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P13623: Conductive Heat Transfer Lab Equipment
System Design Review April 5th, 2013
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Project Participants Dr. Karuna S. Koppula
Project Sponsor : RIT KGCOE, Chemical Engineering Dept. Dr. Karuna S. Koppula Mr. Paul Gregorius MSD 1 Team Guide: Michael Antoniades Project Members: David Olney - (ChemE) Project Manager Todd Jackson - (ME) Project Engineer Alysha Helenic - (ChemE) Documentation Engineer Edward Turfitt - (ChemE) Design/Concept Engineer Charles Pueschel - (ChemE) Data Acquisition Specialist Ian Abramson - (ChemE) Customer Liaison
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Agenda Overview of project
Design specifications, needs and constraints Customer needs Engineering specifications Project deliverables Functional decomposition Design process Concept generation Functional architecture Physical architecture Design generation and assessment Initial concepts Pros and cons Final proposed design Final design assessment Benefits and limitations Feasibility Risk Project planning Project schedule Deliverables Quarter goals Questions
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Heat Transfer and Thermal Conductivity
Heat transfer can take place from three methods (Conduction, Convection , Radiation). The most valuable method to calculate a constants for one specific mode of heat transfer is to reduce or eliminate the other two modes.
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Project Overview Problem Statement:
Build an apparatus that can demonstrate thermal conductivity reliably to students for educational purposes. Resources: The only limitation we have is the set budget for the project. (space, cart, current lab equipment, donations) excluded from budget. Expectations: The purpose of this review session is for constructive criticism, recommendations, and validation by the customer for some of our current designs that we have derived.
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Design Process Flow Problem Definition Define Requirements
PRP Functional Decomposition Problem Definition Engineering Matrix House of Quality Constraint Criteria Define Requirements Define Constraints Power Source Temperature Sensors Heating Element Cooling Element Insulation Methods Data Collection Contact Resistance Interchangeability Define Systems Research Systems Develop Solutions Concept Generation External Assess Solutions Pugh Matrix Design 1 Design 2 Design 3 Design 4 Generate Designs Assess Designs Pro/Con List Final Design Final Design Design assessment Customer Specifications review Risk Assessment Cost Assessment
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Customer Needs
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Engineering Specifications
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Engineering Specifications
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Functional Decomposition
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Functional Architecture
Heating Element Provide a constant heat source to the specimen Cooling Element Provide a constant heat sink to the specimen Temperature Sensors Provide a means for measuring temperature Insulation Minimize the amount of heat loss Data Acquisition Provide a means for collecting data Power Source Provide a means for power heating element
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Concept Generation
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Criteria Generation
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Pugh Matrix: Heating and Cooling
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Pugh Matrix: Insulation
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Pugh Matrix: Sample Container
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Pugh Matrix: Data Measurement and Display
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Design 1 Heater Jacketed Cooler Temp Sensor Thermo Cp Insulation Air
Orientation Horizontal Set-up Easy
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Pros & Cons of Design 1 Pros Simplicity Cheap Visual
Compatible with different samples Easy to set up Cons Inconsistent insulation
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Design 2 Heater Disk Cooler Jacketed Temp Sensor Thermo Cp Insulation
Air Orientation Vertical Set-up Mild
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Pros & Cons of Design 2 Pros Pressure can be applied to the heater
Cheap Visual Compatible with different length samples Cons Hard to swap different diameter samples Potential air leaks because of water supply connections.
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Design 3 Heater Disk Cooler Plate Temp Sensor Thermo Cp Insulation
Solid or packed Orientation Vertical Set-up med-hot
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Pros & Cons of Design 3 Pros No convection
Compatible with different length Pressure can be applied on both the heater and cooler Solid insulation adds support Cons Complex Longer set up times Not completely visible
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Design 4 Heater Disk Cooler Plate Temp Sensor Thermo Cp Insulation
Muti Orientation Vertical Set-up med-hot
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Pros & Cons of Design 4 Pros Limits convections Visual
Compatible with different length and diameter samples Pressure can be applied on both the heater and cooler Compatible with multiple insulations Cons Complex Longer set up times More expensive
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Boat Design Removable caps allow liquid , gases, and pastes to be inserted into the boat. Temperature sensors will be placed at set lengths within the boat so that they do not move. The ends will be made out of a conductive medal to minimize leakage.
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Heat conduction apparatus
Physical Architecture Components Subsystem System Heat conduction apparatus Power source Electric variable power generator Temperature sensor Thermocouple or silicon based temperature sensor Heating element Plate heater Cooling element Cold plate Insulation Variable insulation method Data Collection DAQ LCD Contact resistance Screw cap (pressure) Multi-material Boats
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Critique of Designs
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Data Collection - Design #1
DAQs Cost Interface (to PC) Arduino ~60 USB/Other Ni Equipment >600 Labjack ~110 Needs Manual Data Collection Digital Data Collection Effective For Students of Various Learning Styles 3 Utilization is complex enough to involve 3-4 students in the allotted time 1 Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles - Allows for manual Data Collection 9 Allows for Digital Data Collection
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Data Collection - Design #1 (Digital Only)
Needs Manual Data Collection Digital Data Collection Effective For Students of Various Learning Styles N(3) 3 Utilization is complex enough to involve 3-4 students in the allotted time N(1) 1 Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles - Allows for manual Data Collection N(9) Allows for Digital Data Collection 9
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Data Collection - Design #2 (Analog Version)
Needs Manual Data Collection Digital Data Collection Effective For Students of Various Learning Styles 3 N(3) Utilization is complex enough to involve 3-4 students in the allotted time 1 N(1) Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles - Allows for manual Data Collection 9 Allows for Digital Data Collection N(9)
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Data Collection Design #3
Needs Manual Data Collection Digital Data Collection Effective For Students of Various Learning Styles 3 Utilization is complex enough to involve 3-4 students in the allotted time 1 Utilization Requires Fundamental Understanding of Conducive Heat Transfer Principles - Allows for manual Data Collection 9 Allows for Digital Data Collection
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Temperature In Sample versus Length
Assumptions: Steady State, No conduction or convection from the air on the sample. q = Q/A =-k(dT/dx) Given Targets: Q = 500 W, Target ΔT = 120 K Chosen Parameters: T0 = 273 K, D = ¾”, L = ½’
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Feasibility Analysis One Dimensional Transient Analysis
h T1 T2 T3 T4 T5 One Dimensional Transient Analysis One Dimensional Finite Difference Steady State Analysis T1 and T5 will be known temperatures The length of the rod and properties will be known
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One Dimensional Transient Analysis
h T1 T2 T3 T4 T5
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One Dimensional Transient Analysis
h T1 T2 T3 T4 T5
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One Dimensional Finite Difference Steady State Analysis
h T1 T2 T3 T4 T5
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Simulation Parameters
Copper Rod Parameters Density (kg/m3) 8940 Thermal Conductivity (W/m*K) 401 Specific Heat (J/kg*K) 394 Length (m) 0.254 Diameter (m) Stainless Steel Parameters Density (kg/m3) 7820 Thermal Conductivity (W/m*K) 43 Specific Heat (J/kg*K) 490 Length (m) 0.254 Diameter (m)
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Copper Rod Results After 1 minute After 2 minutes
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Copper Rod Results After 3 minutes After 4 minutes
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Stainless Steel Rod Results
After 5 minutes After 10 minutes
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Stainless Steel Rod Results
After 20 minutes After 40 minutes
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Stainless Steel Rod Results
After 60 minutes
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Feasibility Conclusion
Copper rod reaches steady state much quicker than the stainless steel rod. In order to reach thermal equilibrium quicker, the length of the specimen can be diminished. The lab can be conducted within the allotted time.
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Means for Calculating Thermal Conductivity – Steady State
Where: Rs = thermal resistance of sample F = heat flow transducer calibration factor Tu = upper plate surface temperature Ti = lower plate surface temperature Q = heat flow transducer output Where: K = thermal conductivity d = thickness of sample
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Means for Calculating Thermal Conductivity –Transient
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Risk Assessment
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MSD I and MSD II Goals and Deliverables Project Organization
Define Customer Needs and Specs Develop Concepts Create System Level Design Create Detailed Design Hold System Design Review Revise design based on Review Create test and assembly plans Write BOM Order Materials Hold Detailed Design Review Update Project Plan Design Verification Write Technical Paper Create Poster Final Presentation Create test plans Build system Verify design through testing
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Project Schedule for Quarter
Goal Week Completed Revise System Design based on Review feedback Week 6 Create assembly plans Week 7/8 Create test plans Write BOM Week 9 Order materials Week 9/10 Hold Detailed Design Review Week 10/11
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Questions?
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