EE105 - Spring 2007 Microelectronic Devices and Circuits

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Presentation transcript:

EE105 - Spring 2007 Microelectronic Devices and Circuits Lecture 2 Semiconductor Basics

Periodic Table of Elements

Electronic Properties of Silicon Silicon is in Group IV (atomic number 14) Atom electronic structure: 1s22s22p63s23p2 Crystal electronic structure: 1s22s22p63(sp)4 Diamond lattice, with 0.235 nm bond length Very poor conductor at room temperature: why? (2p)6 (1s)2 (2s)2 (3sp)4 Hybridized State

The Diamond Structure 3sp Tetrahedral Bond

States of an Atom Energy E1 E2 . E3 Allowed Energy Levels Lattice Constant Atomic Spacing Forbidden Band Gap Quantum Mechanics: The allowed energy levels for an atom are discrete (2 electrons with opposite spin can occupy a state) When atoms are brought into close contact, these energy levels split If there are a large number of atoms, the discrete energy levels form a “continuous” band

Silicon Si has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free.

Electron-Hole Pair Interaction With free electrons breaking off covalent bonds, holes are generated. Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers.

Free Electron Density as a Function of Temperature Eg, or bandgap energy, determines how much effort is needed to break off an electron from its covalent bond. There exists an exponential relationship between the free-electron density and bandgap energy.

N Type Doping If Si is doped with group-V elements such as phosphorous (P) or arsenic (As), then it has more electrons and becomes N type (electron). Group-V impurities are called Donors

P Type Doping If Si is doped with group-III elements such as boron (B), then it has more holes and becomes P type. Group-III impurities are called Acceptors

Summary of Charge Carriers

Thermal Equilibrium (Pure Si) Balance between generation and recombination determines no = po Strong function of temperature: T = 300 K

Mass Action Law The product of electron and hole densities is ALWAYS equal to the square of intrinsic electron density, regardless of doping levels Majority Carrier Conc. = Doping Conc. Minority Carrier Conc. (Mass Action Law) N-Type P-Type

Compensated Doping Si is doped with both donor and acceptor atoms: More donors than acceptors: Nd > Na  N type More acceptors than donors: Na > Nd  P type

First Charge Transportation Mechanism: Drift Mobility The process in which charge particles move because of an electric field is called drift. Charge particles will move at a velocity that is proportional to the electric field.

Mobility vs. Doping in Silicon at 300K Typical values

Current Flow: General Case Electric current is calculated as the amount of charge in v meters that passes thru a cross-section if the charge travel with a velocity of v m/s.

Current Flow: Drift Since velocity is equal to E, drift characteristic is obtained by substituting v with E in the general current equation. The total current density consists of both electrons and holes.

Velocity Saturation A topic treated in more advanced courses is velocity saturation. In reality, velocity does not increase linearly with electric field. It will eventually saturate to a critical value.

Second Charge Transportation Mechanism: Diffusion Charge particles move from a region of high concentration to a region of low concentration.

Current Flow: Diffusion Diffusion Coefficient Diffusion current is proportional to the gradient of charge (dn/dx) along the direction of current flow. Total diffusion current density consists of both electrons and holes.

Example: Linear vs. Nonlinear Charge Density Profile Linear charge density profile means constant diffusion current, whereas nonlinear charge density profile means varying diffusion current.

Einstein's Relation p While the underlying physics behind drift and diffusion currents are totally different, Einstein’s relation provides a link between the two.

Resistivity of Uniformly Doped Si

Sheet Resistance (Rs) IC resistors have a specified thickness – not under the control of the circuit designer Eliminate thickness, t, by absorbing it into a new parameter: the sheet resistance (Rs) “Number of Squares”

Using Sheet Resistance (Rs) Ion-implanted (or “diffused”) IC resistor

Idealizations Why does current density Jn “turn”? What is the thickness of the resistor? What is the effect of the contact regions?