1. Molded Interconnect Devices (MID) Market – Global Industry Forecast & Analysis over 2020 - 2026
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2. Molded Interconnect Devices (MID) Market Scenario:
It has been estimated that global MID market size will be worth more than US$1 billion by 2026, with a positive application outlook in automotive, electronics, and industrial sector. Smartphones and smart wearables have gained immense popularity over the past decade. The deployment of MID into these gadgets helps improve circuit density and eliminate unnecessary components by combining circuit boards, cables, and connectors.
Constant technological innovations over the years have resulted in significant miniaturization of electronic devices. Molded interconnect device (MID) is one such technology which is increasingly gaining prominence in the automotive and consumer electronics sector on account of its space-saving circuitry. The technology has been widely adopted by smartphone makers worldwide as it allows more electronic features to be fit into smaller volumes.
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The presence of established automotive and electronics companies in Asia Pacific will be a major factor driving the demand for the technology. These companies are making substantial R&D efforts and investments in new product development. The region is also one of the leading markets of consumer electronics such as smartphones, laptops, routers and printers. Growing integration of MID antennas and circuitries into these devices will definitely complement the regional outlook.
The presence of tech giants such as Apple and Google in the U.S. promises lucrative opportunities for regional MID developers and suppliers. Laser direct structuring (LDS) process segment is projected to exhibit a robust 15% CAGR through The process is widely used by OEMs owing to the elimination of harmful chemical pretreatment during metallization. Prototyping becomes considerably faster and repeatable by simply reprogramming the laser unit.
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4. Competitive Analysis:
Regional Analysis:
North America is slated to grow substantially in the near future. Regional manufacturers are exploring ways to implement innovative features into smartphones and other smart devices. The integration of molded interconnect device could help tech firms deliver compact, reliable, and more advanced features into electronic gadgets.
Competitive Analysis:
Some of the prominent players in Molded Interconnect Devices (MID) Market Amphenol T&M Antennas, Galtronics, Harting Mitronics AG, LPKF Laser & Electronics AG, MacDermid Enthone, Molex, Multiple Dimensions AG, RTP Company, S2P smart plastic product, SelectConnect Technologies, Suzhou Cicor Technology Co. Ltd, TE Connectivity, Teprosa GmbH, Tongda Group, Yomura, Material Suppliers: BASF, DSM, EMS-GRIVORY, Ensinger GmbH, Division Ensinger Compounds, Evonik Industries, Lanxess, Mitsubishi Engineering Plastics, PTS Group, RTP, Sinoplast New Material Ltd., Zeon Corporation
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