1. DLP Technology for Smart Screenless TVs DLP Pico Technology
Philippe Dollo
Application Engineer
DLP® Pico Projection
DLP® Products

2. DLP Screenless TV

3. Screenless TV Applications
Agenda
Screenless TV Applications
System Overview
Design Resources

4. Key advantages for screenless display applications
Optical efficiency, contrast, and speed
Wide choice of display resolutions (nHD, WVGA, HD, Full HD, 4K, etc.)
Advanced image processing algorithms
DLP technology powering a rapidly growing screenless TV Market

5. Screenless display as combination of three technologies

6. Full system block diagram with host processor

7. DLP system block diagram example
Associated Reference Designs
DLP Products in this System
Other DLP Pico Display Chipsets
0.2” nHD (640x360)
0.2” WVGA (854x480)
0.23” qHD (960x540)
0.33” Full HD (1920x1080)
0.47” Full HD (1920x1080)
0.47” UHD (3840x2160)

8. DLP system optical module
System brightness driven by LED strength, optics, and DMD size
Tradeoff between system brightness and required thermal management
DLP optical design manufacturers (ODMs) enable rapid prototyping and development
TI design network facilitates custom development for more advanced projects

9. Screenless TV Applications
Agenda
Screenless TV Applications
System Overview
Design Resources

10. Mobile Smart TV with DLP technology
Features
Benefits
High image quality
Similar core technology used in DLP Cinema® products:
High contrast ratio, Vivid colors, Dark blacks
High efficiency
Bright Images
Long battery operation
Flexible display size
Small size enable flexible form factors
Users can customize their screen size based on their use case
Smart
Stream media and content directly over Wi-Fi
Aesthetics
Can be easily removed when not in use or embedded into furniture and not visible when turned off
End equipment example
Image © JmGO. en.jmgo.com
image © ZTE
Image © JmGO.
Image © xGimi xGimi.com

11. DLP chipset portfolio for mobile smart TV
DLP P 0.47”,1920x1080
Dual DLPC3439
4K Pico TRP UHD DMD 0.47”,3840x2160
Dual DLPC6421
DLP4501 WXGA 0.45”,1280x800
DLPC6401
1000L
Image Size
High lit
Dim lit
50-60”
70+”
500L
DLP P
0.3”, 1280x720
DLPC3438 (.8mm) or DLPC3433 (.4mm)
DLP P
0.3”, 1920x1080
Dual DLPC3437
Image Size
High lit
Dim lit
40-50”
60+”
Brightness, Size, Power, Price
DLP230GP
0.23”, 960x540
Single DLPC3432
300L
DMD
Controller
Key
Image Size
High lit
Dim lit
35-45”
60+”
DLP2010
0.2”, 840x480
DLPC3435 (.8mm) or DLPC3430 (.4mm)
100L
Resolution
DVD HD
Full HD
UHD (4K)

12. Mobile smart TV design considerations
Image quality
Power
Projection
Connectivity
Style
Audio

13. Power considerations with mobile smart TV
Size
Capacity
Brightness
Check out Mobile Smart TV training on TI.com for more info

14. Laser TV with DLP technology
Features
Benefits
Laser phosphor light source
High brightness, long lasting, instant on/off
Portable
Can be moved from room to room or share media with family and friends outdoors
Easy installation
With ultra short optics, the display unit can be placed inches away from a wall or screen and display a 80+in image
Flexible display size
Users can customize their screen size based on their use case
Smart
Stream media and content directly over Wi-Fi
Aesthetics
Can be easily removed when not in use or embedded into furniture and not visible when turned off
End equipment example
Image © Hisense
Image © Appotronics

15. DLP chipset portfolio for Laser TV
.47” 4K UHD
.65” 1080p
.66” 4K UHD
Micromirror Array Size (diagonal)
Display Resolution
Pixel Pitch
Typical Brightness (lumens)
DMD Part #
Controller Part #
Power Management/
Illumination Drive
FPGA
EVM
0.47”
1920x1080
5.4µm
DLP470NE
DLPC4422
DLPA100 No
Contact us
0.47”
3840x2160
5.4µm
DLP470TE
DLPC4422 (2)
DLPA100
Yes
Contact us
0.65”
1920x1080
7.6µm
DLP650NE
DLPC4422
DLPA100 No
Contact us
0.66”
3840x2160
5.4µm
DLP660TE
DLPC4422 (2)
DLPA100
Yes
Link
Small, compact
High performance

16. DLP Laser system design considerations
Laser phosphor light source (typically with RGB color wheel)
Color wheel motor operation is tied to DMD control (duty cycle fixed to RGB segment sizes)
Special attention should be given to optical and thermal system design to ensure optimal size and cooling

17. Laser TV optical engine considerations
Features
Throw ratio
(ultra short throw)
Target brightness
lumens
Use case 1 – Throw ratio
Projection distance
Image size
Required total light output for 300 nits
0.18
15.25 inches (38.75cm)
100 inch (2.54m) diagonal (aspect ratio 16:9)
3420 lumens
Use case 2 - Throw ratio
0.25
25.44 in (64.62 cm)
120 inch (3.05m) diagonal (aspect ratio 16:9)
4930 lumen
Contrast :1
Can trade off between brightness and contrast
DLP Chipset
DLP660TE, DLP470TE, DLP470NE, DLP650NE
Check out Laser TV white paper on TI.com for more info

18. Screenless TV Applications
Agenda
Screenless TV Applications
System Overview
Design Resources

19. Mobile smart TV resources
Getting started on TI.com
21 devices available
6 DLP Pico EVMs
Buy off-the-shelf optical engines
More..
TI Designs
E2E community
DLP design network
White papers
Application notes 19

20. Laser TV resources 3rd Party Evaluation Modules Technical Documents
Keynote Photonics FlexLight 4K-HLD EVM
Design Network
Work with 3rd party design houses and optical module suppliers to help bring your product concept to reality
Technical Documents
Brightness Requirements Application Note
Laser TV White Paper
User Guide & TI Design
Getting Started Guide
4K UHD Display Reference Design
Datasheets
DLP660TE
DLPC4422
DLPA100
TI E2E Community
Review and post technical questions

21. Screenless TV design flow
Consult TI.com training materials to assess tradeoffs between DLP chipsets
Mobile Smart TV training
4K UHD Laser Digital Display Solutions training
Use mass market evaluation module (EVM) to evaluate chosen technology
Prototype custom system using TI Design reference design
Based on EVMs for ease of use and integration
Leverage ODMs and design network for optical module support

22. TI Information – Selective Disclosure

23. Training Levels Technical Level of content:
Fundamental - High level overview of TI technologies, product lines, etc. This is an introduction presentation for someone not familiar with the topic.
Intermediate - Systems or Product topic that goes into depth. This is a presentation for someone familiar with the systems or products being discussed and should be technical in nature.
Advanced - Technical deep dive of a system or product designed for someone with deep experience on the topic including hands-on experience.

24. Standardized Sub-System Nomenclature for Building EE Reference Designs
SUB_SYSTEM_ID
SUB_SYSTEM_NAME
DESCRIPTION
TYPICAL PRODUCTS 1
Analog Front End
Transformation from real world signals to or from digital signals
ADC, DAC, OPA, Instrumentation Amplifier/INA, PGA, REF, BUF, MUX,  XTR 2
Signal Isolation
Galvanic isolation between ground potentials
Digital Isolators, (Signal Transformers, Opto couplers), Analog Isolators 3
Current & Voltage Sense
Current sensing
ADC, OPA, Hall sensors, Fluxgate, INA,  (Current shunts), REF, COMP, MUX, Switch 4
Signal Input/Output Protection
Protection for inputs and outputs, ESD, EFT, Surge
TVS Diodes, FETs, (PTC), (Diodes) 5
Power Stage
Output power transistor and drivers
Isolated Gate drivers, FETs, Diagnostics, Protection, (Relay, Thyritors,  IGBTs) 6
Input Power Protection
Protection for main power supply
eFUSE, HotSwap, (PTC, Diodes, Fuse) 7
Isolated AC/DC Power Supply
Isolated 115/230V AC/DC Power Supply including power stage, , incl. LDO
PWM Controllers, PFC,  FETs, (Diodes) 8
Non-Isolated AC/DC Power Supply
Non-isolated DC/DC Power Supply including power stage, incl. LDO
PWM Controllers, PFC, FET (Diodes, Transformers) 9
Isolated DC/DC Power Supply
Isolated power supply between DC potentials including power stage, incl. LDO
Push-pull drivers,  fly-buck converters, (transformers) 10
Non-Isolated DC/DC Power Supply
DC/DC Power Supply including power stage, incl. LDO
Buck/Boost converters and controllers, LDO, PMIC, Power Modules, voltage & reset supervisors 11
Energy Storage
Battery back up power and capacitor charging including power stage
DC/DC, Oring, Boost Converters, BMS, (Battery), (Capacitors, Supercaps) 12
Digital Processing
Central processing unit(s)
MPU, MCU, DSP, (FPGA, x86, ASIC, CPLD) 13
Memory
Data storage function
DDR Power, Level Translation, ESD Protection, Termination, (SD Card, EPROM, DDR, NOR/NAND Flash) 14
Clocking
Clock generation and distribution
Clock generators, jitter cleaners, clock distribution, (Xtal) 15
Wired Interface
Wired signal interface to external devices or internal boards
RS-232, RS-485, Ethernet, LVDS, 4-20mA DAC, USB, interface translators, Level translators 16
Wireless Interface
Wireless signal interface to external devices or internal boards
Wifi, BLE, NFC, Sub 1GHz 17
Output User Interface
Status signaling and graphical interface
Audio amplifiers, LED drivers, Back lighting, Bias, Touch Screen, ALS, (LEDs, Buzzer, Loudspeaker, Display) 18
Input User Interface
User interface to the product
GPIO expanders, LDC, Captivate,  Haptics Driver, (Push buttons, Key Pads) 19
Self-Diagnostics/Monitoring
On-board sensors and health monitoring
Temperature sensor, Humidity sensor, Voltage & Reset Supervisor 20
Sense Element
integrated sensing elements
CCD, MEMS sensors