1. Module Production Status in Florence
Shipping & Receiving: Gabriella Gheri
Bonding: Mirko Brianzi, Enrico Scarlini
DB: Simone Paoletti
Tests: Riccardo Ranieri, Cristiano Marchettini, Andrea Bocci, Florentina Manolescu, Carlo Civinini, Marco Meschini
xFLAG: Cristiano Marchettini, Riccardo Ranieiri
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

2. Statistics (up to April 19th)
received> (31 L12p)
bonded> (22 L12p)
ARCtested> (22 L12p)
ARC Ok> (22 L12p)
LTtested> (19 L12p)
LT Ok> (19 L12p)
Modules produced following the TIB procedures
specified in:
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

3. Status of Bonding Since March bonded 22 new modules (6 chips).
For this L12p modules the loop height is very important, so it took a lot of time to set all the loop parameters and solve some problem.
Now a new program for Delvotec is ready and it automatically bonds all the front side of the module, making all the loop shapes more reproducible.
The failure rate for these modules lowered from 3 fails/module (repaired) in the beginning down to zero on the last bonded modules.
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

4. Readout bonds Loop heights Specifications: min. 200µm max. 350µm 340
240
Specifications:
min. 200µm
max. 350µm
These are pictures of the loops’ profile...
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

5. Filter Capacitor and Bias bonds
370
420
525
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

6. Pull Test DAGE 3000 pull test machine
Results of Pull Test on Readout bonds
for 5 modules
Mean force = 11.1g
Max Standard deviations = 0.99g
Minimum value = 9.0g
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

7. Rejected Modules Two bad Modules detected by ARC:
Voltage breakdown at ~200V
contiguous noisy strips
One bad (suspicious) Module detected by LT:
Some strange behaviour (affecting Peak Time only) at room temperature then a failure at -15oC followed by intermittent failures with ARC and LT
3/78  rejection rate of 3.8%
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

8. ARC Discarded Modules (i)
IV breakdown (after bonding) at 200V
No evident anomalies after optical inspection ( )
IV from sensor DB OK (Imax~200nA)
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

9. Module
Noisy strips
148…167
148…167
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

10. Pinholes
One new pinhole (not present in the sensor DB) has been generated after some bonding problems on strip #1  promptly identified by both ARC and LT
Another new pinhole has been identified by ARC but it is not apparently related to any bonding problems  not identified by HPK?
Both strips have been disconnected
At present time no new pinhole has developed during the LT runs.
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

11. IV - ARC Test Taken with ARC-DEPP Extracted from xml-xFLAG
Current [nA]
Volt
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

12. Defect Statistics
The defect analysis has been carried out using the Tony-Riccardo’s macros and xFLAG generated xml files
58 ARC tested modules and 54 LT tested modules have been analyzed and inserted in DB
The bad strips distributions are peaked at zero and are dominated by the marginally noisy strips (aka statistical fluctuations noisy strip in only one - out of four - mode)
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

13. Defect Statistics (from DB) out of 31000 strips
ARC LT
#mod in DB 58 54
# bad strips 79 27
# noisy strips 64 8
# shorted strips 1
# opens
13*
15*
# pinholes
# ???? 2
* Mainly unbonded pinholes
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

14. Extracted from xml-xFLAG
23 contiguous
Bad strips
Unstable module
After LT
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

15. Extracted from xml-xFLAG
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

16. Module grading by xFLAG
ARC
54/58 grade A
2/58 grade B
2/58 grade C  rejected LT
52/54 grade A
1/54 grade B
1/54 grade C  rejected
The .xml files have been uploaded into production DB
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze

17. Conclusions
In Florence we produced 78 TIB modules (56 L34p and 22 L12p)
The bonding procedures have been optimized for L34p and L12p modules: no major problems
The ARC test follows immediately the module bonding, LT within one week
A total of 3 modules have been rejected
The bad strips are at the permille level
112 .xml files have been inserted into DB
ModProd Meeting TK-week
April 22nd 2004
Carlo Civinini
INFN-Firenze