1. VIA PUF & PUF WinLink Co., Ltd. Contact : Ricky Kwak / 곽민호
ICTK Co., Ltd.
3/5 fl, Vforum Building, 323 Pangyo-ro, Bundang-gu
Gyunggi-do, Korea 13488
TEL : FAX :
VIA PUF & PUF
WinLink Co., Ltd. Contact : Ricky Kwak / 곽민호
Tel : Fax : Mobile :

2. Executive Summary
The researches of PUF, Physical Unclonable Function, technology have been in the industry for last a decade long, but the most of studies failed to enter the mass volume production with various reasons. One of the latest known reason is repeatability issue or testing time issue. ICTK, a Korean firm, has also researched since 2009 and successfully developed VIA PUF in 2014, that allows to enter volume production without any barrier at all. One of the major reason to have researched PUF technology is to replace memory based security system currently in use. Therefore VIA PUF is going to change the security system to new paradigms. Major basic application areas are Secure ID, Secure Private Key and Secure memory. ICTK is on its way to deploy the products to the market and also is ready to accept any specific requirements to work together with various industry. And yet ICTK is willing to license the VIA PUF technology to those who could be partners. ICTK should be more than happy to provide you more information upon your request. Thanks & best regards.

3. ICTK
ICTK(ICTK Co., Ltd.) is a global transaction & security solution provider serving more than 200 clients worldwide, including manufacturers, banks and government agencies.
As an international testing laboratory and consultant, ICTK has been working on the field of the payments, transportation, value-added network and mobile network sectors, satisfying requirements defined by* EMVCo, Visa, JCB, Discover, Global Platform, NFC Forum and KOLAS (ISO/IEC 17025) for product stability and interoperability. ICTK has been dedicated into the development of customized testing solutions such as testing tools and an validation system.
ICTK is a great smart card testing & security solutions partner for your success
ICTK is a leader in new generation security solutions for smart devices, cloud computing, smart grid and intelligent automobiles. By bringing a physical property of each chip as an ID (Vs. S/W pseudo random number), it provides unclonable functions to prevent any security breach in the most simple and cost-effective way.
All the work for the security solution brought a number of both registered and pending patents. Recently, ICTK has founded R&D center at Fusion Technology Center of Hanyang University to research PUF-based security chip and its system.

4. Situations of Coventional Security
Memory-based Key Management System is the core of security
Keys are generated by PRNG or TRNG
Keys are stored in NVM
Hackers always trying to steal Keys
From NVM or by side channel attack
Impossible to decrypt the encrypted data without the relevant Key
Trend toward to HW security
TPM, TEE, HSM, SE, etc..
Researching replacing technology, PUF

5. Issues of Memory Base Security
Hardware security is vulnerable to physical attacks
Takes months to analyze IC, then few hours to steal KEY
Black hat 2010
Steal KEY from Infineon TPM memory
6 months for chip analysis
6 hours to steal KEY
Black hat 2015
Reverse engineering by computer power
3months for new smartcard IC
2020? ?
Require stronger countermeasure to physical attacks

6. What is PUF? Physical Unclonable Function Requirements of PUF
a physical entity in a physical structure
impossible to clone or duplicate
from the same manufacturing process
Requirements of PUF
Unpredictable
Unclonable
Random
Repeatable

7. Root of Trust Core of SECURITY Root of TRUST
PUF generates the KEY from physical
structure
Once use, demolish the KEY
Regenerate the KEY when need
No requirement of KEY storage
No place Hackers to steal the KEY
Core of SECURITY
Root of TRUST
Counter
Password
User data
etc…
VIA PUF
Variables
HASH
The KEY
KEY derivative

8. Types of PUF? Year Method Author Circuit Commercialization 2000
Random drain
voltage
Portland State
University
Siid Tech  Hitachi
gave up production
2005
Random difference
of two delay path
MIT
Verayo
2007
Random bit from
unstable state of
SRAM
Philips
Intrinsic ID
2009
Random capacitance
value due to the
coating layer
NXP

9. Issues of Conventional PUF’s
Very much sensitive to environmental variations and aging, i.e. temperature, humidity, etc.
Poor repeatability
Require additional post processing circuits to improve repeatability
Normally using ECC (Error Correction Code)
Efficiency of ECC is important factor
Resulted high cost due to test time and design overhead

10. What is VIA PUF?
Utilize VIA holes between two metal layers to create the contact
Certain hole size gives “open or short” by semiconductor process itself
These “opens and shorts” are created randomly
The combination of this “open and short” generates VIA PUF
The holes are scattered rather than located in a specific area

11. VIA PUF Hole Formation Select via hole size smaller than design rule
Target 50% : 50% of “open and short”
Upper Metal Layer
Lower Metal Layer
Cross-sectional Views of Via Hole Array
Via Hole Size: XM
Via Hole Size: Design Rule
VIA holes

12. Advantage of VIA PUF Excellent repeatability
Gives clear “open & short” all the time due to its usual “via hole nature”
No change by environment changes or aging
Complies JEDEC standard for reliability test
High Quality of Randomness
Satisfies “ NIST SP800-90B” test suit
No Error Correction Circuit required
Unlike conventional SRAM type PUF(or active circuit), VIA PUF does NOT require ECC
Scalable PUF cells
Easy to control number of PUF cells

13. Excellent Repeatability
Complies JEDEC Standard for reliability test
Test
Condition
Test Time
Sample #
Test results (fail #)
HTOL
125 ℃ / Vcc=Max.
1000 hr
231 ea
Pass
HTS
150 ℃
75 ea
LTS
-55 ℃
168 hr
77 ea
PRECON
Bake 125 ℃ (24 hr) Soak 35 ℃ / 60% (192 hr) Reflow 260 ℃ (3 cycle)
216 hr
225 ea
(UHAST+
TC+THB)
UHAST
130 ℃ / 85%
96 hr TC
125 ℃ / -55 ℃
1000 cycle
THB
85 ℃ / 85% / Vcc=Max.
ESD
HBM (2KV) -
9 ea
MM (200V)
CDM (800V)
3 ea
Latch-up

14. High Quality of Randomness
Satisfies with NIST SP800-90B test suit
NIST SP800-90b
Sample size : 1280-bit × 160 chips  204,800-bit + TRNG provided from NIST (recommended when test source is not enough for 1,000,000-bit sampling)
Test of IID
 PUF data pass all tests → The PUF data is IID
Min-entropy with the IID bins test :

15. (plan to complete May/’16)
Proven Technology
Status
Chip
PUF
Process
Process Completed
2,560-bit PUF Repeatability and Randomness are confirmed
2014 TSMC
0.18um
2014 Dongbu HiTek
0.13um
Fab-processing
(plan to complete May/’16)
2,560-bit PUF Repeatability and Randomness will be checked
2015 Samsung
65 nm

16. Patent Patent Registered : 30 (US, EU, Korea, China, Taiwan)
Patent Pending : 85 (US, EU, Korea, China, Japan, Taiwan)
Finnegan Henderson LLP(DC) as ICTK’s patent prosecution
partner since 2012 for US & EU
Patent portfolio includes PUF designs, processing,
optimization, application, system, etc.
Finnegan Henderson LLP(DC) as ICTK’s patent prosecution
partner since 2012 for US & EU
Patent portfolio includes PUF designs, processing,
optimization, application, system, etc.

17. Basic Applications of PUF ?
Secure ID
Secure Private KEY in PKI system
Secure Memory
Data encryption by VIA PUF key

18. Secure ID Direct & indirect ID No risk of cloning
Direct ID : use VIA PUF itself as unique ID
Indirect ID : Inject ID & store by “Secure Memory” concept More common to use
No risk of cloning
ID card, passport, Driver license, Drone ID etc..

19. Secure Private Key Provides secure Private Key in PKI system
VIA PUF works with various crypto engines
Secure FINTECH
Certificate
OTP
U2F
2nd factor authentication
IoT
Sensor/ Gateway
Wearable
Device
SmartCard
2nd Factor
Authentication

20. Secure Memory Store the data in NVM with encryption by VIA PUF Key.
Then the VIA PUF Key is demolished, not store in NVM
Re-generate the VIA PUF Key for decryption
Free from hacking
Giant
NVM
Plain data
Crypto Keys
Control Logic
Serial Number
Cipher data
User Data
Crypto engine
Counter
VIA PUF Key
VIA PUF
KDF
etc..

21. ICTK Technology PUF Crypto Engines AES RSA ECC SHA
All tested in silicon as hardware format
LEA or others available upon request
Any configurations open to discuss

22. Product Planning HAWK ??? Giant II ??? Giant 2015 2016 2017
VIA PUF+AES+ECC
Q4 ‘16
???
Giant II
VIA PUF+SHA+NFC
Q3 ‘16
???
Giant
VIA PUF+SHA
Q2 ‘16
2015
2016
2017

23. Applications of Giant series

24. (PUF-encrypted Memory)
Giant
Authentication IC based on VIA PUF
Key features
VIA PUF based key generation
HASH based MAC(Message Authentication Code)
SHA 256
Security countermeasure
Fault injection & Side channel Attack
Applications
Anti-counterfeit
Smartphone Accessories, Smartphone battery
Printer cartridge
E-Cigarett cartridge
M2M authentication
Secure boot / Firmware protection
IP protection
IoT end node authentication
Drone ID
Sample May/’16
E2PROM
(PUF-encrypted Memory)
Giant
SHA2
VIA PUF
Control Logic
I2C/SWI

25. Anti-Counterfeit Off-Line
Utilize “Secure Memory” concept
Install Giant in the “Target Product” to authenticate & “Master”
Enroll “Target Product” before ship out
In the field, “Master and Target Products” authenticate each other
Example : Smartphone Accessary, Smartphone Battery, Printer Ink Cartridge, E-Cig Cartridge, Drone, etc..
Giant
Target product to authenticate
Giant
PUF-encrypted Memory
KeyTarget
SHA2
PUF
User Data
Target
Product
SHA2
MCU
PUF
PUF-encrypted Memory
KeyMaster
User Data
Master

26. Anti-Counterfeit On-Line
Utilize “Secure Memory” concept
Install Giant & NFC tag chip in the “Target Product” to authenticate
Enroll “Target Product” before ship out
In the field, “Target Product” authenticate through smartphone by linking server.
Example : Luxury products(Handbag/Clothes/Liquor/Watch), E-Cig e-liquid, Cosmetics, Medicine, etc..
Additional advantages
Distribution channel & logistics management
Big data collection from users
PUF-encrypted Memory
KeyTarget
SHA2
PUF
User Data
Target
Product
NFC
Giant II
Authenticate
Authenticate
Server
Smartphone
Target product to authenticate

27. Simplified IoT Network Security
Standard to use X.509
No standard specified
Requires security in reality
Giant
PUF based security chip
Secured M2M authentication
Economical engineering

28. WinLink Co., Ltd. Contact : Ricky Kwak / 곽민호
Link to Win….
With you!
WinLink Co., Ltd. Contact : Ricky Kwak / 곽민호
Tel : Fax : Mobile :