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Head Electronics BV 31-3-2017.

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Presentation on theme: "Head Electronics BV 31-3-2017."— Presentation transcript:

1 Head Electronics BV

2 Product Offerings • Supplier Overview • Product Offerings Electronics development Hardware Embedded software Pre-compliant EMC Electronics assembly SMD Conventional Combination PCB-Intermediair Work preparation PCB Specification PCB Mechatronics Housings Wiring Coating

3 One Stop Shop From idea to product.
• Supplier Overview • Product Offerings From idea to product. Product-redesign and – engineering. Purchasing of components. PCB work preparation and purchasing. SMT and THT (trough hole) assembly. Prototyping, pre-production, series production. Housing and cabling assembly. In-house testing of product and CE-EMC. Deliveries on call (JIT) and as series. Logistics, warehouse, outsourcing. Service, upgrades and customer repairs.

4 Locations, Geografic HEAD Electronics BV
• Supplier Overview • Locations, Geografic HEAD Electronics BV Ambachtsweg AH Katwijk zh Tel: +31 (0) Fax: +31 (0) Website:

5 Markets served Industrial electronics Machinery factories
• Supplier Overview • Markets Served - Products & Geographic Industrial electronics Machinery factories Explosion Safety applications Measuring- & control equipment Led-solutions Power electronics Transportation Consumer electronics

6 Customer Service Capabilities
• Supplier Overview • Customer Service Capabilities • Menu Choose your own menu… Project definition. Electronics design & development. Project management / engineering support. Electronics assembly. Mechatronics, wiring, coating etc. Testing, test engineering. Logistics. After sales. Prototyping.

7 Customer Service Capabilities
• Supplier Overview • Customer Service Capabilities • Menu explained Project definition (product, specification, planning etc). Electronics design & development (by customer and / or HEAD). Project management / engineering support (work preparation PCB & BOM, documenting, overall view, etc.) PCB assembly (SMD, THT, manual soldering, etc.). Mechatronics (total assemblies, wiring, coating etc.). Testengineering (AOI, EMC, X-ray etc.). Purchase & Logistics (forecast, purchasing, storage, consignment, etc.). After sales (upgrades, changes, customer repairs, etc.). Prototyping & pre-production (hand + machine & hand).

8 Project Definition • Manufacturing • Capabilities • Menu • Project Definition Defining a project (enquiry, requirements, specs, etc.). Calculation (BOM, labour, machine costs, etc.). Specification (PCB, BOM, etc.). Planning (lead times). Purchase preparation (BOM + planning in MRP). Terms & conditions (general, planning, warranty, payments, etc.).  QUOTATION + ORDER + ORDER CONFORMATION.

9 Project Definition - RFQ
• Manufacturing • Capabilities • Menu • Project Definition • RFQ

10 Electronics Development
• Manufacturing • Capabilities • Menu • Design & Development From idea to functioning product (Balancing development vs. product costs) Specification. Hardware. Embedded software. Availability of components. Cost price components. Production friendly. Programming & testing. CE, EMC pre-compliant. Working prototype. TPD - Technical Product Documentation.

11 Project Management Customer partnership Operations management.
• Manufacturing • Capabilities • Menu • Project Management Customer partnership Operations management. Project management. Quality management. Work preparation PCB/BOM/IT. Documentation in AEGIS. Logistics, purchase, storage. Outsourcing. Planning, controlling. Cost control, invoicing.

12 Work Preparation PCB Panelizing and specification before purchasing:
• Manufacturing • Capabilities • Menu • Project Management • Work Preparation PCB Panelizing and specification before purchasing: PCB data. Multilayer PCB. Panelizing with CAM350. Design/edit with Pulsonics (tool). Own internet tool for PCB specification. Enquire PCB-quotations. Prepare purchase of PCB’s.

13 Work Preparation BOM • Manufacturing • Capabilities • Menu • Project Management • Work Preparation BOM

14 Work Preparation Machines
• Manufacturing • Capabilities • Menu • Project Management • Work Preparation Machines

15 Work Preparation Documentation
• Manufacturing • Capabilities • Menu • Project Management • Work Preparation Documentation (MOS) Documentation in AEGIS MOS = Manufacturing Operations Software

16 Floor Documentation Shop Floor paperless by AEGIS
• Manufacturing • Capabilities • Menu • Project Management • Work Preparation • Floor Documentation Shop Floor paperless by AEGIS

17 Electronics Assembly Surface Mounted Devices
• Manufacturing • Capabilities • Menu • Electronics Assembly • SMD Fast, flexible and accurate Samsung CP series SMD. Placing SMD-components to 0402 Finepitch QFP 0,4 mm Finepitch (µ)BGA Prepared for intelligent feeders Up to 60k components / hour Soltec My Reflow 10 zone Reflow Oven. DEK Horizon 2 screenprinter.

18 Electronics Assembly Surface Mounted Devices
• Manufacturing • Capabilities • Menu • Electronics Assembly • SMD Close up

19 Electronics Assembly Surface Mounted Devices
• Manufacturing • Capabilities • Menu • Electronics Assembly • SMD Barcode

20 Electronics Assembly Surface Mounted Devices
• Manufacturing • Capabilities • Menu • Electronics Assembly • SMD network DATABASE SERVER ETHERNET (TCP/IP) PART-STATION FEEDER-STATION MACHINE C pF C PF DeviceNet SM FEEDER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER Feeder ID Reading Feeder Event (insert, remove, …) DOCKING-CART

21 Electronics Assembly Conventional Components
• Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional Component preparation as cut, bend etc. Placing of all remaining components. Soldering of the leaded components. Final assembly, built in housings. Programming and loading of software. Routine testing. Labeling, PCB serial number/barcode. Packing.

22 Electronics Assembly Conventional Components
• Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Close up

23 Electronics Assembly Wave Soldering
• Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Wave Soldering Wave soldering N2 with the Soltec “Deltawave” (leaded). In-line wave soldering N2 met EPM IBL (RoHS).

24 Electronics Assembly Selective Soldering
• Manufacturing • Capabilities • Menu • Electronics Assembly • Conventional • Selective Soldering Selective soldering N2 with the Soltec My Selective 6745 (RoHS).

25 Electronics Assembly Mechatronics / Total Assembly
• Manufacturing • Capabilities • Menu • Electronics Assembly • Mechatronics PCB cleaning. PCB coating. PCB potting. Cabling in house or outsourced. Total assemblies, housing, 19” racks etc. Burn-in test.

26 Electronics Assembly Cleaning & Coating
• Manufacturing • Capabilities • Menu • Electronics Assembly • Mechatronics • Cleaning & Coating

27 Test, Test Engineering PCB: Visual, probe tester, sleeves /microscope.
• Manufacturing • Capabilities • Menu • Test, Test Engineering PCB: Visual, probe tester, sleeves /microscope. SMD: AOI (Viscom), X-ray (Dage 2 M pixel). CE- precompliant EMC. Product: Visual, Functional, In-circuit, self-test, climate-test. Realisation of project test tools with customers.

28 Logistics - Storage Year order, rolling forecast, MRP.
• Manufacturing • Capabilities • Menu • Logistics Storage Year order, rolling forecast, MRP. Purchasing and incoming goods. Identification / inspection (ATEX !*) / part storage / labeling. Packing following instructions, ESD measures. Storage intermediate and end products, consignation.

29 Logistics - Transportation
• Manufacturing • Capabilities • Menu • Logistics Transportation Just in time, track and trace. Destinations to customer and end customer. Transportation boxes with UPS in NL, UK (Europe). Pallet Benelux with Wesseling Transport Sassenheim. Worldwide via expedition centres, airport etc.

30 After Sales Service After sales service, upgrades, customer repair.
• Manufacturing • Capabilities • Menu • After Sales Service After sales service, upgrades, customer repair. For hard- and software. During the lifecycle of your product. Redesign and use of other/newer parts. Spare parts, obsolete part replacements.

31 Quality Management ISO 9001: 2008 accredited management system
• Manufacturing • Quality Management ISO 9001: 2008 accredited management system Scope Head Electronics BV: “Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products”. Quality manual: MSH Head electronics. Accreditation + verification & support: LRQA + BSH & IMC, NEVAT (consultancy).

32 Your contact persons Managing Director: Arie van Leeuwen
• Competitive Advantage of HEAD • Contact persons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BV Ambachtsweg AH Katwijk ZH tel: +31 (71) fax: +31 (71) Internet:

33 Moving aHEAD for you! Next steps …….
• Competitive Advantage of HEAD • Next Steps …… Moving aHEAD for you!


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