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Date of download: 12/26/2017 Copyright © ASME. All rights reserved.

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1 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Schematic illustration and definition of the thin-film region of a liquid meniscus formed over a sphere

2 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Capillary pressure versus nondimensional liquid volume for square and hexagonally-packed spheres for various contact angles (15–90 deg)

3 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Non-dimensional area-averaged minimum meniscus distance versus nondimensional liquid volume for square- and hexagonally-packed spheres for various contact angles (15–90 deg)

4 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Total exposed liquid free-surface area versus nondimensional liquid volume for square- and hexagonally-packed spheres for various contact angles (15–90 deg)

5 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Final liquid meniscus shape (dark gray) for Topology 1 (HP), r=1, H=1, P=2.8; θ=15 deg between sphere surface and liquid

6 Date of download: 12/26/2017 Copyright © ASME. All rights reserved. From: Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures J. Heat Transfer. 2009;131(10): doi: / Figure Legend: Total thermal resistance for evaporation and conduction in the wick versus nondimensional liquid height in the wick pore for θ=15, 30, and 45 deg, porosity=0.56


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