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Day 25: November 8, 2010 Memory Core

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Presentation on theme: "Day 25: November 8, 2010 Memory Core"— Presentation transcript:

1 Day 25: November 8, 2010 Memory Core
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 25: November 8, 2010 Memory Core Penn ESE370 Fall DeHon

2 Today 6T SRAM review 5T SRAM Multiport SRAM DRAM Leakage
Charge sharing Precharge Multiport SRAM DRAM Leakage Penn ESE370 Fall DeHon

3 Memory Bank Penn ESE370 Fall DeHon

4 SRAM Memory bit Penn ESE534 Spring DeHon

5 Memory Bank Penn ESE370 Fall DeHon

6 5T SRAM Penn ESE370 Fall DeHon

7 Consider What happens to voltage at A when WL turns from 01
Assume Waccess large Waccess >> Wpu=1 Penn ESE370 Fall DeHon

8 Voltage After enable Word Line
QBL = 0 QA = (1V)(g(2+Waccess)C0) CBL>>CA=(g(2+Waccess)C0) After enable Waccess Total charge roughly unchanged Distributed over larger capacitance~=CBL VA=VBL~= CA/CBL Penn ESE370 Fall DeHon

9 Larger Resistance? What happens if Waccess small? Waccess < Wpu
Penn ESE370 Fall DeHon

10 Simulation: Waccess=100 Penn ESE370 Fall DeHon

11 Simulation Penn ESE370 Fall DeHon

12 Charge Sharing Charge sharing can pull down voltage
Penn ESE370 Fall DeHon

13 Consider What happens to voltage at A when WL turns from 01
Assume Waccess large Penn ESE370 Fall DeHon

14 Simulation Waccess=20 Penn ESE370 Fall DeHon

15 Simulation Waccess=4 Penn ESE370 Fall DeHon

16 Charge Sharing Charge sharing can lead to read upset
Charge redistribution adequate to flip state of bit Penn ESE370 Fall DeHon

17 How might we avoid? Penn ESE370 Fall DeHon

18 Precharge to middle Voltage
Precharge to Vdd/2 Now charge sharing doesn’t swing to opposite side of midpoint Penn ESE370 Fall DeHon

19 Simulation Waccess=20 Penn ESE370 Fall DeHon

20 Multiport RAM Penn ESE370 Fall DeHon

21 Mulitport Perform multiple operations simultaneously
E.g. Processor register file R3R1+R2 Requires two reads and one write Penn ESE370 Fall DeHon

22 Simple Idea Add access transistors Penn ESE370 Fall DeHon

23 Watch? What do we need to be careful about?
Penn ESE370 Fall DeHon

24 Isolate BL form Mem Larger, but more robust
Essential for large # of read ports Penn ESE370 Fall DeHon

25 Adding Write Port Penn ESE370 Fall DeHon

26 Write Port What options does this raise? Penn ESE370 Fall DeHon

27 Opportunity Asymmetric cell size Separate sizing constraints
Weak drive into write port (Wrestore) Strong drive into read port (Wbuf) Penn ESE370 Fall DeHon

28 Multiple Write Ports Penn ESE370 Fall DeHon

29 DRAM Penn ESE370 Fall DeHon

30 1T 1C DRAM Simplest case – Memory is capacitor
Feature of DRAM process is ability to make large capacitor compactly Penn ESE370 Fall DeHon

31 1T DRAM What happens when read this cell?
Penn ESE370 Fall DeHon

32 1T DRAM On read, charge sharing Small swing on bit line
VBL = (Cbit/CBL)Vstore Small swing on bit line Must sense Means want large Cbit Limits bits/bitline so VBL large enough Cell always depleted on read Must be rewritten Penn ESE370 Fall DeHon

33 Dynamic RAM Takes sharing idea one step further
Share refresh/restoration logic as well Penn ESE534 Spring DeHon

34 3T DRAM Penn ESE370 Fall DeHon

35 3T DRAM How does this work? Penn ESE370 Fall DeHon

36 3T DRAM Correct operation not sensitive to sizing
Does not deplete cell on read No charge sharing with stored state Must use Vdd+VTN on BL to write full voltage Penn ESE370 Fall DeHon

37 Some Numbers (memory) Register as stand-alone element  4Kl2
Static RAM cell  1Kl2 SRAM Memory (single ported) Dynamic RAM cell (DRAM process)  100l2 Dynamic RAM cell (SRAM process)  300l2 Penn ESE534 Spring DeHon

38 Energy Penn ESE370 Fall DeHon

39 Single Port Memory What are most cells doing on a cycle?
What fraction is involved in a read/write? When not doing a read or write? Reads are slow Cycles long  lots of time to leak Penn ESE370 Fall DeHon

40 ITRS 2009 45nm C0 = 0.045mm × Cg,total High Performance Low Power
Isd,leak 100nA/mm 50pA/mm Isd,sat 1200 mA/mm 560mA/mm Cg,total 1fF/mm 0.91fF/mm Vth 285mV 585mV C0 = 0.045mm × Cg,total Penn ESE370 Fall DeHon

41 High Power V=1V d=1000 g=0.5 Full swing for simplicity Csc = 0
(just for simplicity, typically <Cload) Cload=1000C0 ≈ 45 fF = 45×10-15F WN = 2  Ileak = 9×10-9 A P= (45×10-15) freq ×9×10-9 W Penn ESE370 Fall DeHon

42 Relative Power P= (45×10-15) freq + 1000×9×10-9 W
Break even at freq=200MHz Partial swing on bit line Reduce dynamic energy Increase percentage in leakage energy Penn ESE370 Fall DeHon

43 Consequence Leakage energy can dominate in large memories
Care about low operating (or stand-by) power Use process with high Vth Reduce leakage at expense of speed Penn ESE370 Fall DeHon

44 Admin Size your memory cell André office hours Tuesday
Andrew office hours Wednesday and Thursday Penn ESE370 Fall DeHon

45 Idea Memory can be compact Rich design space Demands careful sizing
Penn ESE370 Fall DeHon


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