1. B. Michel Page 1 Fraunhofer ENAS Micro Materials Center Chemnitz B. Michel, E. Auerswald Fraunhofer ENAS Micro Materials Center Chemnitz und Berlin Neue Trends der Forschung zu modernen Bruchkonzepten angewendet auf Polymerwerkstoffe

2. B. Michel Page 2 Fraunhofer ENAS Micro Materials Center Chemnitz PD / TIA FLASCH RAM µPµP CMOS / SOC MEMSDFB / TE RF / IC Solder Fatigue Stress-induced Birefringence Board Warpage Interfacial Delamination Dielectric Cracking Via Cracking Potential Failure Mechanisms in SOP (System-on-Package) Microsystems Change in Capacitance due to Stress/Strain

3. B. Michel Page 3 Fraunhofer ENAS Micro Materials Center Chemnitz O

4. B. Michel Page 4 Fraunhofer ENAS Micro Materials Center Chemnitz

5. B. Michel Page 5 Fraunhofer ENAS Micro Materials Center Chemnitz

6. B. Michel Page 6 Fraunhofer ENAS Micro Materials Center Chemnitz

7. B. Michel Page 7 Fraunhofer ENAS Micro Materials Center Chemnitz

8. B. Michel Page 8 Fraunhofer ENAS Micro Materials Center Chemnitz Advanced Reliability Testing Methods 1. MicroDAC/NanoDAC/FIBDAC 2. Lock-in Thermography 3. Complex-Cycling Units (humidity, temperature, vibration etc) 4. Humidity- sensitive SPM (moisture AFM…) 5. Acoustic AFAM, Acoustomicroscopy..6. EBSD 7. Micro Moire Testing and und various Laser Testing Methods 8. DMA, TMA und related mechanical testing devices 9. Special-x-Ray Testing (energy dispersive self stress analysis).) 10. Micro/Nano Tomography (Nanotom) 11. Nano-Raman, Micro Raman Stress Analysis 12. Thermo-electrical Testing combined with Deformation Analysis

9. B. Michel Page 9 Fraunhofer ENAS Micro Materials Center Chemnitz Field Coupling Continuum Mechanics – Temperature Field – Electromagnetic Filed ( + Diffusion, Chemical Composition, … ) Field Quantities 49 E i - electric field strength D i - electric flux vector J i el - electric current P i - polarization M i - magnetization p i - momentum vector L i - moment of momentum m- mass U i - displacement vector  ij - stress tensor (not symmetric !!!) m ij - tensor of internal moments E- energy density S- entropy J i (th) - heat flux T- temperature field J i (c) - diffusion current (density) C n - concentration of material n    15 electromagnetic 28 mechanical 6 thermodynamic

10. B. Michel Page 10 Fraunhofer ENAS Micro Materials Center Chemnitz Erweiterung C j (x i, t) - Konzentrationsmaße ∑ i,j freie Enthalpie Erweiterungen: Nichtlinearitäten (z. B. el. - pl.) irreversible Vorgänge (Nichtgleichgewichts–Kontinuumsthermodynamik) Chemie, Stofftransport, Mehrkomponenten-Systeme ( )  E  N j v,s chem. Potential  j =,  G  N j I,T dG = G ij d  ij + Vdp – SdT + H  dM + E  dP +  K dN K ∑ k

11. B. Michel Page 11 Fraunhofer ENAS Micro Materials Center Chemnitz

12. B. Michel Page 12 Fraunhofer ENAS Micro Materials Center Chemnitz Thermal Misfit in thin interfaces layers

13. B. Michel Page 13 Fraunhofer ENAS Micro Materials Center Chemnitz

14. B. Michel Page 14 Fraunhofer ENAS Micro Materials Center Chemnitz

15. B. Michel Page 15 Fraunhofer ENAS Micro Materials Center Chemnitz Delaminierte Gebiet der Glob-Top-Abdeckmasse zum Chip SAM THRU-Scan- Mode

16. B. Michel Page 16 Fraunhofer ENAS Micro Materials Center Chemnitz

17. B. Michel Page 17 Fraunhofer ENAS Micro Materials Center Chemnitz Integral Concepts in Nonlinear Fracture Mechanics

18. B. Michel Page 18 Fraunhofer ENAS Micro Materials Center Chemnitz

19. B. Michel Page 19 Fraunhofer ENAS Micro Materials Center Chemnitz Integralkonzepte II 1992 BITTENCOURT et alModified Crack Closure Integral 1998HUANG et alGeneralized HRR Concept 1998SCHERZERElectro-Mechanics Crack Concept 1998NEWMAN et alMerger of Fatigue and Crack Concepts 1998IKEDA et alMixed Mode Generalized Contour Integral 2001RAO, RAHMAN et alGeneralized Probabilistic Fracture Concept 2002WALLIN et alEuro Toughness Fracture Concept 2005AUERSPERG et alInterface Fracture Concepts for Micro- Nano Transition Region, Generalized Cohesive Zone Models etc.

20. B. Michel Page 20 Fraunhofer ENAS Micro Materials Center Chemnitz Temperature Range: -80°C to 250°C Heating Rate: 6 K/min from RT to 180°C Cooling Rate: 4 K/min from RT to -50°C Temperature Range: RT to 500°C Transfer Time < 60 s K. Kreyßig

21. B. Michel Page 21 Fraunhofer ENAS Micro Materials Center Chemnitz The New Platform with different Modules TIMA-Platform Testing of adhesive TIMs Testing of non-adhesive TIMs High accuracy testing Testing of highly conductive TIMs Reliability testing of TIMs Costumer specific modules

22. B. Michel Page 22 Fraunhofer ENAS Micro Materials Center Chemnitz

23. B. Michel Page 23 Fraunhofer ENAS Micro Materials Center Chemnitz

24. B. Michel Page 24 Fraunhofer ENAS Micro Materials Center Chemnitz

25. B. Michel Page 25 Fraunhofer ENAS Micro Materials Center Chemnitz fibDAC – Deformation Analyse by means of DIC (Digital Image Correlation) Metallic Glas K. Vogel Prof. Gessner Yao-Chuan Tsai Yu-Ching Lin Esashi Masayoshi

26. B. Michel Page 26 Fraunhofer ENAS Micro Materials Center Chemnitz Zycle Tests under the Earth Standort: St.-Anna-Fundgrube zu Wolkenburg