1. Update on development of consolidated insulation system and procedures C. Scheuerlein, 4th DISMAC meeting,

2. Tentative time line for MB2950 cold test in SM18
Goal is to complete the first prototype insulation qualification test during cold test of MB2950 by the end of this year.
Warm magnetic measurements of MB2950 were completed the 14th Nov.
Installation of diode and insulation pieces were completed the 16th Nov.
Welding tests of capillaries, closing flanges of diode container and T-piece with capillaries connected were completed the 17th Nov.
High pressure testing in bldg. 180 was completed the 21st Nov.
Transport to SMI2 and cryostating completed by the 24th Nov.
Installation of anticryostats in SMA18 completed by the 28th Nov.
Installation on SM18 test bench completed not later than 1st Dec.
11th to 15th Dec cold testing of the insulation system.
Preparation of MB2638 for SM18 qualification test in February 2018.

3. MB2950 in SMI2 for insertion into the cryostat

4. Diode venting channel accessibility for visual inspection and removal of metal debris
Metal debris may be transported through the diode venting hole (cross section 22 × 10 mm2), where they could make a short circuit between the grounded diode end plates and the diode components.
Reviewer recommendations:
RT2: “Consider inspecting/cleaning inside of diode pack and magnet domed ends (if feasible).”
RT3: “Define degree of cleanliness and required tooling.”
RT27: “Explore the possibility of inspecting the inner volumes of the diode assembly by using an adapted endoscope and develop a procedure to remove the debris if any.”
A new insulation insert with a grid in front of the diode venting channel has been designed and will be tested (see Florian’s presentation).
Areas with risk of short to ground
End plates at ground potential

5. Visual inspection of the diode venting hole with an endoscope
A diode was mounted in the LHC interconnect mock-up in bldg where we can practise and develop the standard procedures for quality control and cleaning.
Visual inspecting of the venting hole areas of risk where a short between endplates and diode can be caused by metal chips is possible using a standard endoscope.
The required degree of cleanliness remains to be defined. Proposal: No contaminating pieces >2.0 mm must remain.
Inspection of the diode venting hole using a PEAKTECH 5600 endoscope
Photograph of the diode endplate taken with the PEAKTECH 5600 endoscope inside the venting hole

6. Cleaning set-up and cleaning tests
Following advise from Yann Pira, HSE we procured one new vacuum cleaner Hilfisk HDS1005 (CERN SCEM : ), the same type that was used during LS1 for removing Cu chips produced during busbar machining.
14 classified Hilfisk HDS1005 vacuum cleaners that were used in the LHC during LS1 are stored by HSE, and will be available for our work in the LHC tunnel during LS2.
The new vacuum cleaner is declassified and we can use it in 180 for cleaning tests and later training without any RP constraints.
Special adapters for cleaning the venting hole will be designed and tested.
300 mm
Ø 8 mm
Hilfisk HDS1005 vacuum cleaner at the LHC interconnect mock up.
CAD model of the vacuum cleaner extension tube to clean the diode venting hole.