1. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 (a) No-flow underfill voiding for organic acid-based fluxes and (b) their reaction with oxirane of epoxy resins Figure Legend:

2. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 Typical micrographs of C-SAM analysis: (a) failed part in electrical interconnection and (b) yielded part in electrical interconnection Figure Legend:

3. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 A typical test vehicle in void formation study: (a) schematic illustrations of TV-1 and TV-2, (b) TV-1 without solder before heating, and (c) TV-2 with solder bumps before heating Figure Legend:

4. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 Typical micrographs of void formation study: (a) TV-1 without solder after heating and (b) TV-2 with solder bumps after heating Figure Legend:

5. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 DSC measured heat flow diagrams of sample A (without solders) and sample B (with solders) Figure Legend:

6. Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron. Packag. 2009;131(3):031014-031014-5. doi:10.1115/1.3153369 Spectrums of evolved gases in underfill reflow process with eutectic solders and without eutectic solders using GC-MS Figure Legend: