1. 二零一六台灣平坦化論壇 2016 CMP Forum Taiwan
Sept. 7 13:05‒13:10
Opening Remarks:
Dr. CS Chern, Director of MTC, TSMC
Chairman of Board Directors of CMPUGTW
Session (I) Moderator: Dr. Chao-Chang A. Chen, Chair, Distinguish Professor, ME, NTUST
Director, CMP Innovation Center
13:10‒13:40
Innovations! - CMP to support Semiconductor technology
Dr. Tsujimura, CTO, Ebara Company
13:40‒14:10
2) Development of Novel Cu Slurry for The Advanced IC Manufacturing (Tentative)
Dr. Mingshih Tsai, Senior Scientist, Air Products and Chemicals, Inc.
14:10‒14:40
3) Dresser Development (Tentative)
Dr. Scott Lawing, KINIK Company
14:40‒15:10
4) Innovation on Pad Manufacturing (Tentative)
Senior Researcher, Dow Chemical Company
15:10‒15:30 Break

2. 二零一六台灣平坦化論壇 2016 CMP Forum Taiwan
Session (II) Moderator:
Sept. 7
15:30‒16:00
5) CMP Technology for Advanced Package Substrate
Professor Haedo Jeong , School of Mechanical Engineering,
Pusan National University, Korea
16:00‒16:30
6) Post CMP Inspection (Tentative)
Dr. Igor Turovets, Senior Scientist, NOVA Measuring Instruments
16:30‒17:00
AFM Measuring Techniques (Tentative)
Senior Researcher, Bruker Corporation