1. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Saturated moisture concentration as a function of temperature of a BT sample for two different RH levels

2. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Saturated moisture concentration as a function of temperature for a low-Tg die-attach film at 60%RH level

3. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Special treatment and constrain equations at a bimaterial interface in the DCA

4. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Two distinct states of moisture in pores in polymer materials

5. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Implementation procedures of sequentially-coupled heat transfer/moisture diffusion and vapor pressure modeling for reflow process

6. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Comparison of moisture concentration between the DCA and analytical solution

7. Date of download: 10/8/2017
Copyright © ASME. All rights reserved.
From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
J. Electron. Packag. 2009;131(3): doi: /
Figure Legend:
Schematic of moisture distribution in bulk and at interface for a bimaterial: (a) unsaturated case and (b) saturated case