1. PK-1500 Technical data sheet
KOLON Central Research Park
Electronic Materials Research Institute

2. Minimum developing time (sec.)
General Properties
sst / 21sst
PK-1540
PK-1550
Minimum developing time (sec.) 24 29
Exposure Energy (mJ/cm2)
6 sst 12 13
7 sst 17 20
8 sst 22 27
9 sst 33 38
10 sst 47 55
Resolution (μm) 25 30 32 35 39 41 48
Adhesion (μm) 34 46 23
1/1 Resolution(μm) 45 28 40 29 13 19 25 37 53 27 33 38 34 30 26

3. Exposure Energy vs. Sensitivity
SST / 21SST
PK-1540
PK-1550
Exposure Energy
(mJ/cm2)
6 sst 12 13
7 sst 17 20
8 sst 22 27
9 sst 33 38
10 sst 47 55
Test Conditions
Test Artwork : KOLON Test Artwork(Glass Mask)
Lamination : 110 °C, 4kg/cm2, 2.0m/min
Exposure : 5Kw, collimated light
Development : 1.0wt% Na2CO3, Temp. 30 °C, Break Point 50%, Spray Pressure 1.5kg/cm2

4. Resolution SST / 21SST PK-1540 PK-1550 Resolution (um) Test Conditions25 30
7 sst 29 32
8 sst 33
9 sst 35 39
10 sst 41 48
Test Conditions
Test Artwork : KOLON Test Artwork(Glass Mask)
Lamination : 110 °C, 4kg/cm2, 2.0m/min
Exposure : 5Kw, collimated light
Development : 1.0wt% Na2CO3, Temp. 30 °C, Break Point 50%, Spray Pressure 1.5kg/cm2

5. Adhesion SST / 21SST PK-1540 PK-1550 Adhesion (um) Test Conditions34 46
7 sst 29 33
8 sst 25 32
9 sst 23 30
10 sst 20
Test Conditions
Test Artwork : KOLON Test Artwork(Glass Mask)
Lamination : 110 °C, 4kg/cm2, 2.0m/min
Exposure : 5Kw, collimated light
Development : 1.0wt% Na2CO3, Temp. 30 °C, Break Point 50%, Spray Pressure 1.5kg/cm2

6. 1/1 Resolution SST / 21SST PK-1540 PK-1550 1/1 Resolution (um)30 45
7 sst 28 38
8 sst 27 35
9 sst
10 sst 40
Test Conditions
Test Artwork : KOLON Test Artwork(Glass Mask)
Lamination : 110 °C, 4kg/cm2, 2.0m/min
Exposure : 5Kw, collimated light
Development : 1.0wt% Na2CO3, Temp. 30 °C, Break Point 50%, Spray Pressure 1.5kg/cm2

7. Stripping Properties SST / 21SST PK-1540 PK-1550 Stripping Properties
(sec., size)
NaOH 3.0 wt%
6 sst
35 M
49, MS
7 sst
37 ML
54, ML
8 sst
40 L
59, ML
9 sst
42 L
63, ML
10 sst
46 L
69, ML
Test Conditions
Pretreatment  Lamination  Exposure  Developing  Stripping
Stripping condition: 50oC, NaOH 3.0 wt%
Test method: Dipping Method
Stripped particle size: S (small, lower than 0.5cm), M (medium, 0.5~2cm), L (large, 2~5cm), LL (extra large, larger than 5cm)

8. SEM Images (Line/space = 40/40㎛, x400) (Line/space = 40/40㎛, x200)
PK-1540, 7sst /21sst
PK-1540, 8sst /21sst
PK-1540, 9sst /21sst
(Line/space = 40/40㎛, x200)
PK-1540, 7sst /21sst
PK-1540, 8sst /21sst
PK-1540, 9sst /21sst

9. SEM Images (Line/space = 50/50㎛, x350) (Line/space = 50/50㎛, x200)
PK-1550, 8sst /21sst
PK-1550, 9sst /21sst
PK-1550, 10sst /21sst
(Line/space = 50/50㎛, x200)
PK-1550, 8sst /21sst
PK-1550, 9sst /21sst
PK-1550, 10sst /21sst

10. Scum / Sludge Test <Sludge/Scum Test condition>
Defoamer(%)
Filtering Time (50ml)
Filtering Time (100ml)
Sludge Weight
(300ml filtering)
SCUM
PK-1540 NO
28 Sec.
57 Sec.
0.20 g
<Sludge/Scum Test condition>
Filter paper : ADVANTEC-5A
Filtering Time : Measuring after being filtered 50ml and 100ml
Sludge Weight : Measuring sludge weight after being filtered 300ml
Scum Generator : Running Time is 4hrs
temp: 30oC

11. Scum / Sludge Test 1. Test condition. 2. Test method.
* Scum & sludge test : Na2CO3 1.0 wt% , 300mL , DFR amount 1㎡/L , 30℃, 300rpm
2. Test method.
Immerse 1 m2/L of
DFR to 1.0 wt% of
developing solution(Na2CO3)
Mechanical Stirring for 1 hrs
Under yellow room
Homo-mixer Stirring for 4 hrs
(RPM : 3000, Temp : 30℃)
After holding 1day,
Check the sludge
Occurred &
Filtering test

12. General Process Guideline
Best Condition
Recommendation
Specification
Lamination
Roll Temp. (°C)
110
110 ± 10
Exit Temp.: 50  10 °C
Speed (m/min)
2.0
2.0 ± 1.0
Roll Pressure (Kgf/cm2)
4.0
3.5 ± 1.5
Holding Time
Time (min)
15min~4hrs
15min – 8hrs
Under Yellow Light
Exposure
Exposure Energy (mJ/cm2)
Step Held
8/21ST
7~9/21ST
Without Artwork
Resist Step
1hrs
15min – 24hrs
Development
Chemical
1.0wt%
1.0 ± 0.2wt% Na2CO3 -
Temp. (°C) 30
30 ± 2
Break Point
50%
50~70%
Spray Pressure (Kgf/cm2)
2.0 ± 0.5
Stripping 3
2 - 4wt% NaOH 50
45-55
40~60%
* Clean Room: 20~22 °C, 50 ± 10 % RH