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STT-RAM Circuit Design

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Presentation on theme: "STT-RAM Circuit Design"— Presentation transcript:

1 STT-RAM Circuit Design
Max IWRITE (Recap), MTJ Sharing Paper

2 Max IWRITE for I-STT (IBM65)
Cell Sizing Max IWRITE for I-STT (IBM65)

3 I-STT MTJ Specs (Jianping)
For 1ns switching: RP ≈ 500Ω TMR ≈ 120% AP→P: μA P→AP: μA IWRITE(P→AP)/IWRITE(AP→P): 1.5-2 IREAD,MAX: If both the read and write pulses are on the order of a few ns, then IREAD/IWRITE ≈ 2/3. We can share access transistors! (MAYBE) Limiting factor in MTJ sharing is TMR degradation

4 Minimum Cell Size (NN Corner)
VBS = -0.25V Nominal 37–45.5F2 LVT 33–40F2 VBS = 0.00V Nominal 36–44F2 LVT 32.5–39.5F2

5 Maximum Write Currents
2 Cases: VDD = 1V, WL = 1V Nominal voltages specified in documentation VDD & VWL is boosted (while keeping VDS, VGS < 1V) Different VBL & VSL used to write “1” & “0” IWRITE(P→AP)/IWRITE(AP→P): 1.5-2 Example: VWL = 1.10V VBL<1> = 0.00V VSL<1> = 1.10V VBL<2> = 0.10V VSL<2> = 1.40V IWRITE: AP→P = 335μA P→AP = 670μA RAP WL<N> SL<1> BL<1> IWRITE (AP→P) RP WL<N> BL<2> SL<2> IWRITE (P→AP)

6 Simulation Results (P→AP)
MTJ Specs: RP = 500Ω TMR = 120% IWRITE (P->AP) [μA] NOMINAL VT 25F2: VWL = 1.00V, VSL = 0.00V, VBL = 1.20V 35F2: VWL = 1.10V, VSL = 0.10V, VBL = 1.35V 50F2: VWL = 1.25V, VSL = 0.25V, VBL = 1.65V LOW VT 35F2: VWL = 1.10V, VSL = 0.10V, VBL = 1.40V 50F2: VWL = 1.30V, VSL = 0.30V, VBL = 1.80V SL/BL = 1V WL = 1V SL/BL | (VDS < 1V) WL | (VGS < 1V) NOMINAL VT LOW VT SS NN FF 25F2 280.2 327.2 380.3 333.9 378.5 427.4 294.5 345.4 404.3 350.0 398.6 453.3 35F2 473.4 537.3 607.4 561.0 621.2 684.7 495.9 569.0 653.2 599.2 670.0 748.8 50F2 739.7 820.5 906.0 867.4 940.9 1015 787.8 894.1 1018 964.4 1068 1183

7 Simulation Results (AP→P)
MTJ Specs: RP = 500Ω TMR = 120% IWRITE (AP->P) [μA] NOMINAL VT 25F2: VWL = 1.00V, VSL = 1.00V, VBL = 0.00V 35F2: VWL = 1.10V, VSL = 1.10V, VBL = 0.00V 50F2: VWL = 1.25V, VSL = 1.25V, VBL = 0.00V LOW VT 50F2: VWL = 1.30V, VSL = 1.30V, VBL = 0.00V SL/BL = 1V WL = 1V SL/BL | (VDS < 1V) WL | (VGS < 1V) NOMINAL VT LOW VT SS NN FF 25F2 164.3 187.1 212.7 197.8 219.8 243.2 35F2 217.1 240.8 267.3 260.6 283.4 307.1 263.5 289.2 318.2 308.7 333.2 358.9 50F2 264 287.9 315.2 338.0 361.9 402.6 431.2 464.5 488.5 515.9 545.2

8 Summary Maximum IWRITE (LVT, FF) (P→AP) : 25F2: 453.3μA 35F2: 748.8μA
Maximum IWRITE (LVT, FF) (AP→P) : 25F2: 243.2μA 35F2: 358.9μA 50F2: 545.2μA 35F2 LVT cell almost meets I-STT specs for 1ns switching AP→P current a little weak (can be adjusted a little higher) 38-40F2 LVT cell w/ boosted voltages can safely meet Jianping’s spec for 1ns switching

9 TMR Degradation (Reading)
MTJ Sharing TMR Degradation (Reading)

10 Parasitic Parallel Resistance
TMR Degradation MTJ1,1 WL<1> MTJ1,2 MTJ1,M SL BL<1> BL<2> BL<M> MTJ2,1 WL<2> MTJ2,2 MTJ2,M MTJN,1 WL<N> MTJN,2 MTJN,M Parasitic Parallel Resistance Parallel Resistance (R||) degrades TMR

11 Effective RP and RAP Worst case TMR’: largest RP’ and smallest RAP’

12 Effective TMR (1) Putting it all together: Example 1kbit Arrays:
TMR = 120%, M = 2, N = 16, 32-bit words: TMR’ = 4.8% TMR = 120%, M = 2, N = 8, 64-bit words: TMR’ = 9.8% TMR = 120%, M = 2, N = 4, 128-bit words: TMR’ = 20.7%

13 TMR’ vs. N for 1T-2MTJ (M = 2)

14 TMR’ vs. N for 1T-3MTJ (M = 3)

15 Monte Carlo Simulations (1)
Limited to M = 2 Theoretical TMR’ is overly pessimistic With error correction we can let the extreme cases fail. Example: Bit read error = 0.1% Word length = 64 # error correcting bits = 4 Probability of a word error: 1 in 137,763,712 reads M = 2, N = 4 TMR = 120%, RP = 500Ω 25k Simulations Worst Case TMR’ Theoretical = 20.7% Simulation = 46.2%

16 Monte Carlo Simulations (2)
M = 2, N = 8 TMR = 120%, RP = 500Ω 25k Simulations Worst Case TMR’ Theoretical = 9.8% Simulation = 20.7% M = 2, N = 16 TMR = 120%, RP = 500Ω 25k Simulations Worst Case TMR’ Theoretical = 4.8% Simulation = 10.1%

17 Device IREAD/IWRITE Requirements (Writing)
MTJ Sharing Device IREAD/IWRITE Requirements (Writing)

18 Defining IREAD,MAX & IWRITE,MIN
IREAD,MAX: The maximum read current such that the probability of flipping the MTJ is less than some ε (i.e. ε = 0.1% → IREAD,MAX = 200μA) IWRITE,MIN: The minimum write current such that the probability of failing to flip the MTJ is less than some ξ (i.e. ξ = 0.1% → IWRITE,MIN = 600μA)

19 IREAD/IWRITE for 1T-2MTJ (1)
Limited to 1T-2MTJ architecture WL<1> WL<2> BL<1> BL<2> IWRITE,MIN α∙IREAD,MAX

20 IREAD/IWRITE for 1T-2MTJ (2)
RP Case 1: RAP Case 1: “1” “0” RP “1” “0” RAP RP RP Case 2: RAP Case 2: “1” “0” RP RAP “1” “0” RAP RP

21 IREAD/IWRITE vs. TMR

22 SUMMARY Cell Sizing: 35-40F2 TMR Degradation: M = 2 (READING)
Word length should be greater than 64 Serious TMR degradation for N > 8 Ideally: RP = 500Ω, TMR = 120% M = 2, N = 4 → 1kbit arrays of 128-bit words TMR’ = 20.7% Reality: TMR’ ≈ 45% (ignoring worst case) Need less than 8 error correcting bits IREAD/IWRITE (WRITING) For TMR = 120%, χ = 1.5-2: IREAD/IWRITE >


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