1. ID330L: In-circuit Debugging using Renesas Development Tools and On-chip Resources
David Hedley
Staff AE, Applications Engineering
12 Oct 2010
Version: 1.1

2. David Hedley Staff Applications Engineer Experience
Primary Technical Support Engineer
Americas Technical Tools Support Lead
Experience
12 years with major semiconductor manufacturers
Microchip, ZiLOG, Renesas, Renesas
Holds a BEng.(Honors) from Leeds in the UK
2 Patents in MCU Applications and Tools
North Carolina Youth Soccer Certified Coach
© 2010 Renesas Electronics America Inc. All rights reserved.

3. Renesas Technology and Solution Portfolio
Microcontrollers & Microprocessors #1 Market share worldwide *
Solutions for Innovation
Analog and Power Devices #1 Market share in low-voltage MOSFET**
ASIC, ASSP & Memory Advanced and proven technologies
In the session 110C, Renesas Next Generation Microcontroller and Microprocessor Technology Roadmap, Ritesh Tyagi introduces this high level image of where the Renesas Products fit. The big picture.
* MCU: 31% revenue basis from Gartner "Semiconductor Applications Worldwide Annual Market Share: Database" 25 March 2010
** Power MOSFET: 17.1% on unit basis from Marketing Eye 2009 (17.1% on unit basis).
© 2010 Renesas Electronics America Inc. All rights reserved.

4. Renesas Technology and Solution Portfolio
Microcontrollers & Microprocessors #1 Market share worldwide *
Solutions for Innovation
ASIC, ASSP & Memory Advanced and proven technologies
Analog and Power Devices #1 Market share in low-voltage MOSFET**
This is where our session, ID330L: In-circuit Debugging using Renesas Development Tools and On-chip Resources, is focused within the ‘Big picture of Renesas Products’
* MCU: 31% revenue basis from Gartner "Semiconductor Applications Worldwide Annual Market Share: Database" 25 March 2010
** Power MOSFET: 17.1% on unit basis from Marketing Eye 2009 (17.1% on unit basis).
© 2010 Renesas Electronics America Inc. All rights reserved. 4

5. Microcontroller and Microprocessor Line-up
Up to 1200 DMIPS, 45, 65 & 90nm process
Video and audio processing on Linux
Server, Industrial & Automotive
Superscalar, MMU, Multimedia
Up to 500 DMIPS, 150 & 90nm process
600uA/MHz, 1.5 uA standby
Medical, Automotive & Industrial
High Performance CPU, Low Power
Up to 165 DMIPS, 90nm process
500uA/MHz, 2.5 uA standby
Ethernet, CAN, USB, Motor Control, TFT Display
High Performance CPU, FPU, DSC
Legacy Cores
Next-generation migration to RX
H8S
H8SX
M16C
R32C
Here are the MCU and MPU Product Lines, I am not going to cover any specific information on these families, but rather I want to show you where this session is focused
General Purpose
Ultra Low Power
Embedded Security
Up to 10 DMIPS, 130nm process
350 uA/MHz, 1uA standby
Capacitive touch
Up to 25 DMIPS, 150nm process
190 uA/MHz, 0.3uA standby
Application-specific integration
Up to 25 DMIPS, 180, 90nm process
1mA/MHz, 100uA standby
Crypto engine, Hardware security
© 2010 Renesas Electronics America Inc. All rights reserved. 5

6. Microcontroller and Microprocessor Line-up
Up to 1200 DMIPS, 45, 65 & 90nm process
Video and audio processing on Linux
Server, Industrial & Automotive
Superscalar, MMU, Multimedia
Up to 500 DMIPS, 150 & 90nm process
600uA/MHz, 1.5 uA standby
Medical, Automotive & Industrial
High Performance CPU, Low Power
Up to 165 DMIPS, 90nm process
500uA/MHz, 2.5 uA standby
Ethernet, CAN, USB, Motor Control, TFT Display
High Performance CPU, FPU, DSC
Legacy Cores
Next-generation migration to RX
H8S
H8SX
M16C
R32C
These are the products where this presentation applies
General Purpose
Ultra Low Power
Embedded Security
Up to 10 DMIPS, 130nm process
350 uA/MHz, 1uA standby
Capacitive touch
Up to 25 DMIPS, 150nm process
190 uA/MHz, 0.3uA standby
Application-specific integration
Up to 25 DMIPS, 180, 90nm process
1mA/MHz, 100uA standby
Crypto engine, Hardware security
© 2010 Renesas Electronics America Inc. All rights reserved. 6

7. Innovation Typical Modern Fast Design Cycle
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8. IDE Advanced Features
HEW IDE contains a number of advanced features which can be used to quickly find and fix development issues.
© 2010 Renesas Electronics America Inc. All rights reserved.

9. Agenda Overview of HEW Features Q&A Labs Compiler and Linker Options
Library Usage and modification
Sections and MAP Viewer
Call Walker
Q&A
Labs
© 2010 Renesas Electronics America Inc. All rights reserved.

10. Key Takeaways By the end of this session you will be able to:
Use Advanced Section and Stack Analysis Tools
Debug complex development issues
Use advanced tools to optimize your next design
© 2010 Renesas Electronics America Inc. All rights reserved.

11. Compiler and Linker Options
Found under Build > RX Standard Toolchain
Compiler Options for
Source Files
Object Output
List Output
Compile Optimization
One of the most powerful and unique features of HEW is the way the toolchain options dialog allows you to control the options that are applied to the project’s source files when a build is performed. From this single window you can set different options for each file or file type for every project in the Workspace through its context sensitive project file list, and for each configuration or even multiple configurations at once by selecting them from the drop down list at the top of the window.
© 2010 Renesas Electronics America Inc. All rights reserved.

12. Compiler and Linker Options
Linker Options for
Input Library, Binary or Object files
Output debug and programming options
List Output
Link level Optimization
Section Management
This allows you to do very complex operations easily from the graphical interface e.g. here you could change the linker section for a couple of files just by selecting them in the project list and changing the name in the Section field. This could let you locate them in a specific area of the address space while leaving all the other files in the standard sections. In many other IDEs this would entail writing custom section declarations in the source code and manually editing a linker control file.
© 2010 Renesas Electronics America Inc. All rights reserved.

13. Library Usage and Modification
Specify Usage of Device Library under Link/Library Tab
Standard Library Options (math, stdio etc) available under Standard Library Tab
The Link/Library Tab allows configuration of Library options for the Device Library – linker options are automatically appended to the command line which is shown in the window at the bottom of the tab. This shows exactly what the command line options or switches would be if we were to enter DOS mode and run the linker that way,
For the Standard Library options (on the tab to the right) we have the ability to select C89 or C99 compiler options as well as individually select C/C++ library objects which are to be made available for the application. For example stdio (standard I/O) and math libraries are available here.
© 2010 Renesas Electronics America Inc. All rights reserved.

14. Sections and Map Viewer
Provides a graphical view of object locations
The MapView window in HEW provides a graphical way of looking at the map list file. Here (in the Map Section view) you can select a linkage section and see information about the objects in that section. You can also see the linkage order and addresses and drag-and-drop them to edit the link map and edit section addresses from this window.
Section list
Information about objects in the section
© 2010 Renesas Electronics America Inc. All rights reserved.

15. Call Walker (Stack Analysis)
Call Walker utility shows stack usage for each function
Stack used by function
& sub-functions
Stack used by function
The Call Walker utility allows you see the stack usage for functions in your application. It allows you to view not only the individual function stack usage but also the total usage at any point in the call tree or the stack required by all the sub-functions called from a function. [Note you have to enable generation of the .sni stack information file in the linker to use Call Walker.]
One limitation of the Call Walker tool is that it cannot predict how deep a stack might be required in the event of nested interrupts.
Also worth noting is that the stack size shown in the window is Decimal – most stack size declarations in the Renesas start-up code are in Hexidecimal!
© 2010 Renesas Electronics America Inc. All rights reserved.

16. Questions?
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17. Checking Progress
We are using the die to keep track of where everyone is in the lab. Make sure to update it as you change sections.
When done with the lab, your die will have the 6 pointing up as shown here.
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18. Start the Lab
Keep your dice turned to the section of the lab you are on. (Instructions are provided in the lab handout)
Please refer to the Lab Handout and let’s get started!
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19. Questions?
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20. Thank You!
© 2010 Renesas Electronics America Inc. All rights reserved.