1. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
The thermocompression bonding process for a COG packaged by NCF

2. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
The geometric model for a COG module

3. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
The element meshing for a COG module

4. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
Effects of the thickness of substrate/chip on warpage

5. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
Effects of the bonding force on warpage

6. Date of download: 10/22/2017
Copyright © ASME. All rights reserved.
From: Simulation study on the influences of the bonding parameters on the warpage of chip-on-glass module with nonconductive film
J. Electron. Packag. 2009;131(4): doi: /
Figure Legend:
Effects of the multifactor on warpage