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PART 3: (2/2) Computer Memory System CHAPTER 5: Internal Memoryand CHAPTER 6: External Memory 1.

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Presentation on theme: "PART 3: (2/2) Computer Memory System CHAPTER 5: Internal Memoryand CHAPTER 6: External Memory 1."— Presentation transcript:

1 PART 3: (2/2) Computer Memory System CHAPTER 5: Internal Memoryand CHAPTER 6: External Memory 1

2 2 CHAPTER 5: Internal Memory

3 Semiconductor Memory Types Memory TypeCategoryErasureWrite MechanismVolatility Random-access memory (RAM) Read-write memoryElectrically, byte-levelElectricallyVolatile Read-only memory (ROM) Read-only memoryNot possible Masks Nonvolatile Programmable ROM (PROM) Electrically Erasable PROM (EPROM) Read-mostly memory UV light, chip-level Electrically Erasable PROM (EEPROM) Electrically, byte-level Flash memoryElectrically, block-level 3

4 Semiconductor Memory 4 RAM – Misnamed as all semiconductor memory is random access – Read/Write – Volatile – Temporary storage – Static or dynamic

5 Memory Cell Operation 5

6 Dynamic RAM Bits stored as charge in capacitors Charges leak Need refreshing even when powered Simpler construction Smaller per bit Less expensive Need refresh circuits Slower Main memory Essentially analogue – Level of charge determines value 6

7 Dynamic RAM Structure 7

8 DRAM Operation Address line active when bit read or written – Transistor switch closed (current flows) Write – Voltage to bit line High for 1 low for 0 – Then signal address line Transfers charge to capacitor Read – Address line selected transistor turns on – Charge from capacitor fed via bit line to sense amplifier Compares with reference value to determine 0 or 1 – Capacitor charge must be restored 8

9 Static RAM Bits stored as on/off switches No charges to leak No refreshing needed when powered More complex construction Larger per bit More expensive Does not need refresh circuits Faster Cache Digital – Uses flip-flops 9

10 Stating RAM Structure 10

11 Static RAM Operation Transistor arrangement gives stable logic state State 1 – C 1 high, C 2 low – T 1 T 4 off, T 2 T 3 on State 0 – C 2 high, C 1 low – T 2 T 3 off, T 1 T 4 on Address line transistors T 5 T 6 is switch Write – apply value to B & compliment to B Read – value is on line B 11

12 SRAM v DRAM(1/2) Both volatile – Power needed to preserve data Dynamic cell – Simpler to build, smaller – More dense – Less expensive – Needs refresh – Larger memory units Static – Faster – Cache 12

13 13 SRAM v DRAM(2/2)

14 Read Only Memory (ROM) Permanent storage – Nonvolatile Microprogramming Library subroutines Systems programs (BIOS) Function tables 14

15 Types of ROM 15 Written during manufacture – Very expensive for small runs Programmable (once) – PROM – Needs special equipment to program Read “mostly” – Erasable Programmable (EPROM) Erased by UV – Electrically Erasable (EEPROM) Takes much longer to write than read – Flash memory Erase whole memory electrically

16 16 Their Usages………

17 Organisation in detail A 16Mbit chip can be organised as 1M of 16 bit words A bit per chip system has 16 lots of 1Mbit chip with bit 1 of each word in chip 1 and so on A 16Mbit chip can be organised as a 2048 x 2048 x 4bit array – Reduces number of address pins Multiplex row address and column address 11 pins to address (2 11 =2048) Adding one more pin doubles range of values so x4 capacity 17

18 Refreshing Refresh circuit included on chip Disable chip Count through rows Read & Write back Takes time Slows down apparent performance 18

19 Typical 16 Mb DRAM (4M x 4) 19

20 Packaging 20

21 256kByte Module Organisation 21

22 1MByte Module Organisation 22

23 Interleaved Memory Collection of DRAM chips Grouped into memory bank Banks independently service read or write requests K banks can service k requests simultaneously 23

24 Error Correction Hard Failure – Permanent defect Soft Error – Random, non-destructive – No permanent damage to memory Detected using Hamming error correcting code 24

25 Error Correcting Code Function 25

26 26 Hamming Code 6

27 27 P1 P2 1 P4 1 0 0 P8 0 1 0 0

28 28 P1 P2 1 P4 1 0 0 P8 0 1 0 0

29 Advanced DRAM Organization Basic DRAM same since first RAM chips Enhanced DRAM – Contains small SRAM as well – SRAM holds last line read (c.f. Cache!) Cache DRAM – Larger SRAM component – Use as cache or serial buffer 29

30 Synchronous DRAM (SDRAM) Access is synchronized with an external clock Address is presented to RAM RAM finds data (CPU waits in conventional DRAM) Since SDRAM moves data in time with system clock, CPU knows when data will be ready CPU does not have to wait, it can do something else Burst mode allows SDRAM to set up stream of data and fire it out in block DDR-SDRAM (double data rate) sends data twice per clock cycle (leading & trailing edge) 30

31 31 SDRAM

32 SDRAM Read Timing 32

33 RAMBUS Adopted by Intel for Pentium & Itanium Main competitor to SDRAM Vertical package – all pins on one side Data exchange over 28 wires < 12 cm long Bus addresses up to 320 RDRAM chips at 1.6Gbps Asynchronous block protocol – 480ns access time – Then 1.6 Gbps 33

34 RAMBUS Diagram 34

35 DDR SDRAM SDRAM can only send data once per clock Double-data-rate SDRAM can send data twice per clock cycle – Rising edge and falling edge 35

36 DDR SDRAM Read Timing 36

37 Simplified DRAM Read Timing 37

38 Cache DRAM Mitsubishi Integrates small SRAM cache (16 kb) onto generic DRAM chip Used as true cache – 64-bit lines – Effective for ordinary random access To support serial access of block of data – E.g. refresh bit-mapped screen CDRAM can Pre-fetch data from DRAM into SRAM buffer Subsequent accesses solely to SRAM 38

39 39

40 40

41 CHAPTER 6: External Memory 41

42 Types of External Memory Magnetic Disk – RAID – Removable Optical Discs – CD-ROM – CD-Recordable (CD-R) – CD-R/W – DVD Magnetic Tape 42

43 Magnetic Disk Disk substrate coated with magnetisable material (iron oxide…rust) Substrate used to be aluminium Now glass – Improved surface uniformity Increases reliability – Reduction in surface defects Reduced read/write errors – Lower flight heights (See later) – Better stiffness – Better shock/damage resistance 43

44 Read and Write Mechanisms Recording & retrieval via conductive coil called a head May be single read/write head or separate ones During read/write, head is stationary, platter rotates Write – Current through coil produces magnetic field – Pulses sent to head – Magnetic pattern recorded on surface below Read (traditional) – Magnetic field moving relative to coil produces current – Coil is the same for read and write Read (contemporary) – Separate read head, close to write head – Partially shielded magneto resistive (MR) sensor – Electrical resistance depends on direction of magnetic field – High frequency operation Higher storage density and speed 44

45 Inductive Write MR Read 45

46 Data Organization and Formatting Concentric rings or tracks – Gaps between tracks – Reduce gap to increase capacity – Same number of bits per track (variable packing density) – Constant angular velocity Tracks divided into sectors Minimum block size is one sector May have more than one sector per block 46

47 Disk Data Layout 47

48 Disk Velocity Bit near centre of rotating disk passes fixed point slower than bit on outside of disk Increase spacing between bits in different tracks Rotate disk at constant angular velocity (CAV) – Gives pie shaped sectors and concentric tracks – Individual tracks and sectors addressable – Move head to given track and wait for given sector – Waste of space on outer tracks Lower data density Can use zones to increase capacity – Each zone has fixed bits per track – More complex circuitry 48

49 Disk Layout Methods Diagram 49

50 Finding Sectors Must be able to identify start of track and sector Format disk – Additional information not available to user – Marks tracks and sectors 50

51 Winchester Disk Format Seagate ST506 51

52 Characteristics Fixed (rare) or movable head Removable or fixed Single or double (usually) sided Single or multiple platter Head mechanism – Contact (Floppy) – Fixed gap – Flying (Winchester) 52

53 Fixed/Movable Head Disk Fixed head – One read write head per track – Heads mounted on fixed ridged arm Movable head – One read write head per side – Mounted on a movable arm 53

54 Removable or Not Removable disk – Can be removed from drive and replaced with another disk – Provides unlimited storage capacity – Easy data transfer between systems Non removable disk – Permanently mounted in the drive 54

55 Multiple Platter One head per side Heads are joined and aligned Aligned tracks on each platter form cylinders Data is striped by cylinder – reduces head movement – Increases speed (transfer rate) 55

56 Multiple Platters 56

57 Tracks and Cylinders 57

58 Floppy Disk 8”, 5.25”, 3.5” Small capacity – Up to 1.44Mbyte (2.88M never popular) Slow Universal Cheap Obsolete? 58

59 Winchester Hard Disk (1/2) Developed by IBM in Winchester (USA) Sealed unit One or more platters (disks) Heads fly on boundary layer of air as disk spins Very small head to disk gap Getting more robust 59

60 Winchester Hard Disk (2/2) Universal Cheap Fastest external storage Getting larger all the time – 250 Gigabyte now easily available 60

61 Speed Seek time – Moving head to correct track (Rotational) latency – Waiting for data to rotate under head Access time = Seek + Latency Transfer rate 61

62 Timing of Disk I/O Transfer 62

63 63

64 RAID Redundant Array of Independent Disks Redundant Array of Inexpensive Disks (Originally) 6 levels in common use Not a hierarchy Set of physical disks viewed as single logical drive by O/S Data distributed across physical drives Can use redundant capacity to store parity information 64

65 RAID 0 No redundancy Data striped across all disks Round Robin striping Increase speed – Multiple data requests probably not on same disk – Disks seek in parallel – A set of data is likely to be striped across multiple disks 65

66 66

67 Data Mapping For RAID 0 67

68 RAID 1 Mirrored Disks Data is striped across disks 2 copies of each stripe on separate disks Read from either Write to both Recovery is simple – Swap faulty disk & re-mirror – No down time Expensive 68

69 69 RAID 1

70 RAID 2 Disks are synchronized Very small stripes – Often single byte/word Error correction calculated across corresponding bits on disks Multiple parity disks store Hamming code error correction in corresponding positions Lots of redundancy – Expensive – Not used 70

71 71 RAID 2

72 RAID 3 Similar to RAID 2 Only one redundant disk, no matter how large the array Simple parity bit for each set of corresponding bits Data on failed drive can be reconstructed from surviving data and parity info Very high transfer rates 72

73 73 RAID 3

74 RAID 4 Each disk operates independently Good for high I/O request rate Large stripes Bit by bit parity calculated across stripes on each disk Parity stored on parity disk 74

75 75 RAID 4

76 RAID 5 Like RAID 4 Parity striped across all disks Round robin allocation for parity stripe Avoids RAID 4 bottleneck at parity disk Commonly used in network servers N.B. DOES NOT MEAN 5 DISKS!!!!! 76

77 77 RAID 5

78 RAID 6 Two parity calculations Stored in separate blocks on different disks User requirement of N disks needs N+2 High data availability – Three disks need to fail for data loss – Significant write penalty 78

79 79 RAID 6

80 Optical Storage CD-ROM Originally for audio 650Mbytes giving over 70 minutes audio Polycarbonate coated with highly reflective coat, usually aluminium Data stored as pits Read by reflecting laser Constant packing density Constant linear velocity 80

81 CD Operation 81

82 CD-ROM Drive Speeds Audio is single speed – Constant linier velocity – 1.2 ms -1 – Track (spiral) is 5.27km long – Gives 4391 seconds = 73.2 minutes Other speeds are quoted as multiples e.g. 24x Quoted figure is maximum drive can achieve 82

83 CD-ROM Format Mode 0=blank data field Mode 1=2048 byte data+error correction Mode 2=2336 byte data 83

84 Random Access on CD-ROM Difficult Move head to rough position Set correct speed Read address Adjust to required location (Yawn!) 84

85 CD-ROM for & against Large capacity (?) Easy to mass produce Removable Robust Expensive for small runs Slow Read only 85

86 Other Optical Storage CD-Recordable (CD-R) – WORM – Now affordable – Compatible with CD-ROM drives CD-RW – Erasable – Getting cheaper – Mostly CD-ROM drive compatible – Phase change Material has two different reflectivities in different phase states 86

87 DVD - what’s in a name? Digital Video Disk – Used to indicate a player for movies Only plays video disks Digital Versatile Disk – Used to indicate a computer drive Will read computer disks and play video disks Dogs Veritable Dinner Officially - nothing!!! 87

88 DVD - technology Multi-layer Very high capacity (4.7G per layer) Full length movie on single disk – Using MPEG compression Finally standardized (honest!) Movies carry regional coding Players only play correct region films Can be “fixed” 88

89 DVD – Writable Loads of trouble with standards First generation DVD drives may not read first generation DVD-W disks First generation DVD drives may not read CD- RW disks Wait for it to settle down before buying! 89

90 CD and DVD 90

91 High Definition Optical Disks Designed for high definition videos Much higher capacity than DVD – Shorter wavelength laser Blue-violet range – Smaller pits HD-DVD – 15GB single side single layer Blue-ray – Data layer closer to laser Tighter focus, less distortion, smaller pits – 25GB on single layer – Available read only (BD-ROM), Recordable once (BR-R) and re-recordable (BR-RE) 91

92 Optical Memory Characteristics 92

93 Magnetic Tape Serial access Slow Very cheap Backup and archive Linear Tape-Open (LTO) Tape Drives – Developed late 1990s – Open source alternative to proprietary tape systems 93

94 Linear Tape-Open (LTO) Tape Drives LTO-1LTO-2LTO-3LTO-4LTO-5LTO-6 Release date2000200320052007TBA Compressed capacity200 GB400 GB800 GB1600 GB3.2 TB6.4 TB Compressed transfer rate (MB/s) 4080160240360540 Linear density (bits/mm)48807398963813300 Tape tracks384512704896 Tape length609 m 680 m820 m Tape width (cm)1.27 Write elements8816

95 Let's go through processing unit


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