Monday June 8, 2009CALICE SiW ECAL Meeting ULC London EUDET prototype Thermal drain and plans for module assembly Julien Bonis CAD model.

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Presentation transcript:

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London EUDET prototype Thermal drain and plans for module assembly Julien Bonis CAD model of demonstrator SLAB ASU/drain thermal junction Thermal test SLAB Physical short model Assembly and insertion equipments Facilities

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London CAD model of Demonstrator Slab

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London H composite with Tungsten Kapton Kapton are glue on H

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Adapt and Diff ASU For EUDET : Wafer glue on Kapton for electrical junction

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Wedge Thermal gel pad

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Copper drain Drains are keep flat by an equipement

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Copper Tape

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Copper drain are cutting to follow thickness variation of adapt and diff card

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Tape effort Reaction load of thermal gel pads

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Ensemble demo ASU and curve copper drain

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Thermal gel pad and wedges on ASU Thermal gel pad wedge (Thermal conductivity = 1.5 w/m.K)

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Thermal Slab before drain clamping

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Thermal Slab clamping

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Clamped thermal Slab

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Pad mark on drain after disassembly of Slab Pad mark

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Kapton, demo ASU, thermal pads and wedges on model Kapton ASU Thermal gel pad Wedge

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Curve copper drain with copper tape

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Physical short demostartor Slab model Aluminium « H » model

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Equipements Suction pads manipulation equipement for ASU ensemble Suction pads ASU Demo Asu assembly bench

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Suction pads manipulation equipement for ASU ensemble Suction pad ASU Support plate

Monday June 8, 2009CALICE SiW ECAL Meeting ULC London Under study Curve copper drain in flate keeping position manipulator. Tape fitter. Eudet ASU assembly bench. Optimized curve of copper drain. Module insertion equipement. Conductive glue deposit equipement (Wafer/HT Kapton) Facilities –EUDET grey assembly room –Storage and transport box –Cosmic bench Demo Slab expected end of june