1. SIA Update on Patent Quality Philip Wadsworth (QUALCOMM)
2/18/2019 5:43 PM
SIA Update on Patent Quality
Philip Wadsworth (QUALCOMM)
Daryl Hatano (SIA)
Ian Steff (SIA)
February 2, 2011
2/18/2019

2. SIA in U.S. report at September IPTF meeting:
SIA met with USPTO Patent Commissioner Robert Stoll and his team on July 23 at the USPTO office in Arlington Virginia.
SIA’s presentation to the USPTO:
noted that SIA is neutral on patent reform bill.
Reviewed background of IPTF survey methodology.
USPTO responded that it would like to improve patent quality through increased training for patent examiners, and asked for industry assistance. 2 2 2

3. USPTO Training Opportunity
Technology Center 2800, which examines semiconductor patent applications, is having a tech fair at USPTO Headquarters in Alexandria, VA on May 10th and 11th, 2011.
The event is organized under the Patent Examiner Technical Trainings Program (PETTP) announced in the Federal Register on September.
TC 2800 is seeking lectures/presentations from industry experts. All 1200 examiners in TC 2800 are invited to participate and the audience for any given lecture varies from 40 to 200. The sessions should be a descriptive overview of the technology and the state of the art, with less emphasis on equations.
In the past, companies have found it to be well worth their time to volunteer speakers as it provides USPTO with a basis for understanding a specific product area and improves patent quality.
IPTF members with operations in the U.S. are welcome to send speakers
to help improve patent quality. 3 3 3

4. Training Topics
Technology Center 2800 examines semiconductor patent applications, and the Federal Register notice lists technical training topics of interest as:
Mixed signal design and architecture, flexible displays, OLED display technology, nitride semiconductors, compound semiconductors, nanodevices, power converters, image sensors, motor controls, CMOS technology, quantum electronics, analog to digital and digital to analog converters, organic semiconductors, micro-opto-electromechanical systems, ASIC design, spintronics and magnetic random access memory (MRAM), nonvolatile memory devices, semiconductor and electronic packaging technologies, solar cells, digital logic circuits, laser and fiber optics, phase change memory, photolithography, thin film deposition, light emitting diodes, digital cameras, optical waveguides, antennas, printing technology, MEMs, multilevel interconnections, LCDs, x-ray applications, photonic crystals, green power generation technologies, and sensors. 4 4 4