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Introducing Intel® Xeon® Processor Scalable family
Bryan Hiestand Data center Marketing
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Legal Disclaimers Intel technologies may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer. For more complete information about performance and benchmark results, visit Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit Cost reduction scenarios described are intended as examples of how a given Intel- based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. § For more information go to All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps. No computer system can be absolutely secure. Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements that involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K. Intel, the Intel logo, Xeon, Intel vPro, Intel Xeon Phi, Look Inside., are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Microsoft, Windows, and the Windows logo are trademarks, or registered trademarks of Microsoft Corporation in the United States and/or other countries. © 2016 Intel Corporation.
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Intel® Xeon® Scalable platform
The foundation of Data Center Innovation: Agile & Trusted Infrastructure Launched July 11, 2017 Performance Pervasive through compute, storage, and network Security Pervasive data security with near zero performance overhead Agility Rapid service delivery Key Message: Introducing Xeon Scalable Platform Storyline: I’m excited to introduce the latest addition to our data center portfolio, the Intel Xeon Scalable Platform. This platform represents a new pinnacle in Intel’s 20+ year history of data center innovation. The Intel Xeon Scalable Processor was architected to deliver strong workload driven performance. Performance: We are excited to be delivering a consistent outstanding performance boost of 1.65X average across a wide range of real-world applications gen over gen. Compute, Storage, Network Optimized: It’s been a multi-year journey but finally, in this generation, we’ve implemented more features and capabilities specifically for storage and network than ever before. This enables us to win more workloads, more customers and enable new usage models or business opportunities. Security: We’re also lowering the performance overhead for security data; making data encryption / decryption without a performance penalty a reality. This allows data center operators to deploy security pervasively with minimal impact to service delivery. Simple and Easy to Deploy: In the last 5 years, we’ve done a lot of work with the ecosystem to ensure that all the capabilities that went into workload optimization are industry-ready for fast adoption. Also, for the first time, we are releasing a platform that is capable of 2, 4, & 8S+, all at the same time. This will not only accelerate the availability of larger systems in the industry but now, some of the mission critical features (previously available on higher-end system only) can now be supported in 2S mainstream systems. delivers 1.65x average performance boost over prior Generation1 1 Up to 1.65x Geomean based on Normalized Generational Performance going from Intel® Xeon® processor E5-26xx v4 to Intel® Xeon® Scalable processor (estimated based on Intel internal testing of OLTP Brokerage, SAP SD 2-Tier, HammerDB, Server-side Java, SPEC*int_rate_base2006, SPEC*fp_rate_base2006, Server Virtualization, STREAM* triad, LAMMPS, DPDK L3 Packet Forwarding, Black-Scholes, Intel Distribution for LINPACK Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.
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Sustained Microprocessor Innovation Leadership
Thurley Platform Romley Platform Grantley Platform Purley Platform Intel® Microarchitecture Codename Nehalem Intel® Microarchitecture Codename Sandy Bridge Intel® Microarchitecture Codename Haswell Intel® Microarchitecture Codename Skylake Nehalem 45nm New Micro-architecture Westmere 32nm New Process Technology Sandy Bridge 32nm New Micro-architecture Ivy Bridge 22nm New Process Technology Haswell 22nm New Micro-architecture Broadwell 14nm New Process Technology Skylake 14nm New Micro-architecture Future Product Tock Tick Tock Tick Tock Tick Tock Innovation delivers new microarchitecture with Skylake 3
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What is THE Intel® Xeon® Processor Scalable Family (Purley) ?
Skylake CPU Lewisburg Chipset Integrated options Discrete options Fabric Ethernet QUICK ASSIST So what makes up the Purley platform? Purley is the platform name and it consists of three main areas of components. First, we have the Skylake CPU interconnected with the UltraPath Interconnect, or UPI, bus. This UPI bus replaces the QPI bus on existing platforms. They skylake cpu has a totally new core micro architecture for added performance, A new memory subsystem, Support for 2S, 4S, & 8S, 4 to 28 cores, ranging from 70 to 205W, Integrated FPGA option, Integrated Omni-Path Fabric option Second – the CPU is connected to the Lewisburg chipset via the DMI link. It has your IO – extra PCIe lanes, SATA ports, USB ports, etc. It has management buses It also has optional integrated components: Intel QuickAssist, Intel 4x10GbE, and Intel Omni-Path Finally, there are a plethora of add-in options from Intel and others connected to the PCIe lanes including: Intel SSDs Intel Ethernet Intel Omni-Path Xeon Phi co-processor Etc So we need to all understand and sell the entire platform! SSDs Accelerators Networking
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One Scalable Platform Pervasive performance for actionable insights: 4.2x more vms than a 4-year-old server1 Securing data and services without compromising performance: 3.1x faster cryptographic hashing performance than the Intel® Xeon® processor E v4 family2 3 1,2: See Appendix
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AVX-512 QAT AVX-512 4-Socket AVX-512 4-Socket QAT VROC
Of course, the world’s data centers do not run synthetic benchmarks, they run real world workloads. This is why Intel invests so deeply in working with a broad ecosystem of software providers to optimize WLs that organizations run to fuel their businesses and drive insight. Here are the results of deep engineering work with hundreds of ISVs across cloud, analytics and network. SPEAKER NOTE: Picks a few relevant to the customer. Here’s an example used in the launch keynote: In the Cloud space, Tencent - Tencent video stitching application allows customers to create immersive video content for VR, 360 videos and other needs, based on certain algorithms. Leveraging AVX-512, Xeon Scalable is 72% faster, reducing the time it takes to stitch videos together providing Tencent’s users a more seamless, smoother and immersive 360-degree video experiences. These video experiences are becoming more pervasive in gaming, sports and in many other fields. In the area of Analytics, SAS - SAS applications provide an integrated environment for modeling, data mining, forecasting, optimization, simulation, experimental design and more. When coupled with the Intel® Optane™ SSD DC P4800X, the Intel® Xeon® Platinum 8180 processor improves throughput 2X, allowing customers to run more complex analyses, in aggregation, in less time and across larger data sets, to gain deeper insight into critical business. Improvements driven by ability to move large blocks of data more efficiently with Optane and more compute from Xeon Scalable. And in Networking, Telefonica – Telefonica’s NFV lab concluded an evaluation of Xeon Scalable processors in a vBNG (virtualized Broadband Network Gateway) showing performance improvement of 67% on a top-bin SKU vs. previous generation (Broadwell). This astounding performance improvement allows them to better service the increasing amount of traffic they are seeing and prepares them for the increase in traffic they are forecasting for the future with 5G. We’ve been working with software companies across the data center industry to help them test and optimize for the performance delivered by Xeon Scalable platforms. And were seeing amazing results – up to 2x the performance of our prior generation. All of these performance gains benefit for the per core improvements in Xeon Scalable processors. In addition, delivering 50% more memory bandwidth is also a big contributor. You also notice some big improvement when software vendors optimize for AVX-512. HPC related sw vendors were the first to optimize for AVX-512 but you notice that enterprise, cloud, and comms vendor have also optimized. In addition, we’re also seeing big improvement when customer use Intel QuickAssist technology to process cryptographic and compression algorithms. QAT VROC Other names and brands may be claimed as the property of others.. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit: Baidu Search Click-Through-Rate (CTR) : OS: CentOS Linux release Testing by Intel June S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. Huawei FusionSphere virtualized cloud Platform: OS: RHEL 7.2. Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. Kingsoft Cloud Image Processing and MySQL Cloud Service: OS: CentOS Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. Neusoft SaCa Aclome: SaCa Aclome workload (for general performance) and compressing/decompressing workload (for QAT). OS: CentOS Testing by Intel and Neusoft May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. Tencent Business Analytics: Video Stitching workload. OS: CentOS Linux kernel Testing by Intel April S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. IBM DB2: DB2 v The IBM Big Data Insights Internal Heavy Multiuser Workload (BDInsights) is a multi-user data warehousing workload based on a retail environment. Testing by Intel and IBM April/May S Intel® Xeon® processor E v4 vs 4S Intel® Xeon® Platinum processor 8180. IHS Markit Analytics Risk Engine: internal synthetic portfolio. OS: Windows server Testing by Intel and IHS Markit May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168. LAMMPS: Testing by Intel June S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168. SAP HANA: 1-Node, 4S Intel® Xeon® Processor E v4 on Grantley-EX-based platform with 1024 GB Total Memory on SLES12SP1 vs. estimates based on SAP internal testing on 1-Node, 4S Intel® Xeon® Scalable family. SAS Business Analytics: SAS 9.4 m4 application running the 30 session SAS Mixed Analytics workload. OS: CentOS 7.2 kernel ntel and SAS May S Intel® Xeon® E v4 vs 2S Intel® Xeon® Platinum processor 8180. AsiaInfo Telco BSS: AsiaInfo Telco BSS workload. OS: RHEL 7.3. Testing by Intel & AsiaInfo May S Intel® Xeon® processor E v4 vs 4S Intel® Xeon® Platinum processor 8180. eBrisk: OS: Windows Server 2012 R2 Standard Build Test clips: . Testing by Intel May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8180. Ericsson MediaFirst Video Processing UHD HEVC transcoding workload. OS: CentOS Linux* 7.2 kernel Testing by Ericsson in May S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168. Sandvine Virtual Series OS: CentOS Linux release Kernal: Linux el7.x86_64 Hypervisor: qemu-kvm el7_3.3.x86_64 VNF sizing: 3vCPU (6 pCPU threads), 128 GB RAM Testing by Sandvine, June S Intel® Xeon® processor E v3 vs 2S Intel® Xeon® Gold processor 6150. Telefonica: Testing by Telefonica. 2S Intel® Xeon® processor E v4 vs 2S Intel® Xeon® Platinum processor 8168. 7
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New Intel® Xeon® Scalable Processor SKU Stack
Intel® Xeon® processor Scalable Family (codename Skylake-SP) Intel® Xeon® processor E v4 Product Family (codename Broadwell-EP) Intel® Xeon® processor E7 v4 and E v4 Product Family (codename Broadwell-EX) Platinum Advanced & Segment Optimized 8+ Socket Capable Advanced & Segment Optimized Gold Standard 2 Socket Capable 4 Socket Capable Basic Standard Silver Basic Bronze
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New Intel® Xeon® Scalable Processor SKU Brand
Intel® Xeon® Processor Scalable Family The Highest Performance and Most Feature Rich Processors supporting 2S to 8S+ Systems Intel® Xeon® Platinum 8XXX Processor Intel® Xeon® Processor E7 Family 4 Socket / 8 Socket + Intel® Xeon® Gold 6XXX Processor Intel® Xeon® Gold 5XXX Processor Intel® Xeon® Processor E5 Family 2 Socket / 4 Socket Intel® Xeon® Silver 4XXX Processor Intel® Xeon® Bronze 3XXX Processor Entry Processor Skylake SKU Numbering Integration Options F = Fabric T = High Tcase/Extended Reliability M = 1.5 TB/socket Memory Shelf Generation SKU Number 8 1 7 6 F Note: SKUs supporting 768GB memory tier will not have a suffix to denote memory tier on the Intel® Xeon® Processor Scalable Family All information provided here is subject to change without notice. Intel may make changes to specifications and product descriptions at any time, without notice. Contact your Intel representative to obtain the latest Intel product specifications and roadmaps All SKUs, frequencies, features and performance estimates are PRELIMINARY and can change without notice
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Polling Question #1 Do you plan to sell Purley/Skylake based solutions in 2017? Yes No Don’t know yet
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Purley Platform Overview
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2-Socket Platform Configuration Example
Typical 2S Configuration SKL Intel® UPI LBG DMI 3x16 PCIe* 1x100G Intel® OP Fabric x4 ** DDR4 DIMMs PCIe* uplink connection for Intel® QuickAssist Technology and Intel® Ethernet Example DIMM population shown; please look up Apache Pass customer collateral for specific rules on DDR4/Apache Pass DIMM populations **
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Skylake Server CPU Features and Technologies
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Rebalancing the Cache Hierarchy
Shared LLC Up to 2.5MB/core (inclusive) Core MLC (256kB private) Up to 1.375MB/core (non-inclusive) MLC (1 MB private) Previous Generations Skylake Server Shift cache balance from shared-distributed to private-local by enlarging MLC Shared LLC retained to benefit shared data and to enable capacity balancing High hit rate on low latency MLC increases performance
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Intel® Advanced Vector Extensions-512 (AVX-512)
End Customer Value: Workload-optimized performance, throughput increases, and H/W-enhanced security improvements for familiar analytics, HPC, video transcode, cryptography, and compression software. Problems Solved: 1. Achieve more work per cycle (doubles width of data registers) 2. Minimize latency & overhead (doubles the number of registers) with ultra-wide (512-bit) vector processing capabilities (2x FMA processing engines are available on Intel® Xeon® Platinum and Intel® Xeon® Gold Processors) Value pillars Segments Proof points performance security Cloud Service Providers Comms Service Providers Enterprise Up to 2x FLOPS/clock cycle1 Up to 4x greater throughput2 Accelerates performance for your most demanding computational tasks * FLOPs = Floating Point Operations 1 Peak performance vs. Intel® AVX2. As measured by Intel® Xeon® Processor Scalable Family with Intel® AVX-512 compared to an Intel® Xeon® E5 v4 with Intel® AVX2 2 Vectorized floating-point throughput. As measured by Intel® Xeon® Processor Scalable Family with Intel® AVX-512 compared to an Intel® Xeon® E5 v4 with Intel® AVX2
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New On-Chip Interconnect Architecture
Broadwell Server 24 Core top SKU Skylake Server 28 Core top SKU
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Polling Question #2 Which of the following Intel® Xeon® Processor Scalable family features do you think will benefit your customers most? 6-channels of DDR4 memory (more bandwidth) AVX-512 instruction set General system-level performance improvements More processor cores
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Intel® C62x Chipset (Lewisburg) Overview
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Lewisburg PCH: Intel® QuickAssist Technology
Enables standard server platforms to offer ubiquitous compression and security features Networking, Storage, Big Data, Cloud, HPC, and Data center applications achieve high performance on: Bulk Ciphers, Authentication Public Key Cryptography Compression Cryptographic Ciphers & Authentication Symmetric Encryption and Authentication Public Key Cryptography Secure Key Establishment (Asymmetric Encryption, Digital Signatures, Key Exchange) Certificate Shared Secret Compression Lossless Compression in flight and at rest
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Intel® QuickAssist Technology Example Apps
Server Secure Browsing, , Search, Data Transfers Secure Multi-Tenancy Networking Firewalls Secure Routing Web Proxy WAN Optimization Authentication 3G/4G Wireless Big Data Affinity Analytics (Hadoop) Storage Real-time Data Compression Static Data Compression Secure Storage No computer or technology is absolutely secure
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Intel® C62x series chipset SKU Guidance
Product Name SKU 10Gb/1Gb Ethernet Ports Compression Encryption RSA Max PCIe* Uplink Recommended Min uplink Config PCIe* Uplink x8 Optional Muxed Link Est TDP (W) Intel® QuickAssist Technology Intel® C621 Chipset LBG-1G 0/4 N/A x1 disabled ~ 15 Intel® C622 Chipset LBG-2 2/4† x8 x4 ~ 17 Intel® C624 Chipset LBG-4 4/4 x16 ~ 19 Intel® C625 Chipset LBG-E 20 Gb/s 20K Ops/s ~ 21 Intel® C626 Chipset LBG-M 40 Gb/s 40K Ops/s enabled ~ 23 Intel® C627 Chipset LBG-T 100 Gb/s 100K Ops/s ~ 26 Intel® C628 Chipset LBG-L All SKUs, frequencies and features are PRELIMINARY and can change without notice. †Four ports total: ports 0 & 1 can run up to 10 GbE, while ports 2 & 3 are limited to 1 GbE Package Size (all SKUs): 34x28mm, Package Pin Count: 1310 Intel recommends two lanes of PCIe3 for each active 10GbE port for networking and x16 if Intel® QuickAssist Technology is active LBG supports x16, x8, x4 and x1 options, up to the maximum uplink width. *These Ethernet ports are in addition to the 1Gb port used by ME11.6 All LBG skus support 7 year production and 10 year use in line with the Unique Extended Supply Life CPU SKUs (10-year use + NEBS-Friendly Thermal Specification)
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Purley Platform Storage Solution Enhancements
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Intel is investing in two technologies
Intel 3D NAND technology lower cost & higher density “Warm Data” Higher Performance “HOT DATA” Intel® Optane™ technology HARD DISK DRIVE INTEL 3D NAND TECHNOLOGY We are investing in two key technologies: Intel® 3D NAND Technology and Intel® Optane™ Technology. Intel’s 3D NAND is all about SCALE - higher density and lower cost. Pushing outward to capture more of the warm data on a media that is much faster than a HDD. Intel® Optane™ Technology is about establishing our position in hot data tier for real-time processing, pushing inward with memory media that is 10X the density of DRAM. Applications and services will be able to put more data into faster storage and expand the system memory pool. With these technologies, we will deliver a wide portfolio of products, to meet the varying market needs. INTEL® OPTANETM TECHNOLOGY DRAM CPU LOWER COST HIGHER LESS DELAY MORE
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Storage Enhancements for Purley Platforms
M.2 (SATA and PCIe) support – recommend for all server boot drives U inch PCIe SSD topologies supported in Platform Design Guide New SSDs New RAID and Performance Enhancement Software PCIe based RAID using Intel® Virtual RAID on Chip (Intel® VROC) technology Updates to Intel® Rapid Storage Technology Enterprise (Intel® RSTe) and Intel® Cache Acceleration Software (Intel® CAS) New PCIe storage enhancements in Processor Intel® Volume Management Device (Intel® VMD) provides support for PCIe Solid State Drives (SSD): Hot-plug, enclosure management and error containment functions, LED Management
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RAIDing NVMe* SSDs behind switches
3. Data RAID across Intel VMD domains whether direct attached or behind switches (no boot), Behind a single or multiple** CPUs 1. Boot RAID up to 4 SSDs in each of the 3 Intel VMD domains (up to 12 direct attached SSDs) UPI Intel VMDn Intel VMD Intel VMD x16 PCIe x16 PCIe x16 PCIe x16 PCIe x16 PCIe x16 PCIe x4 PCIe* x4 PCIe PCIe switch Boot RAID Data RAID x4 PCIe 2. RAID SSDs behind switches; Stay within x16 Intel VMD domain - boot; RAID across Intel VMD domains – no boot Validated up to 24 NVMe* SSDs on 1 level of switches … Boot RAID ** May incur performance penalty
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Polling Question #3 What % of your customers use PCI Express* connected SSD drives? 0-10% 10-30% 30-70% >70%
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SKU Stack
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Intel® Xeon® Processor Scalable Family SKU Stack
31xx (Bronze) 41xx (Silver) 51xx (Gold) 61xx (Gold) 81xx (Platinum) 2S-2UPI 2S-2UPI, 4S-2UPI capability 2S-2UPI, 2S-3UPI, 4S-2UPI, 4S-3UPI capability 2S-2UPI, 2S-3UPI, 4S-2UPI, 4S-3UPI, 8S-3UPI capability 6-ch 2133 6-ch 2400 6-ch 2666 2 UPI 9.6GT/s 2 UPI 10.4GT/s 3 UPI 10.4GT/s Intel® Turbo Boost Technology Intel® HT Technology Intel® AVX-512 (1 512-bit FMA) Intel® AVX-512 (2 512-bit FMA) 48 lanes PCIe* Gen3 Node Controller Support Standard RAS Advanced RAS B = Available in Boxed version (with 3-year warranty) 8180 28C / 205W / 2.5G B 8176 28C / 165W / 2.1G B 6154 18C / 200W / 3.0G 8170 26C / 165W / 2.1G B 6152 22C / 140W / 2.1G B 8168 24C / 205W / 2.7G 6150 18C / 165W / 2.7G 8164 26C / 150W / 2.0G B 6148 20C / 150W / 2.4G B B B 8160 24C / 150W / 2.1G 6142 16C / 150W / 2.6G 6140 18C / 140W / 2.3G B 8158 12C / 150W / 3.0G 6138 20C / 125W / 2.0G B 8156 4C/ 105W / 3.6G 4116 12C / 85W / 2.1G B 6136 12C / 148W / 3.0G 8153 16C / 125W / 2.0G B 4114 10C / 85W / 2.2G B 6134 8C / 130W / 3.2G 5122 4C / 105W / 3.6G B 4112 4C / 85W / 2.6G B 6132 14C / 133W / 2.6G 5120 14C / 105W / 2.2G B B B 4110 8C / 85W / 2.1G B 6130 16C / 125W / 2.1G 3106 8C / 85W / 1.7G 5118 12C / 105W / 2.3G 6128 6C / 115W / 3.4G B B B 3104 6C / 85W / 1.7G 4108 8C / 85W / 1.8G 5115 10C / 85W / 2.4G 6126 12C / 125W / 2.6G All SKUs, frequencies, features and performance estimates are PRELIMINARY and can change without notice
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Intel® Xeon® Scalable Processor Transition Advisor
Digital Transition Guide 73 pg ppt 1 click answer New Here’s a sneak peek at the Digital Transition Guide. Currently, Intel access only – contact your Intel Rep for discussion. Available to Partners mid to late Q3. OEMs may develop their own versions. Offering key partners the opportunity to leverage or adopt “as-is,” re-skin and or personalize
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Key Resources Get more information: Take advantage of current Intel® Xeon® Scalable Processor Promotions: Transition Advisor Tool: Get recommendations for which new processor skus to offer customers Q: Are you supporting early ship? A: To enable early access to the latest Intel technologies, we will support Purley early ship systems based on our spread core board (Wolf Pass) and density optimized board (Buchanan Pass). We are supporting nine pre-configured SKUs, optimized for HPC, Cloud and Enterprise workloads. SKU details are available here: Q: Will you support a custom early ship configuration? A: Yes. We will support custom configurations with peripherals from the Early Ship Approved Peripherals list. Contact your Intel Sales Representative for details. Q: Are you supporting early ship for server boards? A: For early ship, we are supporting integrated server systems based on our spread core and density optimized boards. Q: When can I begin placing early ship orders? A: We are taking orders for early ship systems now and we will take orders until 4 weeks prior to launch. Systems will begin shipping in April and we will continue to ship systems through launch. Q: What is the minimum order quantity for early ship orders? A: Minimum order quantity is 100 processors. This equates to 50 spread core systems (S2600WF), 12 density optimized systems (S2600BP) or some combination of these systems. Exceptions will be considered with submission of an MOQ exception form Q: What is the lead time for early ship orders? A: When systems begin shipping in April, lead times will be: One week for set configurations provided we have systems in inventory. Four weeks for customer configure-to-order systems. Q: What is the impact of the Lewisburg PCH sighting on Early Ship systems (rev 10_ )? A: Early ship systems will contain the Lewisburg workaround (implemented via a board fix). Our board fix will support standard server reliability with current Lewisburg (B-1, S-0) and the new production Lewisburg (B-2, S-1) steppings.
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