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Non-Traditional Machining Electron Beam Machining & Laser Beam Machining.

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Presentation on theme: "Non-Traditional Machining Electron Beam Machining & Laser Beam Machining."— Presentation transcript:

1 Non-Traditional Machining Electron Beam Machining & Laser Beam Machining

2 EBM-Gun vaccum Cathode(W/Tantalu m)-filament[2500 C] High voltage supply Bias grid “-vely” Anode Magnetic lens Aperture Electro magnetic lens Work piece Deflector coils IlluminationTelescope Vaccum gauge port Diffusion pump Slotted disc

3 EBM- Modules of Electron Beam Gun Cathode cartridge-tungsten or tantalum High voltage supply Bias grid – ( pulsed) to get pulse mode operation Anode Magnetic Lens Aperture Electromagnetic coils deflector coils Lighting system & telescope for alignment Rotating slotted discs Vaccum pumps- diffusion pump

4 EBM – Mechanism of Material Removal Thermo-ionic electons Acceleration of electrons due to anode potential high velocity beam of electron shaping and focussing of the electron beam Impingment of high velocity electron beam on the work spot size 10-100 micron- high energy density Heating,melting & vaporisation Thermo-ionic electons Acceleration of electrons due to anode potential high velocity beam of electron shaping and focussing of the electron beam Impingment of high velocity electron beam on the work spot size 10-100 micron- high energy density Heating,melting & vaporisation

5 EBM – Mechanism of Material Removal  localised heating by focussed electron beam  gradual formation of hole by penetration of multi-vaporisation front  Penetration till auxiliary support  Expulsion of any molten material at the top by high vapour pressure of auxiliary material

6 EBM- Advantages Very high drilling rates when small holes with large ratio are to be drilled. Machine almost any material irrespective of their mechanical properties. applies no mechanical cutting force,work holding and fixturing cost is very less. Fragile and brittle materials can also be processed. Heat affected zone is rather less due to shorter pulses

7 EBM- Limitations high capital cost of the equipment and necessary regular maintenance applicable for any equipment using vaccum system. heat affected zone is rather less in EBM but recast layer formation cannot be avoided. non-productive pump down period for attaining desired vaccum. However this can be reduced to some extent using vaccum load locks.

8 LBM- Introduction  Laser- Light Amplification by stimulated Emission of Radiation  Albert Einstein – 1917  Industrial Laser – 1960s  Wavelength-0.5 to 70 micron  Power density – as high as 1 MW/mm2  Absorption of laser temperature  Rapid rise in temperature  Melting & evaporation  Material Removal

9 LBM- Working Principle of Laser  Spontaneous absorption  Spontaneous emission  Time duration – ns  Stimulated absorption  Meta-stable state of electron  Time duration- micro to ms  Population inversion

10 LBM- Spotaneous absorption & emission E0 E1 E1-E0=hv

11 Population inversion POPULATION INVERSION

12 LBM- working principle of laser

13 LBM- laser types and Lasing Medium Gas lasers - Helium – Neon - Argon - co2 etc. – wave length 10.6μm Solid State Lasers - Ruby which is chromium-aluminium alloy having a wavelength of 0.7 μm - Nd-glass lasers having a wavelength of 1.64 μm

14 LBM- solid state laser RUBY ROD

15 LBM- Gas laser

16 LBM – Mechanism of Material Removal  absorption of laser energy  Rapid rise in temperature  Melting and evaporation  Material removal  Gas assist

17 LBM - Application Material removal – drilling,cutting, trepanning welding alloying bending laser drilling- pulsed and continuous laser

18 LBM- advantages Micro-holes can be drilled in difficult-to- machine materials. though it is a thermalprocessing but heat affected zone specially in pulse laser processing is not very significant due to shorter pulse duration. There is no physical tool.

19 LBM - limitations  High initil capital cost  High maintenance cost  Not very efficient process  presence of heat affected zone-specially in gas assist co2 laser cutting  Thermal process- not suitable for heat sensitive materials

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