1. Trends in Electronics Reliability Testingby
Dr. John W. Sofia
Analysis Tech
Phone: (781)
Fax: (781)
Website:
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2. First Integrated Circuit
The Starting Point
First Transistor
Bell Labs, 1947
First Integrated Circuit
Texas Instruments, 1958
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3. Yesterday And Today 1970 Today Intel 4004-2.3x103 transistors
Intel Pentium II-7.5x106 transistors
Today
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4. Heat Fluxes For Various Events
Chu, Simons, et.al 1999
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5. observed by Gordon Moore in 1965.
Moore’s Law
Performance doubles with every new chip generation (approximately every months)
observed by Gordon Moore in 1965.
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6. Driving Factors
Simons, 1999
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7. CPU Power Trend
Aghazadeh, M., 1994
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8. Relative Cooling Capability of Various Modes of Convective Heat Transfer and Coolants
Kraus and Bar-Cohen, 1983
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9. Power Dissipation of CMOS Devices Vs. Clock Speed
Montesano & Cassia, 1995
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10. Explosion in heat flux
Simons, 1996
Explosion in Heat Flux

11. CPU Heat Dissipation Over Time
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12. Processor Performance Vs. Temperature
Kryotech, Inc., 1999
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13. National Technology Roadmap For Semiconductors
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14. Industry Trends
CMOS will continue to be the pervasive semiconductor technology for both memory and logic.
Chip sizes will increase, but circuit density will increase even more resulting in higher heat flux
Cost will become an increasingly significant challenge for future high-end cooling designs.
There will be increase emphasis on reducing design time.
The majority of new computer systems will most likely be air-cooled for the next few years.
The application of low temperature cooling as a means to achieve improved system performance may be expected to increase over the next few years.
Simons, 1999
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15. Major Causes of Electronic Failures
Source: U.S. Air Force Avionics Integrity Program
Reynell, M. 1990
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16. Trends in Electronic Cooling
Increasing module and device heat fluxes
Declining thermal design-margins
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17. Trends in Electronic Interconnects
Larger numbers of interconnects / signals
Smaller (less robust) mechanical size interconnects
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18. Trends in System Costs Decreasing cost-performance ratio
Increasing cost of system failure to end user
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19. Trends in Test Needs
Increasing challenges to avoid thermal & interconnect failure
Increasing needs (& budgets) for reliability testing
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20. Analysis Tech Thermal and Interconnect Reliability Test Systems
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21. Analysis Tech Test & Measurement Systems for Electronic Packaging Reliability
Thermal Analyzers:
Measurement of all device thermal-characteristics
Electrical method of junction temperature measurement
Complete test lab equipment
Complete component test services
Event Detectors:
Electrical monitoring of interconnect reliability
For thermal-cycle, vibration, and shock testing
Ideal for long-term unattended test
Solder joints, connectors, and all advanced interconnects
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