1. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
Reflow temperature profile

2. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
Interface analysis of the SnCuNi IMC: (a) Sn0.7Cu1.0Ni + OSP [9] and (b) Sn0.7Cu + EING

3. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
IMC Growth of SnCuNi subject to thermal aging: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

4. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
Typical failure modes of ball pull test

5. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
Ball pull test results: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

6. Date of download: 10/15/2017
Copyright © ASME. All rights reserved.
From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes
J. Electron. Packag. 2013;136(1): doi: /
Figure Legend:
Comparison of ball pull strength of brittle failure