Technology and Product Update

Technology and Product Update
Isola Technology and Product Update June 2005

Isola Technology Agenda
Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities

Isola Technology Overview

Emerging Trends High Speed Digital Optical Solutions
- High Gbps Data rates. - High Clock speeds Optical Solutions Gbps data rates and beyond Lead free and Thermal Reliability Higher Thermals Higher Thermal Cycling resistance Miniaturization - Thinner Dielectrics - Embedded passives - Packaging Thermal Management - Thermal conductive Substrates Environmental - Halogen Free Manufacturing and Process Technology Signal Integrity Lead Free

L e a d Free Isola’s Product offering- High Tg High performance
T Mins/Td.400** P Tg Polyimide HB L e a d Free IS625 IS500 P Tg Polyimide V0/V1 Military/Computers/drilling T Mins/Td.350** IS420 IS415 IS620 Tg 215 Low Loss Ghz Laminate IS410 180° Tg FR Tg Low Dk & Df IS640 Next Generation Low Loss-.005 Thermal Performance T260/ Decomp./IST G200 BT Epoxy Laminate High Speed Digital / Base stations/Routers/Servers/Burn in Higher Reliability High Speed /High Frequency T Mins/Td.300** FR406 High Tg 170° Epoxy Telecom Gbps* Low Freq and speed 1 -1.5Gbps * Gbps * Electrical Performance Loss /DK * Speeds a function of design such as line length etc. **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes.

Isola Product Offering
Tg 260 Polyimide Laminate V0/V1 P96 IS Low Loss Tg 260 Polyimide Laminate HB P95 Next Gen Low Loss R F & M I C O W A V E IS Low Loss IS640 Performance Tg 215 Low Loss Ghz Laminate IS620 IS Low Loss BT / Epoxy Laminate G200 IS Low Loss Tg 180 Low Dk & Df FR408 High Tg Lead free Signal Integrity IS Low Loss IS415 Thermal Conductive IS450 IS420/IS410 High Tg Lead free High Reliability Chip Packaging IS420 High Tg 170° Epoxy FR406/DE117 High Tg 180° Halogen free FR406 NF/A11 Low Flow No Flow IS500 Tg 150 Halogen Free Laminate DE156 FR406BC IS410 BC FR408 BC Buried Capacitance Applications Tg 140 Multifunctional FR402/DE114 Tg 130 FR-4 Multifunctional ED130UV Tg 150 Lead Free High Reliability IS400 FR-4 ED130 Application

Signal Integrity- Overview
Drivers Overview of Technical issues High Speed Basics Key definitions Measurements Time domain measurements Losses Dielectric losses Conductor losses Conductor roughness losses Frequency domain measurements Isola offering Product selection criteria

Drivers - High Speed and High Frequency

High Speed Digital basics
High Speed digital communication involves sending bits of information coded on Trapezoidal waveforms. The Information - Zeros and ones are coded on the rise time or on both the rise time and fall time. High Voltage is 1 and Low voltage is zero The conductive paths between a chip that sends a signal to the chip that receives a signal are called interconnects, A group of interconnects represents a bus The sharper the Rise time the faster the signal To achieve faster rise times Sinusoidal wave forms are superimposed on one another. The range of frequencies used is called bandwidth The bandwidth is given as =0.35/Rise time Example a 2.5 Gbps signal with a rise time of 70 Ps will have a fundamental frequency = 1.25 Ghz and a second cut off frequency of 4.5 Ghz and a 2.5 Gbps signal with a rise time of 125 Ps will have a fundamental frequency equal to 1.25 Ghz and a bandwidth or second cut off frequency = 2.5 Ghz. Frequency is a function of Data rate and bandwidth is a function of Rise Time

Time-domain definition of a periodic digital clock signal with analog definitions of rise time, fall time, and duty cycle. From Practical RF circuit Design for Modern Wireless systems Vol1 – Les Besser and Rowan Gilmore

Digital detector output signal - eye diagram - shows the effect of random jitter. A large eye amplitude and small difference between bit window and eye duration are necessary for low bit error rate.

Eye Pattern Analysis Margin Signal with Noise
The “Eye” One Bit Length Signal with Noise Good Sampling Period Margin Jitter Height of the central eye opening measures noise margin in the received signal Width of the signal band at the corner of the eye measures the jitter Thickness of the signal line at the top and bottom of the eye is proportional to noise and distortion in the receiver output Transitions between the top and bottom of the eye show the rise and fall times of the signal Reference: Handbook of Fiber Optics

After 40 inches through IS640
The effect of Laminate substrate on Signal integrity A 10 Gbps signal at source After 40 inches through IS640 After 40 inches through 406

Isola Products and Signal integrity in time domain
Simulated Eye 5 Gbps -1 M -50 Ohms impedance 5 Mil Track width PRBS 35 PS Rise time At Source Zero Dielectric Loss IS640 Df =.004 IS620 DF= FR408 DF= FR4 Df =.020

High Speed Digital Drivers
Trends Rising Bandwidths- Bandwidth Approx.=0.35/Rise time Faster edge rates ----> 35 PS and lower High Data rates 10 Gbps/ 4 Channels at Gbps Longer Lines up to 1 M long Narrower lines with higher conductor loss

Lossy transmission line Model
Characterisitic impedance Zo = √(R+JwL)/(G+JwC) R and G are not negligible

What is attenuation (loss)?
Where α is the attenuation co-efficient and β is the phase related co-efficient 20 Log Vout / Vin = Loss in dB The Voltage of a signal drops exponentially as the energy is absorbed in the dielectric medium, dissipated as conductor loss and radiated

Dielectric loss αDieletric(in dB) approx =2.3 *f(In Ghz) *df* √Dk

Wider lines are less lossier due to reduced skin effect
Conductor loss Wider lines are less lossier due to reduced skin effect A lower loss product like IS620 allows the designer to use thinner lines. αConductor(in dB/inch) approx =36/(w(line width in mils)*Z0(impedance) )* √ f(In Ghz)

Effect of Conductor Roughness
Surface roughness difference between 1 and 5 Microns = Dielectric loss tangent of –approx % of the dielectric loss

IS620 is the best in class product for dissipation factor

FR406 and IS415 are best in class - Loss close to Getek type products
PCL 370 HR is the highest loss product in this category

Material Challenges Line Lengths and widths dictate the use of materials More & More Standard materials will be used Focus on equalization technologies Key factors will be the ability to predict accurately P.U.L characterisitcs While Dielectric losses dominate at higher speeds Copper losses are not insignificant- Focus on Lower tooth profile

Isola Roadmap High Speed/High Frequency
Enabling High Speed Digital Speeds beyond 10 Gbps Low Dk / Df Solutions with Conventional Process Friendly Technologies Flat Df Response vs. Frequency for Higher Signal Integrity

Selection –High speed products
Key design factors in selecting products for very high speed applications Data rates Higher data rates require the use of Lower DF products Faster Rise times Lower DF Higher Frequency range or bandwidth Stable Dissipation factor over frequency and lower DF Thinner packages Narrower Lines- Lower DK and Lower Dissipation factor Large Backplanes Longer lines- Lower dissipation factors Error correction- Predictable PUL properties Equalization- Pre emphasis Reliability Higher CAF, Thermal Cycling and Lead free assembly compatibility Cost Extendibility and scalability Lower dissipation factor

Overview Lead free assembly
Overview Thermal Analysis Thermal Resistance Thermal Cycling Resistance Isola Lead free product offering Product selection for Lead free assembly

Overview Restriction of Hazardous Substances
Legislation bans the following Six substances for shipment to EU countries – effective July Lead Mercury Hexavalent Chromium( Cr6+) Polybrominated biphenyl Polybrominated diphenyl ether Cadmium High End Networking companies exempt Max Conc. By Wt. < 0.1 % Max Conc. By Wt.< 0.01 %

Liquidus and Reflow Temperatures of Candidate Lead-Free Solder alloys for Replacing Eutectic Tin-Lead Solder Patented compositions; may require licensing or royalty agreements before use. **For more information see: Phase Diagrams & Computational Thermodynamics, Metallurgy Division of Materials Science and Engineering Laboratory, NIST. Source : NIST Website

Criteria for Down-Selection of Alloys
Candidate Alloys for Replacing Lead-Alloy Solders Table 3.1. Criteria for Down-Selection of Alloys Criteria for Down-Selection of Alloys Source : NIST Website

Thermal Resistance Drivers - Lead Free
Legislation driven < 1000 PPM of lead. Lead Free Solders Ternary alloys of Tin/Silver /Copper Average reflow temperature Deg C higher

Lead Free Laminate Attributes
Lead Free ~Reflow Sn/Pb37 Reflow

Thermal Analysis Overview

Overview DSC / TMA / DMA /TGA
Isola ASL equipment Dual cell DSC with autosampler Dual Cell DSC Pressurized DSC/Dual cell DSC with autosampler TMA TGA DMA Test Method DSC IPC-TM Glass Transition and Cure Factor by DSC IPC-TN Glass Transition and Z-axis Thermal Expansion by TMA 3

DSC: Differential Scanning Calorimetry Definitions
DSC measures the temperatures and heat flows associated with transitions in materials as a function of time and temperature in a controlled atmosphere. These measurements provide quantitative and qualitative information about physical and chemical changes that involve endothermic and exothermic processes, or changes in heat capacity. A DSC measures the heat into or out of a sample relative to a reference while heating the sample and reference with a linear temperature ramp. Endothermic: Heat flows into the sample. Exothermic: Heat flows out of the sample. What is happening to the sample? As the sample is heated, it absorbs energy in order to change the temperature of the sample Energy units (W/g) Watts per gram of sample. Principle of Operation 5

Glass Transition A sample goes through the Glass Transition when the amorphous or not crosslinked areas change to (or from) a viscous or rubbery condition to (or from) a hard and relatively brittle condition This is a fully reversible change The glass transition takes place over a temperature range. The glass transition temperature (Tg) is a temperature chosen to represent the temperature range over which the glass transition takes place. NOTE: FIRST AND SECOND RUNS ARE DONE ON THE SAME PIECE OF SAMPLE Delta Tg = Tg(run 2) - Tg(run 1) What does a Delta Tg tell us? Degree of Cure of the Laminate or Printed Wiring Board Printed Wiring Board All parts are cured equally 12

DSC:Interpretation Selection of TG – First derivative
Selection of TG – Half height -Isola Selection of Tg - Inflection 18

TMA – Thermo Mechanical Analysis
TMA measures linear or volumetric changes in the dimensions of a sample as a function of time, temperature, and force in a controlled environment. As the sample is heated, the material expands according to it’s Coefficient of Thermal Expansion (CTE) Upon reaching its decomposition temperature (Td) delamination occurs TMA: Measurements Glass Transition Temperature (Tg) Temperature of Decomposition (Td) Time to Decomposition at 260C (T-260) Time to Decomposition at 288C (T-288) Coefficient of Thermal Expansion (CTE) X, Y & Z Axis Below Tg, Above Tg & Overall ( C) Tg measurement Materials exhibit a dramatic increase in CTE as it goes through the Tg region. Measurement of the onset of the change determines the Tg Temperature at which delamination of the sample occurs Analysis can be obtained from 2nd scan Tg Decomposition temperature Measurement of onset of the dramatic change in probe position determines the Td Similar onset analysis to T-260 T-288 41

TMA : Typical 1 St Run Chart
TMA : Typical 2nd Run chart 49

Typical TMA Decomp Curves
TMA: T-260 & T-288 Sample time at temperature before delamination occurs Typical temperatures are 260C and 288C Sample is heated at 100C/min to the desired temperature and quickly equilibrated Sample is then held isothermally at the desired temperature until delamination occurs T-260(288) = Time(delam) - Time(temp equilib) TMA T-260 T-288 Method variations Other laboratories heat sample at 10C/min Side by side testing of 100C/min v 10C/min shows no measurable difference between the two methods Typical TMA Decomp Curves

TGA Thermogravimetrical Analysis
TGA measures the amount and rate of change in the weight of a material as a function of temperature or time in a controlled atmosphere. Instrument made up of extremely sensitive balance within a controlled atmosphere TGA: What is happening to the sample? As the sample is heated, volatiles escape causing a loss of weight in the sample. Upon decomposition, a dramatic weight change occurs. TGA Measurements Temperature at which x percent of weight is lost Decomposition Temperature (Td) TGA Typical Curve 59

DMA-Dynamic Mechanical Analysis
The periodic application of stress and strain to the material as the temperature is varied. Measurement of the modulii of the material provides important physical information for the material as well as the Tg Storage modulus: Measurement of the materials ability to store energy Loss modulus: Measurement of the materials ability to dissipate energy Tan Delta: Ratio of the storage modulus to the loss modulus What is happening when the sample is being heated? While the sample is being heated, it is physically displaced from parallel by a set force, to a set amplitude at a set frequency The instrument measures the samples resistance to displacement and its ability to return to its original position. These properties change as the temperature of the sample is changed Sample becomes more elastic as it goes through the glass transition range If cross-linking is occurring during the temperature increase, the sample becomes more rigid. Measurements Glass Transition Temperature (Tg) Delta Tg Modulus information Two most common methods for selecting the glass transition temperature Onset of the Storage Modulus Peak of the Tan Delta 66

DMA: Transitions Typical DMA curve Broad Transition Increasing Cure
Multiple Transitions 73

Thermal Resistance and Lead-Free

Drivers Thermal Resistance- Drivers Process conditions Lead Free
OEM reliability requirements. Failure mechanism - Matrix Decomposition and De-lamination

Laminate factors Thermal Resistance - Laminate factors
Td- Decomposition temperature of laminate measured by weight loss by TGA. Function of Resin Chemistry T-260,T Resistance to De-lamination at elevated temperatures. This follows a Power law. Function of Resin Chemistry and board design. Tg - Marginal effect

Thermal Cycling Resistance

Thermal Cycling Resistance-Drivers
OEM reliability requirements due to harsh service conditions Failure mechanism - Mainly metal Fatigue

Thermal Cycling Resistance -Tests
Tests - Simulated tests such as IST – Electrically heating interconnects in cycles of 3 minutes and cooling HATS-Air to Air Liquid to liquid and other cycling tests

Thermal Cycling Resistance-Laminate Factors
CTE Z axis - Lower CTE reduces Stresses on the interconnect Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress. Tg (TMA) - Higher Tg Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors

Thermal Cycling Resistance-Fabrication Factors
Board design factors Ductility of the copper - Higher is better Thickness of the board Hole diameter- Smaller holes and higher aspect ratio reduce cycles to failure. Plating Thickness and quality

Reliability Roadmap - Thermal Cycling - Drivers
Low Cycle fatigue Finite life Infinite life Average thermal cycling conditions may not push copper into plastic range Higher strains during preconditioning IST change the failure mechanism

Thermal Cycling Resistance-Data presentation

Typical Stress Strain Curve
Copper has a modulus = 17.6 E6 Psi and a Yield strength of 30Ksi which means it reaches its Yield point at < 0.2 % elongation or 35 Deg C excursion on a board

Material Properties of Cu Layer and Composite Substrate
Cu Layer – Elastic/Plastic ECu = 15.6x106 psi, sy,Cu = 20,000 psi, CTECu=17x10-6/oC Composite Substrate – Linear Elastic Esubstrate=15 GPa, CTEsubstrate=80x10-6/oC (RT-180oC), CTEsubstrate=320x10-6/oC ( oC) 21oC 260oC Time Temperature 150oC Simulated Thermal Cycles

Stress/Strain (average) in Cu Layer
260oC 21oC 150oC Mises Stress (MPa) Cyclic stress behavior in Cu layer during thermal cycling.

Mises Stress Analysis Cycle 1, 260oC Cycle 1, 21oC Cycle 6, 260oC Cycle 1, 21oC Stress in Cu is highest in the first thermal cycle and stabilizes in subsequent cycles.

What attributes do we need for Thermal cycling resistance?
Laminate factors CTE Z axis - Lower CTE reduces Stresses on the interconnect Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress. Tg (TMA) - Higher Tg Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors IS410 FR408 DE117 IS400 Modeling results show that the Overall Expansion, CTE and Preconditioning are biggest factors governing the IST performance Isola’s Low expansion and High TMA Tg products such as IS620,IS420,IS400 perform better on Thermal cycling

Isola Roadmap Thermal Resistance
Td and T-260/T-288 are key factors determining Thermal Resistance from a Laminate standpoint - Isola’s response - IS410, IS415 and IS620.

What attributes do we need in
a lead free product? Higher Decomposition temperature Higher than 340 Deg C Higher T-260 performance Higher than 60 minutes Higher T-288 performance Lower overall Z axis expansion Less than 3.5 % Low Wt loss at elevated temperature (Lower vols.)

Very High Thermal strains Acceptable service life
Very High performance High Performance Acceptable service life Precondition: 6x - 260C; 0.010” PTH; 0.100” MLB Thickness *Based on Published papers and discussions with fabs and OEM’s

Isola Lead Free Compatible Laminate Product Offering

Isola Thermal Reliability Products
Lead-free solderable Low CTE Low Df IS410 IS400 IS420 IS415 Phenolic epoxy Tg 180C CAF resistant CTE – 3.5 % amb – 288 C Td – 350C T288 > 15 min UL Approved Phenolic cured, filled Tg 150C CAF resistant CTE – 3.00 % amb – 288 C Td – 330C T288 > 5 min UL Approved Phenolic cured, filled Tg 170C CAF resistant CTE– 2.80 % amb -288 C Td – 340C T288 > 15 min UL approved Non-dicy, Non phenolic Tg 190C CAF resistant CTE – 2.90 % amb C Td – 370C T288 > 20 min UL approved Applications : 6 x solder float, lead-free soldering Applications : Severe thermal cycling, lead-free soldering Applications : High data rate; Severe TCT, lead-free solder,

Isola Product Ad

Isola Lead Free Compatible Products

IS400 Product Strengths Features Applications
Better Thermal Reliability With Non-dicy Cured Chemistry Excellent Z-axis Thermal Expansion Excellent Solder Heat Resistance & Low Moisture Absorption Higher Tg 150oC (DSC) Than Standard Epoxies Standard FR-4 Epoxy Processing UV Blocking & AOI Compatible Applications Computers, Servers, Workstations, Telecommunications, Consumer Electronics & Automotives

IS400 Laminate Thermal Properties
Item FR402 IS400 Tg (oC) DSC TMA DMA 140 ± 5 135 ± 5 150 ± 5 145 ± 5 155 ± 5 Z-axis CTE (ppm/oC) Room Temp to Tg Tg to 288 oC Room Temp to 288 oC 70-80 40-50 Solder (sec) > 60 > 180 Decomposition Temp (oC, TGA) Time to Delamination (min, TMA) T288 T260 1-5 10-15 * For 0.71mm (0.028²) Laminate, 38% Weight Resin Content

IS400 Laminate Physical Properties
Thickness :0.028² Property Unit Condition IS400 FR402 Peel Strength (1oz) Flexural Strength Length Cross Volume Resistivity Surface Resistivity Dielectric Constant (500MHz) Dissipation Factor (500MHz) Water Absorption Solder Glass Transition Temp. (DSC) Flammability lb/in psi W .cm W - % sec oC A C-96/35/90 C-24/23/50 D-24/23 UL94 6~8 70000 ~ 80000 60000 ~ 70000 5x1014~ 5x1015 1x1013~ 1x1014 4.3 0.015~0.018 0.12~0.18 > 180 150 V-0 9~11 70000 ~ 80000 60000 ~ 70000 5x1014~ 5x1015 1x1013~ 1x1014 4.3 0.015~0.018 0.15~0.20 > 60 135~145 V-0

IS400 Thermal Reliability Testing
Test condition TCT (-40oC to +125oC) 15 min/10 sec/15 min’ for 200 cycles, then microsection and E-testing. Sample 8L MLB Result Pass Current State No delam, copper crack, resin recession been found.

Thermal Performance T260/ Decomp./IST
Electrical Performance Loss /DK FR406 High Tg 170° Epoxy IS410 180° Tg FR Tg Low Dk & Df IS620 Tg 215 Low Loss Ghz Laminate IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling 1 -1.5Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300** T Mins/Td.350** High Speed /High Frequency Gbps* T Mins/Td.400** **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS415 190Tg IS500 Halogen Free 180 Tg

IS410 Product Strengths High Tg FR4 (180°C TMA)
Enhanced thermal stability High Decomposition Temperature (350°C) Superior PTH reliability due to very low z-axis CTE Unique resin chemistry contributes to CAF Resistance Lead-Free Compatible PCB substrate (6x peak 260°C reflow) Un-filled resin matrix enhances Hi-pot resistance on thin cores Enhanced drilling performance on high aspect ratio holes Low Cost of ownership Wide market acceptance and North American and Asia Pacific manufacturing

IS410 Product Positioning
As a substitute for Std. FR4 requiring lead-free performance As an improvement over FR4 materials by achieving CAF resistance An alternative to filled phenolic resin systems that are more susceptible to insulation resistance failures

Property Units FR406 IS410 G200 FR408 IS620 Tg, (DSC) ºC 170 180 185 215 Td, (TGA) 290 350 320 360 352 CTE x-axis (amb - Tg) ppm/ºC 14 11 15 13 y-axis (amb - Tg) 12 z-axis (amb - 288C) % 4.4 % 3.5 % 3.5% 2.8 % Solder Float, 288C sec >220 >500 >1200 > 800 T-260, (TMA) min 10 >60 20 T-288, (TMA) <1 >15 8 Material Tested: 0.008”, 44% Resin %

> 6.3 7 8 lb/in Peels, 1 oz. 1400 1175 1100 volt/mil Electrical Strength 94 V-0 - Flammability .15* 0.14* 0.20* % Moisture Absorption Units GPY FR-4 UL Recognition .008 .011 .012 .021 .018 DF, 2 GHz N/A .013 .023 DF, 1 MHz 3.6 3.7 3.9 DK, 2 GHz 4.0 4.6 DK, 1MHz IS620 FR408 G200 IS410 FR406 Property Material Tested: 50% Resin Content *Material Tested: 0.008”, 44% Resin %

Immersion Silver Finish; 100 V Bias; 25 Coupons
IS410 CAF Test Results IS410 vs. High Tg FR4 Immersion Silver Finish; 100 V Bias; 25 Coupons Failure % B1 = 11 mil diagonal spacing B2 = 15 mil diagonal spacing B3 = 20 mil diagonal spacing B4 = 25 mil diagonal spacing Spacing - PTH to PTH

Mean Time to Failure (MTTF) = 325 cycles
IS410 IST (9.8 mil PTH) Mean Time to Failure (MTTF) = 325 cycles

IS410 Dk Matrix

IS410 Df Matrix

IS410 Processing Cross Reference
FR406 IS410 IS415 Scaling See Scaling Table in Process Guide Same as FR406 Similar to FR408 Oxide Multiple options available Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Cure = 375F (90 min) Drilling See Drilling Table in Process Guide Same as FR406, longer drill life Same as FR406 longer drill life Desmear Chemical Desmear (single pass) Similar to FR408 (double pass cyclic amine)

Next Generation in Thermally Reliable
IS415 Next Generation in Thermally Reliable Laminate and Prepreg

IS415 Product Strengths Superior PTH reliability due to very low z-axis CTE Very high Tg (200°C by TMA) compared to FR4 (160ºC by TMA) Non-phenolic based resin system Very high decomposition temperature (375°C) suitable for Pb-free assembly Dielectric constant comparable to Std High Tg FR4 Dissipation factor comparable to Std High Tg FR4 (20% lower than phenolic resin systems) Low cost of ownership relative to modified epoxy systems with Mid-Dk, mid-Df performance

The only low cost, non-phenolic, lead free substrate in the market As a substitute for Std. FR4 requiring lead-free performance without sacrificing electrical performance An improvement over phenolic-based FR4 materials by providing lower loss comparable to Std FR4 materials An alternative to filled phenolic resin systems that are more susceptible to insulation resistance failures

Property Units FR406 IS410 IS415 P95 Tg, (DSC) ºC 170 180 190 260* Td, (TGA) 290 350 375 416 CTE α 1, z-axis (amb - Tg) ppm/ºC 65 50 55 Solder Float, 288C sec >220 >500 >1000 >1200 T-260, (TMA) min 10 >60 T-288, (TMA) <1 >10 >20 Dk (2 GHz) 3.9 3.8 4.2 Df (2 GHz) .018 .023 .017 .014 Isola Material Tested: 0.008”, 44% Resin Content

IS415 Tg by TMA 196C (Better Thermal Performance)

IS415 Dk Matrix

IS415 Df Matrix

IS415 Attenuation Comparison
FR406 and IS415 are best in class - Loss close to Getek type products PCL 370 HR is the highest loss product in this category

FR406 IS410 IS415 Scaling See Scaling Table in Process Guide Same as FR406 Similar to FR408 Oxide Multiple options available Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Cure = 375F (90 min) Drilling See Drilling Table in Process Guide Same as FR406, longer drill life Same as FR406 longer drill life Desmear Chemical Desmear (single pass) Similar to FR408 (double pass cyclic amine)

IS500 Product Strengths High Tg (180°C) Halogen-Free PCB substrate
Superior Dk across frequency ( ) closely matching High Tg FR4 Loss Tangent comparable to High Tg FR4 ( ) Very Low z-axis CTE (2.3%), as compared to Std FR4 (4%) Superior Thermal Reliability, capable of meeting lead-free requirements (T260 and T288 >60 minutes) Low moisture absorption (0.2%) Very high copper peel strength 8 lb/in. (1.4KN/m) after thermal stress Global product availability (N. America, Europe, Asia) by early 2005

Competitive Products: Hitachi E-67G(H), Hitachi E-679FG, Polyclad PCL-HF-571F, Nelco D1049 (beta) Superior Dk relative to all currently available Halogen-Free substrates (3.8 vs ) Globally manufactured High Tg, Halogen Free PCB Substrate Low z-axis CTE, ideal for IST critical applications 40% higher peel strengths than competitive materials Significant Cost Advantage

IS500 Thermal Characteristics
TG DSC - 180°C TMA - 170°C DMA - 210°C CTE (z-axis, RT °C): < TG : ppm/°C > TG : 180 ppm/°C T260 (TMA): > 60 min T288 (TMA): > 60 min TD (TGA): °C Thermal stress tests: Solder dip @ 288°C > 5 minutes: passed 10x °C: passed High Pressure Cooker Test: passed (30 min + solder dip °C)

IS500 Physical Characteristics
Flammability: V-0 Moisture uptake: (D24/23) % 10 GHz: 4.0 10 GHz: Alkali Resistance: passed (D24/125, 20 70°C 20 in 10 % NaOH) CTI (Comparative Tracking Index) 300 Color Dark Yellow Peel Strength > 7.0 lb/in. (1.4KN/m)

IS500 – Dk matrix

IS500 - Df matrix

FR406 and IS415 are best in class - Loss close to Getek type products PCL 370 HR is the highest loss product in this category

FR406 IS410 IS500 Scaling See Scaling Table in Process Guide Same as FR406 Currently using FR406 scaling factors (additional characterization req’d) Oxide Multiple options available Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Cure = 390F (90 min) Pressure = 300 psi Drilling See Drilling Table in Process Guide Same as FR406, longer drill life See Drilling table in following slides Desmear Chemical Desmear (single pass) Similar to FR408 (double pass cyclic amine)

FR408 Positioning and Value Proposition
FR408 is a high performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications. As an improvement over Std. FR4, FR408 offers improved electrical properties as well as Pb-Free compatibility. As an alternative to PPO resin systems, FR408 offers lower signal loss improving electrical performance. As an alternative to PPO resin systems, FR408 offers a 33% lower CTE improving PTH reliability As an alternative to modified epoxy systems with Cyanate Ester, FR408 offers better fracture toughness making it the product of choice for high density designs and CAF resistance Value Proposition High thermal performance Tg of 180°C by DSC Very high decomposition temperature, Td of 360°C by TGA suitable for Pb-Free assembly Improved Dielectric Properties (Dk 3.3 – 3.8; Df ) Superior Processing, closest to conventional FR-4 as compared to all high speed materials

FR408 Laminate Thermal Properties
Property Units FR406 IS410 G200 FR408 IS620 Tg, (DSC) ºC 170 180 185 215 Td, (TGA) 290 350 320 360 353 CTE x-axis (amb - Tg) ppm/ºC 14 11 15 13 y-axis (amb - Tg) z-axis (amb - 288C) 140 120 Solder Float, 288C sec >220 >500 >1200 > 800 T-260, (TMA) min 10 >60 20 T-288, (TMA) <1 >10 8 >15 Material Tested: 0.008”, 44% Resin %

FR408 Laminate Physical Properties
> 6.3 7 8 lb/in Peels, 1 oz. 1400 1175 1100 volt/mil Electrical Strength 94 V-0 - Flammability .15* 0.14* 0.20* % Moisture Absorption Units GPY FR-4 UL Recognition .008 .012 .017 .019 DF, 10 GHz DF, 5 GHz .011 .018 DF, 2 GHz N/A .013 .023 DF, 1 MHz 3.55 3.7 3.8 DK, 10 GHz 3.9 DK, 5 GHz 3.6 DK, 2 GHz 4.0 4.6 DK, 1MHz IS620 FR408 G200 FR406 Property Material Tested: 50% Resin Content *Material Tested: 0.008”, 44% Resin Content

FR408 Dk matrix

FR408 Df matrix

IS620 Ad

IS620 Product Strengths Superior Electrical Performance - The Loss With IS620 is Lower at Higher Frequencies and Stays Stable, the Response With APPE is Not Stable and it Increases With Frequency IS620 is a Thermoset Resin, Unlike APPE Resins Which Are Thermoplastic Blends. The APPE Resin Conforms While IS620 Flows IS620 Does Not Use Special Glass and is Therefore Available in Standard Sizes and is Not Subject to the Supply Issues The Cost of Ownership vs. Performance is Very Favorable With IS620 Superior PTH reliability due to very low z-axis CTE The Only Lead-Free Compatible Product in its Class

Appropriate for High Speed Digital applications up to 5 Gbps As a performance upgrade replacement for Nelco N Product due to its ease of processing and superior thermal and electrical attributes at a slightly lower cost of ownership As a substitute for Nelco N SI Products due to its ease of processing, availability and lower cost of ownership As a replacement for APPE resin systems due to its much lower cost of ownership and availability As a replacement for Rogers 4350 in the lower to mid end designs due to its stable electrical performance at a substantially reduced cost As a substitute for G-200/BT applications due to its better thermal and electrical performance at similar cost As the lead-free low loss product

Property Units FR406 G200 IS415 IS500 IS620 IS640 Tg, (DSC) ºC 170 185 190 215 220 Td, (TGA) 290 320 370 400 353 350 CTE x-axis (amb - Tg) ppm/ºC 14 15 13 11 y-axis (amb - Tg) 10 z-axis (amb - 288C) % 4.4% 3.5% 2.9% 2.8% 3.6% Solder Float, 288C sec >220 >1200 TBD >800 T-260, (TMA) min 20 >60 T-288, (TMA) <1 8 >20 >15 >10 Material Tested: 0.008”, 44% Resin %

Property Units FR406 G200 IS415 IS500 IS620 IS640 Dk, 2 GHz 3.9 3.7 3.8 3.6 Dk, 10 GHz - 3.55 Df, 2 GHz .018 .012 .016 .008 <.0045 Df, 10 GHz .019 .017 Electrical Strength V/mil 1100 1175 >1000 1000 1400 TBD Peels, 1oz lbs./in. 8 7 >6.3 >5.5 Flammability 94V-0 Moisture Absorption % 0.20 0.14 0.26 0.12 0.15 0.40* UL Recognition FR-4 GPY Non ANSI *Material Tested: 0.030”(5-2116), 52% Resin %

IS620 Dk Matrix

IS640 Df matrix

IS620 vs. Modified Epoxy Special Glass
12 Inch Trace 8 Inch Trace

IS620 Attenuation 16” Transmission Line
Data courtesy Northrup Grumman

IS620 is the best in class product for dissipation factor

IS620 TDR Measurements - Siemens
Figure a shows a TDR measurement of the impedance profile of a 1m conductor in layer HF 1. For comparison purposes TDR results of conductors in a board made from IS 620 and R04350 are confronted. The difference of the impedance course can be basically attributed to 2 reasons: 1. Inevitable different geometrical dimensions (line width, height of chamber etc.) of the two boards 2. Different dielectric figures for both materials Due to different dielectric figures of different types of material there are varying delays of electrical signals. Also these delays can be taken from TDR measurements. The difference in time of the scarped flanks at the end of the effective range marks the double difference in delay (feed and return run of signal) of electrical signals. a) Time Domain Reflectometry

IS620 S21 Measurements - Siemens
TDR measurements allow a very precise determination of running time differences and thereof the differences of dielectric figures. However, in order to identify damping characteristics, gauging in the frequency range are more suitable. In order to do so scattering parameters S21 (transmisson damping) of both materials are compared. Figure b shows that there are no differences in damping features of both materials in a range of up to 15GHz. As a result of this it can be said that both materials hold nearly the same dissipation factors tan d. b) Frequency Domain

Lead Free Assembly Testing
IS620 Lead Free Assembly Testing

IS620 Pb-Free Simulation – NEMI Parameters

IS620 Lead-Free Assembly – European Customer A

IS620 Lead-Free Assembly – European Customer B

Plated-Thru Holes after 8x Reflow Process

IS620 Thermal Analysis (before and after 8x Reflow Simulation)
Before Reflow Simulation After Reflow Simulation CTE before Tg ppm/C C CTE after Tg ppm/C C CTE after Tg ppm/C C Overall CTE ppm/C C TGA 350C C DSC Tg Cleave A C Delta 1C DSC Tg Cleave B C Delta 1C Peak Tan Delta 171C and 269C T-260 by TMA 60 minutes minutes+ T-288 by TMA 2.8, 2.9, 3.0, 3.7 minutes Weight Loss % 0.4% to 260C % to 260C Samples of the finished test cards were sent to Isola for thermal analysis prior to reflow simulation. The results shown support the claim that the IS620 would perform as expected in the reflow simulation. Additional, samples were submitted to the Isola R&D lab after 8 reflow passes.

IS620 Lead-Free Assembly Summary
Feedback from the Market IS620 Passes Lead-Free Assembly Testing 7x at Merix IS620 Passes Lead-Free Assembly Testing 6x at PPC Positive Results at all customers to date Finished Board thermal analysis demonstrates T260 greater than 60 minutes Finished Board decomposition temperature greater than 350 C Joint Press-Release with Merix on Lead-Free Compatibility IS620 Lead Free is getting great traction in the market and we are already seeing a strong Ramp up. It is now the only Lead Free product in its Class

Isola Processing Cross Reference
FR408 IS620 IS640 Scaling 30% greater in Grain Similar to FR408 in Fill Currently evaluating* (using IS620 factors) Oxide Same as FR406/8 Lamination ROR = F/min Cure = 375F (90 min) Pressure = psi 40 min soak – 200F ROR = 4 F/min Cure = 390F (120 min) Pressure = psi ROR = F/min Cure = 390F (150 min) Pressure = psi Drilling Similar to N or N SI Similar to R4350 F&S Drill life substantially better than R4350 Desmear Double Pass Desmear Plasma Desmear Similar to FR408 (prefer Plasma Desmear) Similar to FR406

IS640 Next Generation Low Loss

IS640 Ad

IS640 Product Strengths Superior Signal Integrity - flat Df from 2 to 15 GHz Stable Dielectric Constant from 2 to 15 GHz Customized Dk for different applications (ie.3.0, 3.20, 3.25, 3.38, 3.45) Utilizes Standard E-Glass Standard Thicknesses Available Tack-free prepreg for ease in handling Superior Drilling performance Conventional FR-4 processing Compatible with Isola IS410, FR406 & FR408 Lower Cost of Ownership

Applicable for RF Microwave/High-Speed Digital Market (5+ Gbps) Capable of meeting lead-free requirements IS640 prepreg is non-tacky, unlike Rogers 4350 Significant Cost Advantage Rogers 4350 has 60% ceramic filler in the resin, more difficult drilling

IS640 Material Properties
Electrical Properties Values Dk @ 2 GHz 5 GHz 10 GHz 2 GHz Df @ 5 GHz Df @ 10 GHz Mechanical Properties Values Peel Strength - after thermal stress 4 lbs/in (1/2 oz)RT Flammability V-0 T > 60 minutes Tg - DSC Degrees C *All tests run on 0.030” 2116 with 52 % retained resin % Electrical properties tested by Bereskin Stripline Method

IS640 Stripline Dk Comparison
55 % RESIN

IS640 Stripline Df Comparison
55 % RESIN

IS640 Dk matrix – High Speed Digtal
Electrical test data by Bereskin Stripline Method at ambient temp. Tg tested by DSC Td tested by onset

IS640 Df matrix – High Speed Digital
Electrical Data tested by Bereskin Stripline Method at ambient temp. Tg – tested by DSC Td – tested by onset

IS640 RF/ Microwave – 3.45 and 3.38 Dk
Tested per IPC TM

IS640 Rf/ Microwave Df matrix– 3.45 and 3.38 Dk
Tested per IPC TM

IS640 RF/ Microwave – 3.25 & 3.20 Dk Tested per IPC TM

IS640 RF/ Microwave Df matrix – 3.25 & 3.20 Dk
Tested per IPC TM

IS640 RF/ Microwave Dk Tested per IPC TM

Isola Processing Cross Reference
FR408 IS620 IS640 Scaling 30% greater in Grain Similar to FR408 in Fill Currently evaluating* (using IS620 factors) Oxide Same as FR406/8 Lamination ROR = F/min Cure = 375F (90 min) Pressure = psi 40 min soak – 200F ROR = 4 F/min Cure = 390F (120 min) Pressure = psi ROR = F/min Cure = 390F (150 min) Pressure = psi Drilling Similar to N or N SI Similar to R4350 F&S Drill life substantially better than R4350 Desmear Double Pass Desmear Plasma Desmear Similar to FR408 (prefer Plasma Desmear) Similar to FR406

PWB Reliability Test Methods
Interconnect Stress Testing (IST)

Interconnect Stress Testing (IST)
IST is an accelerated stress test method Creates uniform strain from within substrate DC current is used to heat the PTH barrels and forced convection cooling to cycle PTH Technique identifies and assesses the severity of post separation and barrel cracks

Test Method Comparison

Failure defined as resistance degradation
IST Data Analysis Failure defined as resistance degradation

IST Weibull Analysis Benefits of Weibull Analysis method
Accounts for infant mortality Requires few data points to fit data Attributes of Weibull Distribution Good Fit of data: Shape parameter (slope) > 3 Number of cycles at 1% failure > 75 cycles MTTF (Mean Time to Failure) is a meaningful summary of data

Hi-Pot Testing

Hi-Potential Testing (Hi-Pot)
Hi-Pot testing is analogous to high voltage testing Determine the state of the material’s electrical insulation Synonymous terms: Voltage withstanding test Dielectric strength testing Insulation breakdown testing Technique to test the insulation resistance of materials ZBC used in buried distributive capacitance applications Reference: Buried Capacitance and thin laminates

Conductive Anodic Filament (CAF) Failure

Conductive Anodic Filament (CAF)
CAF formation was first reported in 1976, but field failures were identified later in the 1980s Electrochemical failure Growth of copper containing filament along epoxy-glass interface Bell Laboratories investigated mechanism of CAF formation Physical degradation of glass/epoxy bond Moisture absorption occurs under high humidity conditions An electrochemical pathway develops and electrochemical corrosion occurs Water acts as electrolyte, the copper circuitry becomes the anode and cathode, and the operating voltages acts as the driving potential

CAF Pathways

CAF Test Vehicle Sun Microsystems Test Board 10 Layer Board, .050”
Single Ply 2116 Construction All Layers, B and C-Stage A1 - A4 = Hole to Hole In Line with Glass B1 - B4 = Hole to Hole Diagonal to Glass C1 - C4 = Hole to Plane Clearance (antipad) D1 & D2 = Plane to Plane

Registration

Registration Summary Registration error composed of several different sources Types: Offset error, Compensation error, angle error, random noise Offset error Related to tooling processes Punch, pinning, and drilling Compensation error Related to scaling artwork Material movement or artwork movement Angle error Related to a rotational misalignment Post-etch punch machines that are miscalibrated Random noise

References Ready, W. Jud, Turbini, Laura J., “Conductive Anodic Filament Failure: A Material Perspective” Biunno, Nicholas, Schroeder, Greg, “Buried Capacitance and Thin Laminates”. PCB reliability testing with Interconnect Stress Test. McQuarrie, Wm. Gray, “Control of Key Registration Variables for Improved Process Yields on Dense MLBs”.

Isola Technology Isola Product Technology Roadmap
Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities

Laboratory Capabilities
Isola Laboratory Capabilities

Isola Analytical lab Capabilities
IPC-4101A Qualification and Conformance Testing Thermal Analysis Differential Scanning Calorimetry (DSC) Tg, delta Tg Thermomechanical Analysis (TMA) X, Y, Z- CTE, Tg, T-260, T-288 Dynamic Mechanical Analysis (DMA) Tg, Modulus 4 Camera CTE (X and Y) Rheometer Gel Window, Minimum Viscosity Microscopy Scanning Electron Microscopy (SEM) Energy Dispersive Spectroscopy (EDS) Optical Microscopy (Microsectioning including thermal stress) Fourier-Transform Infrared Spectroscopy (FTIR) Coulometric Titration (Moisture Content)

Isola Analytical Lab Capabilities
Electrical Testing Dielectric Constant/ Dissipation Factor 1 MHz (Two Fluid) 100 MHz to 1.5 GHz (HP 4291A) 1 GHz to 20 GHz (Bereskin Method) Network Analyzer and full signal integrity bench Electric Strength Hi-Pot Arc Resistance Insulation Resistance Conductive Anodic Filament (CAF) Physical Testing Dimensional Stability 4 Camera System Peel Strength UL Flammability Oxygen Index Flexural Strength Compressive Strength Bond Strength Shear Strength Warp and Twist Surface Profilometry

Agilent PNA/PLTS Signal Integrity Bench

Signal Integrity with Eye Diagrams

Mechanical Analysis

Scanning Electron Microscopy (SEM)

Isola Competitive Advantage – Product Technology
Development Methodology Modeling Large IP Portfolio and Large Data base of Research Strong Development and Process Technology group Neat Resin characterization and modeling Infrastructure Pilot manufacturing facilities Best in class Analytical Labs Global footprint with Regional Centers of excellence Investment in new Technology Focus on cost effective technologies Isola’s new Technologies based on unique formulas using components vs. prepackaged value priced Technologies from Vendors Leading Technology Player

Technology and Product Update

Similar presentations

Presentation on theme: "Technology and Product Update"— Presentation transcript:

Similar presentations

About project

Feedback

Log in

Auth with social network:

Technology and Product Update

Similar presentations

Presentation on theme: "Technology and Product Update"— Presentation transcript:

Similar presentations

About project

Feedback