1. Introducing Intel® Xeon® Processor Scalable family
Bryan Hiestand
Data center Marketing

2. Legal Disclaimers
Intel technologies may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer.
For more complete information about performance and benchmark results, visit
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.  For more complete information visit
Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings.  Circumstances will vary. Intel does not guarantee any costs or cost reduction. § For more information go to
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps.
No computer system can be absolutely secure.
Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements that involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.
Intel, the Intel logo, Xeon, Intel vPro, Intel Xeon Phi, Look Inside., are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries.
© 2016 Intel Corporation.

3. Intel® Xeon® Scalable platform
The foundation of Data Center Innovation:
Agile & Trusted Infrastructure
Launched July 11, 2017
Performance
Pervasive through compute, storage, and network
Security
Pervasive data security with near zero performance overhead
Agility
Rapid service delivery
Key Message: Introducing Xeon Scalable Platform
Storyline: I’m excited to introduce the latest addition to our data center portfolio, the Intel Xeon Scalable Platform. This platform represents a new pinnacle in Intel’s 20+ year history of data center innovation. The Intel Xeon Scalable Processor was architected to deliver strong workload driven performance.
Performance: We are excited to be delivering a consistent outstanding performance boost of 1.65X average across a wide range of real-world applications gen over gen.
Compute, Storage, Network Optimized: It’s been a multi-year journey but finally, in this generation, we’ve implemented more features and capabilities specifically for storage and network than ever before. This enables us to win more workloads, more customers and enable new usage models or business opportunities.
Security: We’re also lowering the performance overhead for security data; making data encryption / decryption without a performance penalty a reality. This allows data center operators to deploy security pervasively with minimal impact to service delivery.
Simple and Easy to Deploy:
In the last 5 years, we’ve done a lot of work with the ecosystem to ensure that all the capabilities that went into workload optimization are industry-ready for fast adoption. Also, for the first time, we are releasing a platform that is capable of 2, 4, & 8S+, all at the same time. This will not only accelerate the availability of larger systems in the industry but now, some of the mission critical features (previously available on higher-end system only) can now be supported in 2S mainstream systems.
delivers 1.65x average performance boost over prior Generation1
1 Up to 1.65x Geomean based on Normalized Generational Performance going from Intel® Xeon® processor E5-26xx v4 to Intel® Xeon® Scalable processor (estimated based on Intel internal testing of OLTP Brokerage, SAP SD 2-Tier, HammerDB, Server-side Java, SPEC*int_rate_base2006, SPEC*fp_rate_base2006, Server Virtualization, STREAM* triad, LAMMPS, DPDK L3 Packet Forwarding, Black-Scholes, Intel Distribution for LINPACK
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

4. Sustained Microprocessor Innovation Leadership
Thurley Platform
Romley Platform
Grantley Platform
Purley Platform
Intel® Microarchitecture Codename Nehalem
Intel® Microarchitecture Codename Sandy Bridge
Intel® Microarchitecture Codename Haswell
Intel® Microarchitecture Codename Skylake
Nehalem
45nm
New Micro-architecture
Westmere
32nm
New Process Technology
Sandy Bridge
32nm
New Micro-architecture
Ivy Bridge
22nm
New Process Technology
Haswell
22nm
New Micro-architecture
Broadwell
14nm
New Process Technology
Skylake
14nm
New Micro-architecture
Future Product
Tock
Tick
Tock
Tick
Tock
Tick
Tock
Innovation delivers new microarchitecture with Skylake 3

5. What is THE Intel® Xeon® Processor Scalable Family (Purley) ?
Skylake CPU
Lewisburg Chipset
Integrated options
Discrete options
Fabric Ethernet QUICK ASSIST
So what makes up the Purley platform? Purley is the platform name and it consists of three main areas of components.
First, we have the Skylake CPU interconnected with the UltraPath Interconnect, or UPI, bus. This UPI bus replaces the QPI bus on existing platforms. They skylake cpu has a totally new core micro architecture for added performance, A new memory subsystem, Support for 2S, 4S, & 8S, 4 to 28 cores, ranging from 70 to 205W, Integrated FPGA option, Integrated Omni-Path Fabric option
Second – the CPU is connected to the Lewisburg chipset via the DMI link.
It has your IO – extra PCIe lanes, SATA ports, USB ports, etc.
It has management buses
It also has optional integrated components: Intel QuickAssist, Intel 4x10GbE, and Intel Omni-Path
Finally, there are a plethora of add-in options from Intel and others connected to the PCIe lanes including:
Intel SSDs
Intel Ethernet
Intel Omni-Path
Xeon Phi co-processor
Etc
So we need to all understand and sell the entire platform!
SSDs
Accelerators
Networking

6. One Scalable Platform
Pervasive performance for actionable insights:
4.2x more
vms than a 4-year-old server1
Securing data and services without compromising performance:
3.1x faster cryptographic hashing performance than the Intel® Xeon® processor E v4 family2 3
1,2: See Appendix

7. AVX-512 QAT AVX-512 4-Socket AVX-512 4-Socket QAT VROC
Of course, the world’s data centers do not run synthetic benchmarks, they run real world workloads. This is why Intel invests so deeply in working with a broad ecosystem of software providers to optimize WLs that organizations run to fuel their businesses and drive insight. Here are the results of deep engineering work with hundreds of ISVs across cloud, analytics and network.
SPEAKER NOTE: Picks a few relevant to the customer. Here’s an example used in the launch keynote:
In the Cloud space, Tencent - Tencent video stitching application allows customers to create immersive video content for VR, 360 videos and other needs, based on certain algorithms. Leveraging AVX-512, Xeon Scalable is 72% faster, reducing the time it takes to stitch videos together providing Tencent’s users a more seamless, smoother and immersive 360-degree video experiences. These video experiences are becoming more pervasive in gaming, sports and in many other fields.
In the area of Analytics, SAS - SAS applications provide an integrated environment for modeling, data mining, forecasting, optimization, simulation, experimental design and more.  When coupled with the Intel® Optane™ SSD DC P4800X, the Intel® Xeon® Platinum 8180 processor improves throughput 2X, allowing customers to run more complex analyses, in aggregation, in less time and across larger data sets, to gain deeper insight into critical business.  Improvements driven by ability to move large blocks of data more efficiently with Optane and more compute from Xeon Scalable.
And in Networking, Telefonica – Telefonica’s NFV lab concluded an evaluation of Xeon Scalable processors in a vBNG (virtualized Broadband Network Gateway) showing performance improvement of 67% on a top-bin SKU vs. previous generation (Broadwell). This astounding performance improvement allows them to better service the increasing amount of traffic they are seeing and prepares them for the increase in traffic they are forecasting for the future with 5G.
We’ve been working with software companies across the data center industry to help them test and optimize for the performance delivered by Xeon Scalable platforms. And were seeing amazing results – up to 2x the performance of our prior generation. All of these performance gains benefit for the per core improvements in Xeon Scalable processors. In addition, delivering 50% more memory bandwidth is also a big contributor. You also notice some big improvement when software vendors optimize for AVX-512. HPC related sw vendors were the first to optimize for AVX-512 but you notice that enterprise, cloud, and comms vendor have also optimized. In addition, we’re also seeing big improvement when customer use Intel QuickAssist technology to process cryptographic and compression algorithms.
QAT
VROC
Other names and brands may be claimed as the property of others.. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit:
Baidu Search Click-Through-Rate (CTR) : OS: CentOS Linux release Testing by Intel June S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
Huawei FusionSphere virtualized cloud Platform: OS: RHEL 7.2. Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
Kingsoft Cloud Image Processing and MySQL Cloud Service: OS: CentOS Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
Neusoft SaCa Aclome: SaCa Aclome workload (for general performance) and compressing/decompressing workload (for QAT). OS: CentOS Testing by Intel and Neusoft May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
Tencent Business Analytics: Video Stitching workload. OS: CentOS Linux kernel Testing by Intel April S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
IBM DB2: DB2 v The IBM Big Data Insights Internal Heavy Multiuser Workload (BDInsights) is a multi-user data warehousing workload based on a retail environment. Testing by Intel and IBM April/May S Intel® Xeon® processor E v4 vs 4S Intel® Xeon® Platinum processor 8180.
IHS Markit Analytics Risk Engine: internal synthetic portfolio. OS: Windows server Testing by Intel and IHS Markit May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168.
LAMMPS: Testing by Intel June S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168.
SAP HANA: 1-Node, 4S Intel® Xeon® Processor E v4 on Grantley-EX-based platform with 1024 GB Total Memory on SLES12SP1 vs. estimates based on SAP internal testing on 1-Node, 4S Intel® Xeon® Scalable family.
SAS Business Analytics: SAS 9.4 m4 application running the 30 session SAS Mixed Analytics workload. OS: CentOS 7.2 kernel ntel and SAS May S Intel® Xeon® E v4 vs 2S Intel® Xeon® Platinum processor 8180.
AsiaInfo Telco BSS: AsiaInfo Telco BSS workload. OS: RHEL 7.3. Testing by Intel & AsiaInfo May S Intel® Xeon® processor E v4 vs 4S Intel® Xeon® Platinum processor 8180.
eBrisk: OS: Windows Server 2012 R2 Standard Build Test clips: . Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180.
Ericsson MediaFirst Video Processing UHD HEVC transcoding workload. OS: CentOS Linux* 7.2 kernel Testing by Ericsson in May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168.
Sandvine Virtual Series OS: CentOS Linux release Kernal: Linux el7.x86_64 Hypervisor: qemu-kvm el7_3.3.x86_64 VNF sizing: 3vCPU (6 pCPU threads), 128 GB RAM Testing by Sandvine, June S Intel® Xeon® processor E v3 vs 2S Intel® Xeon® Gold processor 6150.
Telefonica: Testing by Telefonica. 2S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168. 7

8. New Intel® Xeon® Scalable Processor SKU Stack
Intel® Xeon® processor Scalable Family (codename Skylake-SP)
Intel® Xeon® processor E v4 Product Family
(codename Broadwell-EP)
Intel® Xeon® processor E7 v4 and E v4 Product Family
(codename Broadwell-EX)
Platinum
Advanced &
Segment Optimized
8+ Socket Capable
Advanced &
Segment Optimized
Gold
Standard
2 Socket Capable
4 Socket Capable
Basic
Standard
Silver
Basic
Bronze

9. New Intel® Xeon® Scalable Processor SKU Brand
Intel® Xeon® Processor Scalable Family
The Highest Performance and Most Feature Rich Processors supporting 2S to 8S+ Systems
Intel® Xeon® Platinum 8XXX Processor
Intel® Xeon® Processor E7 Family
4 Socket / 8 Socket +
Intel® Xeon® Gold 6XXX Processor
Intel® Xeon® Gold 5XXX Processor
Intel® Xeon® Processor E5 Family
2 Socket / 4 Socket
Intel® Xeon® Silver 4XXX Processor
Intel® Xeon® Bronze 3XXX Processor
Entry Processor
Skylake SKU Numbering
Integration
Options
F = Fabric
T = High Tcase/Extended Reliability
M = 1.5 TB/socket Memory
Shelf
Generation
SKU Number 8 1 7 6 F
Note: SKUs supporting 768GB memory tier will not have a suffix to denote memory tier on the Intel® Xeon® Processor Scalable Family
All information provided here is subject to change without notice. Intel may make changes to specifications and product descriptions at any time, without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps
All SKUs, frequencies, features and performance estimates are PRELIMINARY and can change without notice

10. Polling Question #1
Do you plan to sell Purley/Skylake based solutions in 2017?
Yes No
Don’t know yet

11. Purley Platform Overview

12. 2-Socket Platform Configuration Example
Typical 2S Configuration
SKL
Intel®
UPI
LBG
DMI
3x16
PCIe*
1x100G
Intel® OP Fabric x4 **
DDR4 DIMMs
PCIe* uplink connection for Intel® QuickAssist Technology and Intel® Ethernet
Example DIMM population shown; please look up Apache Pass customer collateral for specific rules on DDR4/Apache Pass DIMM populations **

13. Skylake Server CPU Features and Technologies

14. Rebalancing the Cache Hierarchy
Shared LLC
Up to 2.5MB/core
(inclusive)
Core
MLC (256kB private)
Up to 1.375MB/core
(non-inclusive)
MLC (1 MB private)
Previous Generations
Skylake Server
Shift cache balance from shared-distributed to private-local by enlarging MLC
Shared LLC retained to benefit shared data and to enable capacity balancing
High hit rate on low latency MLC increases performance

15. Intel® Advanced Vector Extensions-512 (AVX-512)
End Customer Value: Workload-optimized performance, throughput increases, and H/W-enhanced security improvements for familiar analytics, HPC, video transcode, cryptography, and compression software.
Problems Solved: 1. Achieve more work per cycle (doubles width of data registers)
2. Minimize latency & overhead (doubles the number of registers) with ultra-wide (512-bit) vector processing capabilities
(2x FMA processing engines are available on Intel® Xeon® Platinum and Intel® Xeon® Gold Processors)
Value pillars
Segments
Proof points
performance
security
Cloud Service Providers
Comms Service Providers
Enterprise
Up to 2x FLOPS/clock cycle1
Up to 4x greater throughput2
Accelerates performance for your most demanding computational tasks
* FLOPs = Floating Point Operations
1 Peak performance vs. Intel® AVX2. As measured by Intel® Xeon® Processor Scalable Family with Intel® AVX-512 compared to an Intel® Xeon® E5 v4 with Intel® AVX2
2 Vectorized floating-point throughput. As measured by Intel® Xeon® Processor Scalable Family with Intel® AVX-512 compared to an Intel® Xeon® E5 v4 with Intel® AVX2

16. New On-Chip Interconnect Architecture
Broadwell Server 24 Core top SKU Skylake Server 28 Core top SKU

17. Polling Question #2
Which of the following Intel® Xeon® Processor Scalable family features do you think will benefit your customers most?
6-channels of DDR4 memory (more bandwidth)
AVX-512 instruction set
General system-level performance improvements
More processor cores

18. Intel® C62x Chipset (Lewisburg) Overview

19. Lewisburg PCH: Intel® QuickAssist Technology
Enables standard server platforms to offer ubiquitous compression and security features
Networking, Storage, Big Data, Cloud, HPC, and Data center applications achieve high performance on:
Bulk Ciphers, Authentication
Public Key Cryptography
Compression
Cryptographic Ciphers & Authentication
Symmetric Encryption and Authentication
Public Key
Cryptography
Secure Key Establishment
(Asymmetric Encryption, Digital Signatures, Key Exchange)
Certificate
Shared Secret
Compression
Lossless Compression in flight and at rest

20. Intel® QuickAssist Technology Example Apps
Server
Secure Browsing, , Search, Data Transfers
Secure Multi-Tenancy
Networking
Firewalls
Secure Routing
Web Proxy
WAN Optimization
Authentication
3G/4G Wireless
Big Data
Affinity Analytics (Hadoop)
Storage
Real-time Data Compression
Static Data Compression
Secure Storage
No computer or technology is absolutely secure

21. Intel® C62x series chipset SKU Guidance
Product Name
SKU
10Gb/1Gb Ethernet Ports
Compression
Encryption
RSA
Max PCIe* Uplink
Recommended Min uplink Config
PCIe* Uplink x8
Optional Muxed Link
Est TDP (W)
Intel® QuickAssist Technology
Intel® C621 Chipset
LBG-1G
0/4
N/A x1
disabled
~ 15
Intel® C622 Chipset
LBG-2
2/4† x8 x4
~ 17
Intel® C624 Chipset
LBG-4
4/4
x16
~ 19
Intel® C625 Chipset
LBG-E
20 Gb/s
20K Ops/s
~ 21
Intel® C626 Chipset
LBG-M
40 Gb/s
40K Ops/s
enabled
~ 23
Intel® C627 Chipset
LBG-T
100 Gb/s
100K Ops/s
~ 26
Intel® C628 Chipset
LBG-L
All SKUs, frequencies and features are PRELIMINARY and can change without notice.
†Four ports total: ports 0 & 1 can run up to 10 GbE, while ports 2 & 3 are limited to 1 GbE
Package Size (all SKUs): 34x28mm, Package Pin Count: 1310
Intel recommends two lanes of PCIe3 for each active 10GbE port for networking and x16 if Intel® QuickAssist Technology is active
LBG supports x16, x8, x4 and x1 options, up to the maximum uplink width.
*These Ethernet ports are in addition to the 1Gb port used by ME11.6
All LBG skus support 7 year production and 10 year use in line with the Unique Extended Supply Life CPU SKUs (10-year use + NEBS-Friendly Thermal Specification)

22. Purley Platform Storage Solution Enhancements

23. Intel is investing in two technologies
Intel 3D NAND technology
lower cost & higher density
“Warm Data”
Higher Performance
“HOT DATA”
Intel® Optane™ technology
HARD DISK DRIVE
INTEL 3D NAND
TECHNOLOGY
We are investing in two key technologies: Intel® 3D NAND Technology and Intel® Optane™ Technology.
Intel’s 3D NAND is all about SCALE - higher density and lower cost. Pushing outward to capture more of the warm data on a media that is much faster than a HDD. Intel® Optane™ Technology is about establishing our position in hot data tier for real-time processing, pushing inward with memory media that is 10X the density of DRAM. Applications and services will be able to put more data into faster storage and expand the system memory pool.
With these technologies, we will deliver a wide portfolio of products, to meet the varying market needs.
INTEL® OPTANETM
TECHNOLOGY
DRAM
CPU
LOWER
COST
HIGHER
LESS
DELAY
MORE

24. Storage Enhancements for Purley Platforms
M.2 (SATA and PCIe) support – recommend for all server boot drives
U inch PCIe SSD topologies supported in Platform Design Guide
New SSDs
New RAID and Performance Enhancement Software
PCIe based RAID using Intel® Virtual RAID on Chip (Intel® VROC) technology
Updates to Intel® Rapid Storage Technology Enterprise (Intel® RSTe) and Intel® Cache Acceleration Software (Intel® CAS)
New PCIe storage enhancements in Processor
Intel® Volume Management Device (Intel® VMD) provides support for PCIe Solid State Drives (SSD):
Hot-plug, enclosure management and error containment functions, LED Management

25. RAIDing NVMe* SSDs behind switches
3. Data RAID across Intel VMD domains whether direct attached or behind switches (no boot),
Behind a single or multiple** CPUs
1. Boot RAID up to 4 SSDs in each of the 3 Intel VMD domains (up to 12 direct attached SSDs)
UPI
Intel VMDn
Intel VMD
Intel VMD
x16 PCIe
x16 PCIe
x16 PCIe
x16 PCIe
x16 PCIe
x16 PCIe
x4 PCIe*
x4 PCIe
PCIe
switch
Boot RAID
Data RAID
x4 PCIe
2. RAID SSDs behind switches;
Stay within x16 Intel VMD domain - boot;
RAID across Intel VMD domains – no boot
Validated up to 24 NVMe* SSDs on 1 level of switches …
Boot RAID
** May incur performance penalty

26. Polling Question #3
What % of your customers use PCI Express* connected SSD drives?
0-10%
10-30%
30-70%
>70%

27. SKU Stack

28. Intel® Xeon® Processor Scalable Family SKU Stack
31xx (Bronze)
41xx (Silver)
51xx (Gold)
61xx (Gold)
81xx (Platinum)
2S-2UPI
2S-2UPI, 4S-2UPI capability
2S-2UPI, 2S-3UPI, 4S-2UPI, 4S-3UPI capability
2S-2UPI, 2S-3UPI, 4S-2UPI, 4S-3UPI, 8S-3UPI capability
6-ch 2133
6-ch 2400
6-ch 2666
2 UPI 9.6GT/s
2 UPI 10.4GT/s
3 UPI 10.4GT/s
Intel® Turbo Boost Technology
Intel® HT Technology
Intel® AVX-512 (1 512-bit FMA)
Intel® AVX-512 (2 512-bit FMA)
48 lanes PCIe* Gen3
Node Controller Support
Standard RAS
Advanced RAS
B = Available in Boxed version (with 3-year warranty)
8180
28C / 205W / 2.5G B
8176
28C / 165W / 2.1G B
6154
18C / 200W / 3.0G
8170
26C / 165W / 2.1G B
6152
22C / 140W / 2.1G B
8168
24C / 205W / 2.7G
6150
18C / 165W / 2.7G
8164
26C / 150W / 2.0G B
6148
20C / 150W / 2.4G B B B
8160
24C / 150W / 2.1G
6142
16C / 150W / 2.6G
6140
18C / 140W / 2.3G B
8158
12C / 150W / 3.0G
6138
20C / 125W / 2.0G B
8156
4C/ 105W / 3.6G
4116
12C / 85W / 2.1G B
6136
12C / 148W / 3.0G
8153
16C / 125W / 2.0G B
4114
10C / 85W / 2.2G B
6134
8C / 130W / 3.2G
5122
4C / 105W / 3.6G B
4112
4C / 85W / 2.6G B
6132
14C / 133W / 2.6G
5120
14C / 105W / 2.2G B B B
4110
8C / 85W / 2.1G B
6130
16C / 125W / 2.1G
3106
8C / 85W / 1.7G
5118
12C / 105W / 2.3G
6128
6C / 115W / 3.4G B B B
3104
6C / 85W / 1.7G
4108
8C / 85W / 1.8G
5115
10C / 85W / 2.4G
6126
12C / 125W / 2.6G
All SKUs, frequencies, features and performance estimates are PRELIMINARY and can change without notice

29. Intel® Xeon® Scalable Processor Transition Advisor
Digital Transition Guide 73 pg ppt  1 click answer
New
Here’s a sneak peek at the Digital Transition Guide. Currently, Intel access only – contact your Intel Rep for discussion. Available to Partners mid to late Q3. OEMs may develop their own versions.
Offering key partners the opportunity to leverage or adopt “as-is,” re-skin and or personalize

30. Key Resources
Get more information:
Take advantage of current Intel® Xeon® Scalable Processor Promotions:
Transition Advisor Tool:
Get recommendations for which new processor skus to offer customers
Q: Are you supporting early ship?
A: To enable early access to the latest Intel technologies, we will support Purley early ship systems based on our spread core board (Wolf Pass) and density optimized board (Buchanan Pass). We are supporting nine pre-configured SKUs, optimized for HPC, Cloud and Enterprise workloads. SKU details are available here:
Q: Will you support a custom early ship configuration?
A: Yes. We will support custom configurations with peripherals from the Early Ship Approved Peripherals list.  Contact your Intel Sales Representative for details.
Q: Are you supporting early ship for server boards?
A: For early ship, we are supporting integrated server systems based on our spread core and density optimized boards.
Q: When can I begin placing early ship orders?
A: We are taking orders for early ship systems now and we will take orders until 4 weeks prior to launch. Systems will begin shipping in April and we will continue to ship systems through launch.
Q: What is the minimum order quantity for early ship orders?
A: Minimum order quantity is 100 processors. This equates to 50 spread core systems (S2600WF), 12 density optimized systems (S2600BP) or some combination of these systems. Exceptions will be considered with submission of an MOQ exception form
Q: What is the lead time for early ship orders?
A: When systems begin shipping in April, lead times will be:
One week for set configurations provided we have systems in inventory.
Four weeks for customer configure-to-order systems.
Q: What is the impact of the Lewisburg PCH sighting on Early Ship systems (rev 10_ )?
A: Early ship systems will contain the Lewisburg workaround (implemented via a board fix). Our board fix will support standard server reliability with current Lewisburg (B-1, S-0) and the new production Lewisburg (B-2, S-1) steppings.