ways to use quality and reliability engineering to win designs
12 types of IC prices
16 ways to obtain a lower price from IC marketing
5 ways to convince a customer to accept a higher price

10. Writer Responsibilities IC test and qualification engineer, FAE, PME
Types of ICs
MCUs, ASICs, and memories
Types of Companies
IC manufacturer, seller, and user
Companies
Hitachi, Xerox, Siemens, Mitsubishi, Toshiba, Impact/Memec (distributor)*, NEC
Most professionals in IC sales learned about ICs and the IC business while working for an IC company. Sasan Khajavi, however, learned about ICs while working for a systems company. He was an IC test and qualification engineer at Xerox, where he selected and qualified ICs from dozens of IC vendors. Being on the other side of the fence, he learned firsthand how system companies make complex IC and IC vendor selection decisions.
Sasan has written about embedded (non-pc) microprocessors in Electronic News and NASA Tech Briefs.
*Microchip Inc. dedicated FAE

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