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Date of download: 3/7/2018 Copyright © ASME. All rights reserved.

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Presentation on theme: "Date of download: 3/7/2018 Copyright © ASME. All rights reserved."— Presentation transcript:

1 Date of download: 3/7/2018 Copyright © ASME. All rights reserved. From: Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology J. Electron. Packag. 2016;139(1): doi: / Figure Legend: FTGP assembly process: (a) The copper-cladded polyimide sheets are heat-sealed along three edges to form a pouch, into which (b) the wick (if not already bonded to one of the polymide sheets) and vapor spacer layer and charging tube are inserted. (c) The fourth edge is heat-sealed over the charging tube, and vacuum epoxy is applied around the interface around the tube to seal any leaks. (d) The TGP is evacuated and charged with water through the tube. (e) A final heat seal is made in front of the charging tube. (f) The outer section of the TGP containing the charging tube is then cut away.


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