1. Impact of TIDVG problem on LSS5 dump design schedule
Marco Calviani, Etienne Carlier, Antonio Perillo Marcone
LIU-SPS Coordination Meeting

2. Strategy
Use the design of TIDVG#4 (new LSS1 dump) as test bench for TIDVG#5 (new LSS5 dump)
Common developments for both dumps
TIDVG#4 will be installed in the machine in LSS1 during EYETS16-17
Profit of the outcome of TIDVG#5 preliminary design review held in 04/2016 for the design of TIDVG#4
Reduction of number of cooling feedthroughs
Remove lengthy longitudinal welding of the dump copper core

3. TIDVG#4 new features that will profit to TIDVG#5
No more longitudinal welding. Dump block and copper core will be housed in a single extruded tube.
Tube will act as vacuum chamber
Tube feasibility confirmed
Tube length is not a limiting factor
Better separation between vacuum and cooling functions
Improvement of cooling circuit
Use of diffusion bounding technique (copper / inox) for improved heat exchange between cooling plate and cooling circuit
Reduction of the number of cooling feedthroughs for cooling plates
Cooling circuits will enter/exit the dump from the upstream or downstream ends

4. Impact on TIDVG#5 Development of a TIDVG#5 prototype on hold
TIDVG#4 will be fully instrumented to measure cooling efficiency in order to serve as real prototype for the design of TIDVG#5
Cooling efficiency will be tested with beam
Development of Thermal Conductivity and Cooling (TCC) test bench ongoing
Study of thermal exchange efficiency between graphite / copper
Will be useful for both dumps
Lessons learned from TIDVG#4 problem to be retrofitted to TIDVG#5 project
Diagnostic in case of dump failure
Impact of external shielding on dump failure diagnostic to be evaluated

5. Summary
Design of TIDVG#4 is progressing full speed with a positive impact on TIDVG#5
A lot of synergies present between design of TIDVG#4 and TIDVG#5
New concepts (mechanical assembly and cooling circuit) will be tested with beam. This will be invaluable for the final design of TIDVG#5
No visible impact of the TIDVG#5 planning for the time being. Strong feeling that, at the end, TIDVG#5 will profit of the TIDVG#3 problem
Delivery of the full dump in 2019 for mock-up installation in BB5 is still the project baseline.