1. Process Flow For Electronic Component Prep
Electronic components are prepared for assembly by both manual (40%) and automatic processes (60%).
Manually remove components from supplier packages.
Clip components to the proper length manually or with the automated component prep system.
Form component leads manually or with the machine form system.
Tin the component leads manually or with the wave solder machine.
Perform leak detection test on hermetically sealed MIL-STD components (20% of products). (Must be done in an enclosed space.)
Place components in packages for shipment to customers.

2. Electronic Component Preparation Facilities Layout
Legend
Wave Solder
Machine Area
Automated Component
Prep System
Storage Cabinet
Leak
Test
Machine Form
Area
Storage Rack
Unload
Load
Cleaning Tank N
Manual Component Form Area
Machine
Manual Form / Solder Tin Area
Work Station /
Desk
Supervisor
Office
Production
Support Office
Table
Person