Presentation on theme: "The Complete Process Solution"— Presentation transcript:
1 The Complete Process Solution RJR Polymers, Inc.The Complete Process Solution
2 RJR Polymers, Inc.Specializes in the manufacture of Injection Molded Plastic Packages, Pre-applied Adhesives, Equipment and Processes that provide additional service to our customers in the Electronics Industry.Provide engineered solutions to our customers demanding product and process applicationsAllow our customers to focus on their core competencies.Can manage your product from design through to high volume offshore manufacturing through our licensed partners
3 Market Mix RF/ Wireless Imaging Medical Military WAN/ LAN/ Broadband TelecomAutomotiveMEM’s, MOEM’s, sensors, etc.
6 MaterialsFull staff of polymer chemists have formulated a complete line of B-staged adhesives.Our view of the entire process has allowed us to design functional materials you require today and the future.The common goals of all our materials are:Ionic purityNear ‘Zero” outgassingFuse or cure in minutes (pushing the boundaries of today’s competitive materials)No Mess (it’s pre-applied)!!
7 RJR’s pre-applied Materials Air CavityPackage LidsPlasticCompositesGlassCeramicMetalGlass WindowsFor CCD, CMOSand otherVision DevicesFlip Chip DevicesThermout™Pulls heat away from thedevice through the lidAdhesive Options* Thermo-Set* Thermo-Plastic* Electrically Conductive* Thermally Conductive
8 RJR’S Optical Products GlassStandard ProductsBorosilicate glassSchott D263, Corning 1737F, Corning D211Supplied in standard thicknesses of 0.54mm and 0.71mmMaterial supplied cut on tape on rings (plastic or metal)Typical epoxy dispense pattern:0.76/1.40mm wide0.05/0.2mm height0.25mm typical pullback from edgeStandard Coatings availableCan be supplied beveledWafer CleaningGlass capacity to millions of units per month
9 Microwave Application Low Chloride Quick Bond 1. RJR Supplied lids pre-applied Quick Bond2. Place Packages and lids into the ITS or AITS3. Start the cycle4. Time from Start to cured ~ 4 minutes5. Material is then fully cured!
10 Flip Chip Application Thermout™ Resilient material built to maintain thermal contact between a die and a lid or coverB-stage material that is pre-appliedCan be applied to ceramic or metalsExhibits elastomer type behavior at elevated temperatures to maintain thermal performanceRetains elongation and resiliency at low temperatures
12 Flip Chip Application Thermout™ Will withstand Mil-Std thermal cycling requirementsFor PBGA Applications – Materials available that will pass MSL Level IIIFor CBGA (HTCC or LTCC) Applications – Materials available that will pass MSL Level I168 hr. AutoclaveCan be manufactured with a variety of thermally enhanced fillers – Aln, BN, Ag
13 Sealing EquipmentOur staff of Expert Engineers have designed Semiautomatic AND Fully Automatic solutions for your Packaging sealing needsOUR Focus:Increase throughputFunctioning today and with future applicationsIncrease yieldsEliminate “Blowouts”Accurate lid placementDecrease required floor space (REAL ESTATE)
14 Equipment - ITS (Isothermal Packaging System) SemiautomaticCustom Design & Built PlatesControls:TimePressureTemperatureUPH: *99% + Yield** Run Rates are Dependant onPackage Size and Configuration
15 Air Cavity Package Technologies Plastic BackedFor Low Energy Cavity PackageApplications likeSensors, etc.CCD / CMOS(Thermo-Plastic)For Vision and OpticalSensor applications.Thermally EnhancedMetal BackedEutectic & Non-eutectic applications withhigh thermal transfer
16 Eutectic Die Attach in a Plastic Air Cavity Package ! This technology represents a breakthrough in polymer based air cavity electronic packaging. This new low cost injection molded packaging process allows the user to combine the thermal advantages gained by using a eutectic die attach material between die and backplane, with a moisture resistant plastic sidewall specifically designed to manage the higher power and frequency output values previously found only in ceramic packaging systems/ technology.Features:Eutectic Die attachMoisture resistantLow CTECTE matched packageLow DielectricLow ParasiticsHigh PowerHigh FrequencyLow Cost !Package Applications:RF/ MicrowaveWLAN/ LANShort Range WirelessMEMS/ MOEMSLDMOSCCD/ CMOS
17 RJR’s Injection Molded Packages Package BuildupEssentially 3 layersThermal Base (Cu, WCu, CuMoCu, AlSiC, etc)Sidewall with leadsLids with epoxy (pre-applied)RJR formulated epoxy as interstitial layersPlastic alloy formulated to match the CTE of Copper or Copper alloys (WCu, CuMo, etc.)Leads are coated with moisture resistant polymer, then injection moldedThe 3 layers are fused together using RJR ITS equipment
18 RJR’s Injection Molded Packages Thermal Package PerformanceMoisture ResistantEutectic Die attachableThermal Dissipation >10 wattsHandle Frequency > 2.5 GHz Have parts in service at 5.8 GHzPass JEDEC Level I Moisture Pre-ConditioningPass Mil-Std 883 Section 1010 Condition C temp cycleAnticipated improvement in electrical performance compared to ceramic
19 RJR Air Cavity Package Technologies Benefits of RJR Packages vs CompetitionEqual or superior performance compared to ceramic packages.Fast turnaround time (two weeks) for prototype assembly.Lower tooling costs.Substantially less expensive !!All Packages Available in Leadframe FormatBenefits of Thermally Enhanced Plastic Packages:Improved heat dissipation = lower die operating Temp. = longer life!Less Expensive !!!
20 Customer location –or- RJR Location Thermally-Enhanced PackageBuild process procedure (eutectic die attach)Process StepsRJR Polymers1) Package Base2) Leadframe with moisture barrier applied3) Injection mold sidewall over leadframe4) Nickel and Gold plate leadframe5) Epoxy coat molded sidewallCustomer location –or- RJR Location6) Perform Die attach to base leadframe7) Using RJR’s ITS system – attach assembled baseleadframe to coated injection molded sidewall8) Wire Bond device to package9) Using RJR’s ITS system – seal packagelid to molded sidewall10) Trim, Form and singulate
21 Thermally-Enhanced Package Exploded View Package lid with pre-applied adhesiveLid Material: Plastic, Ceramic, Metal, Glass, etc.Injection molded sidewallShown with moisture resistant seal encapsulating the leads and pre-applied adhesive on bottom surfaceWire BondsDeviceSolder Preform or Epoxy, etc.Package BaseBase Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, etc.Completed Package
22 RJR’S Optical Packaging 28, 32, 40, 48 and 52 lead count packages standard tooledPackages are capable of JEDEC level 1 for moisture pre-conditioningFrom design to prototypes in 6 weeks.Customers experience Low Cost/ Low barriers to entry for product mechanical testing/ samplingRJR’s offers product solutions for drop in replacements as well as new/ custom packaging.RJR solution includes the use of RJR assembly technology
23 RJR Polymers RF Power Products LDMOS, MMIC, FET, pHEMT, Wide BandgapPower levels to +150 wattFrequency Management to +5.8 GHzEutectic Die attachable (like all RJR Packages)Enabling TechnologyInternally matched elements transform impedence to manageable levelsFlat sealing surface – reduces gross leak failureLeadframe processing/ assemblyLow cost – approx. 60% of ceramic equivalents
24 RJR Air Cavity Package Costs/ Deliverables Benefits of R-Pak vs CompetitionRapid turnaround time (~6 weeks) for prototype/ custom packagesFast turnaround time (two weeks) for prototype assembly.Substantially lower tooling costs.Substantially less expensive packages !! Typically half the cost of ceramic.Low barriers to entryLow Cost toolingLow cost packagesBudget friendly
25 RJR’s Injection Molded Package Program Rewards Equal or superior performance compared to ceramic packages.Moisture ResistantEutectic, epoxy, RTV, etc. Die attachableThermal Dissipation >10 wattsHandle Frequency >= 5.8 GHzCan Pass JEDEC Level I Pre-ConditioningPass Mil-Std 883 Section 1010 Condition C temp cycle
26 RJR Plastic Alloy – HTP-1000 R-Pak Plastic Body CompoundThis custom thermoplastic compound is used in RJR R-Pak plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications.Physical:Density: gm/cc ASTM D792Water Absorption 0.02% ASTM D57023C:Tensile Strength 21,000 PSI ASTM D638Tensile Modulus 2.5 X 106 PSI ASTM D638Break 1.2% ASTM D638Flexural Strength 31,000 PSI ASTM D790Flexural Modulus 2.4 X 106 PSI ASTM D790IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256Thermal:Melting Point 280C (536F) ASTM D34181.8 Mpa (264 PSI) 270C (518F) ASTM D648Electrical:Volume Resistivity ohm-cm ASTM D257Surface Resistivity ohm IEC 93Dielectric Strength 766 V/mil ASTM D149Dielectric Constant 1 kHz ASTM D150100 kHz10 MHzDissipation Factor 100 kHz ASTM D150@ 10 MHz ASTM D150Arc Resistance 165 Sec. ASTM D495Comparative Tracking Index 175 volts ASTM D3638Chemical Resistance:Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.
27 RJR Polymers Quality System Roadmap to ISO Certification - Scheduled for Q3 2003Supplier to Global OEM’sMotorolaEricsson/ Infineon MicroelectronicsAgere SystemsPhilips SemiconductorsEtc.ASQC Plan (Incoming and Outgoing)Provide QA on all components of product manufactureRaw materials for epoxy, plasticsLidsPackaging productsLot to Lot traceability back to Raw Material Components
28 RJR Summary The Total Electronic Package Solution RJR has the technology backgroundIntegrated manufacturerProvide SolutionsManage the manufacturing cycle in-houseDesignProduct DevelopmentMaterialsInjection MoldingCoating products with epoxiesLight/ Prototype assemblyOffshore PartnersEquipment manufacturer – ITS, AITSInnovative thinkingThe Total Electronic Package Solution
29 South KoreaKen ParkFar East RepresentativeByuk-San BLDGJookjeon-ri, Su-ji-Up Yong-in SiKyunggi-Do, KoreaMobile:FaxEuropeRenaud de LangladeEuropean RepresentativeManaging DirectorNovaPack TechnologiesParc d’Activities de Pissaloup4 rue Edouard Branly78190 TrappesFrancePhFaxMobile:Eastern USAScott MellenEastern Regional Sales Manager/Sales EngineerPh (315)Fax (315)Mobile: (315)Western USA David Pasfield Western Regional Sales Manager/ Sales Engineer Ph (707) Fax (707) Mobile: (707)Midwestern USADave DeWireDirector Sales and MarketingPh (303)Fax (303)Mobile: (303)Taiwan/Pacific Rim RegionMichael LeongPacific Rim Regional Sales Manager/Sales Engineer, Jalan GangsaGreenlane HeightsPenang 11600MalaysiaPhFaxMobile:RJR Polymers Inc. Contact Information