1. Military/Aerospace PCB
Est. 1986
Military/Aerospace PCB

2. ShinDuk Electronics(SDE)
▣ Company Profile
Corporate
ShinDuk Electronics(SDE)
C E O
Mr. SC Park
Established
1986. Feb. 25 (PCB Manufacturer)
Expansion
1993 Siheung
Factory SIZE
5,600m^2
IN House
1996 D/S, MLB
- Full IN LINE PCB Manufacturer
CU plating
2011 Electric, Electroless
Tin Line
2017 Flat TIN Line 150ft
Capacity
25,000㎡/month(Printing Standard)
exchange
Private, Not listed
Employees
108 3

3. AS-9100 D Military/Aerospace
▣ Certifications
ISO–14001
Environment
2005/09
Updated on 2018
SQ (A)
Hyundai/Kia
2006/02
Updated on 2017
IATF 16949
Auto Quality
2007/1
Updated on 2018
U L
UL Mark
2007/06
AS-9100 D
Military/Aerospace
2015/10
Updated on 2018

4. ▣ Gross Yearly 32 28 30 27 Revenue ( US $ ) Fiscal Year Year 2015 2016
2017
2018
Amount
USD $28 Million
USD $27 Million
USD $32 Million
USD $30 Million 32 28 30 27
Revenue ( US $ )
Fiscal Year

5. Global Customers

6. San Jose, California
SDE America

7. SDE America 3301 Tisch Way Suite #100PW San Jose, CA 95128
Kathleen Groeschen
Office:
Mobile:

8. ▣ Technologies BACK Drill
Offering inexpensive alternative to buried and blind vias
Eliminating additional drilling and lamination steps
Removing unwanted “stub section” (the copper from the via)

9. Impedance Matching ▣ Technologies Dual/ Differential Single/Controlled
Devices intended to present an apparent load to the source of Zload = Zsource* (complex conjugate matching). Given a source with a fixed voltage and fixed source impedance, the maximum power theorem says this is the only way to extract the maximum power from the source. Devices intended to present an apparent load of Zload = Zline (complex impedance matching), to avoid echoes.
Devices Given a transmission line source with a fixed source impedance, this "reflection less impedance matching" at the end of the transmission line is the only way to avoid reflecting echoes back to the transmission line.
Devices intended to present an apparent source resistance as close to zero as possible, or presenting an apparent source voltage as high as possible. This is the only way to maximize energy efficiency, and so it is used at the beginning of electrical power lines. Such an impedance bridging connection also minimizes distortion and electromagnetic interference; it is also used in modern audio amplifiers and signal-processing devices.
Dual/ Differential
Single/Controlled

10. ▣ Technologies B.V.H (Buried/Blind Via Hole) B
Blind & Buried Via technology has played a pivotal role in squeezing more capability into a smaller space. By shortening vias to only pass through necessary layers, more surface area become available for components
Key benefits include:
 Ability to meet the density constraints of lines and pads on a typical design without increasing the layer count or board size
PCB aspect ratio reduction B

11. ▣ Technologies Counter Sink Hole & (HPL) Hole Plugged Land
A common use is to allow the head of a countersunk bolt, screw or rivet, when placed in the hole, to sit flush with or below the surface of the surrounding material. A countersink may also be used to remove the burr left from a drilling or tapping operation thereby improving the finish of the product and removing any hazardous sharp edges
HPL (Hole Plugged Land), HP (Hole Pugged), TENTED VIA are currently apply to our production process
HPL (Hole Plugged Land), HP (Hole Plugged), TENTED VIA

12. Cutting a sheet into panel sizes Drilled hole size check
▣ Full In-house line
Cutting a sheet into panel sizes
DATA & FILM check
CAM (FILM AOI)
Pin stacking
Chamfer
Cutting
8 machines
(Automatic Optical Inspection)
Drilled hole size check
Applying thermal heat and pressure to create one product
HOT PRESS(MLB)
CNC Drill
HOLE AOI
HOLE CHECK M/C
F/P

13. Connecting layers by plating holes Drying the printed side
▣ Full In-house line cont.
Cleaning foreign substance
LDI
Developing Etching and Stripping
Connecting layers by plating holes
Copper Plating
D/F Surface Treatment
Pattern Imaging
D.E.S
F/P
(Photo Solder Resister)
Component/ top/ primary side
Drying the printed side
OPEN, SHORT Testing
A O I Inspection
PSR Print(C/S)
Drying
PSR Print (S/S)
Solder/ bottom/ secondary side

14. Checking for Open & Short
▣ Full In-house line cont.
Drying printed side
Silk labeling
Drying
PSR Exposure
PSR Developing
Marking Print
55ft. Long line
Gold/HASL Plating
2 machines
Checking for Open & Short
(Bare Board Test )
Final Dryig
Surface Treatment
Flying BBT
Routing/ V-CUT
F/P
*Picture: Tin Line 36meters

15. LDI (Laser Direct Imaging)
▣ Extra equipment for IPC3
Hole Plugging M/C
Inkjet Printer
LDI (Laser Direct Imaging)
FLYING PROVE E-TESTER
Via Filling machine
Saturn – 8000
MIVA Laser Direct Imaging
Microcraft Moving Probe BBT
2018
2017
Via and Micro holes
Contactless imager
OPEN,SHORT 4WAY inspection
*Same machine as PCB Tech

16. ▣ Reliance Testing Equipment
3D Measurement
Pressure Cooker Tester
Thermo Hygrostat
ION Contamination Checker

17. Plasma – JESAGI Korea UV Laser Drill – ESI 5335
▣ Equipment Investment Plan 2019
Plasma – JESAGI Korea
UV Laser Drill – ESI 5335

18. ▣ Materials