Charge collection in X-ray pixel detectors based on SI-GaAs doped with Cr G.I.Ayzenshtat a, M.V.Bimatov b, O.P.Tolbanov c, A.P.Vorobiev d a Science & Production.

Slides:



Advertisements
Similar presentations
of Single-Type-Column 3D silicon detectors
Advertisements

C.Manfredotti, Quartu S.Elena, WOCSDICE 2001 GaAs IBIC analysis of gallium arsenide Schottky diodes C.Manfredotti 1,2, E.Vittone 1,2,F.Fizzotti.
Semiconductor detectors
General Characteristics of Gas Detectors
Test Beam at IHEP,CAS ZHANG Liang sheng, Test Beam Group Introduction BEPC/BES Ⅱ will be upgraded as BEPC Ⅱ / BES Ⅲ, it is necessary to do beam test for.
Study of plastic scintillators for fast neutron measurements
Drift velocity Adding polyatomic molecules (e.g. CH4 or CO2) to noble gases reduces electron instantaneous velocity; this cools electrons to a region where.
Modeling and simulation of charge collection properties for 3D-Trench electrode detector Hao Ding a, Jianwei Chen a, Zheng Li a,b,c, *, Shaoan Yan a a.
New approach to simulate radiation damage to single-crystal diamonds with SILVACO TCAD Florian Kassel, Moritz Guthoff, Anne Dabrowski, Wim de Boer.
1 Sep. 19, 2006Changguo Lu, Princeton University Induced signal in RPC, Configuration of the double gap RPC and Grouping of the strips Changguo Lu Princeton.
Laser Testing of Silicon Detectors Rhorry Gauld University of Saint Andrews IPM program – PPD Mentor: Ronald Lipton 30/07/08 1.
Optoelectronic Devices (brief introduction)
GaAs radiation imaging detectors with an active layer thickness up to 1 mm. D.L.Budnitsky, O.B.Koretskaya, V.A. Novikov, L.S.Okaevich A.I.Potapov, O.P.Tolbanov,
Paul Sellin, Radiation Imaging Group Charge Drift in partially-depleted epitaxial GaAs detectors P.J. Sellin, H. El-Abbassi, S. Rath Department of Physics.
Proportional Counters
Why silicon detectors? Main characteristics of silicon detectors: Small band gap (E g = 1.12 V)  good resolution in the deposited energy  3.6 eV of deposited.
1 Semiconductor Detectors  It may be that when this class is taught 10 years on, we may only study semiconductor detectors  In general, silicon provides.
Drift and Diffusion Current
1 Small GEM Detectors at STAR Yi Zhou University of Science & Technology of China.
Tzveta Apostolova Institute for Nuclear Research and Nuclear Energy,
11 th RD50 Workshop, CERN Nov Results with thin and standard p-type detectors after heavy neutron irradiation G. Casse.
KIT – University of the State of Baden-Wuerttemberg and National Research Center of the Helmholtz Association Institut für Experimentelle Kernphysik
NEW COMMENTS TO ILC BEAM ENERGY MEASUREMENTS BASED ON SYNCHROTRON RADIATION FROM MAGNETIC SPECTROMETER E.Syresin, B. Zalikhanov-DLNP, JINR R. Makarov-MSU.
Network for Computational Nanotechnology (NCN) UC Berkeley, Univ.of Illinois, Norfolk State, Northwestern, Purdue, UTEP First-Time User Guide Drift-Diffusion.
NEEP 541 Ionization in Semiconductors - II Fall 2002 Jake Blanchard.
Paul Sellin, Radiation Imaging Group Time-Resolved Ion Beam Induced Charge Imaging at the Surrey Microbeam P.J. Sellin 1, A. Simon 2, A. Lohstroh 1, D.
M. McConnell1, J. R. Macri, J. M. Ryan, K. Larson, L. -A. Hamel, G
1. A photoresistor is formed from a square 1 cm x 1 cm slab of GaAs. Light of wavelength 830 nm falls onto it at a power density of 1, generating electron-hole.
Performance limits of a 55  m pixel CdTe detector G.Pellegrini, M. Lozano, R. Martinez, M. Ullan Centro Nacional de Microelectronica, Barcelona, 08193,
I n s t i t u t e of H i g h E n e r g y P h y s i c s И н с т и т у т Ф и з и к и В ы с о к и х Э н е р г и й Influence of cooling on the working parameters.
2016/6/4 Taka Kondo (KEK) 1 Issues of the SCT Digitization model 2 nd meeting of SCT Digitization TF Taka Kondo (KEK) 1.Current SCT digitization.
1 TRD-prototype test at KEK-FTBL 11/29/07~12/6 Univ. of Tsukuba Hiroki Yokoyama The TRD prototype is borrowed from GSI group (thanks Anton).
GaAs detectors for medical imaging G.I.Ayzenshtat a*, S.M. Gushin a, O.B. Koretskaya b, O.P. Tolbanov b, A.V. Tyazhev b, E.A. Babichev c, V.R. Groshev.
Ionization Detectors Basic operation
Analysis of Edge and Surface TCTs for Irradiated 3D Silicon Strip Detectors Graeme Stewart a, R. Bates a, C. Corral b, M. Fantoba b, G. Kramberger c, G.
Introduction to semiconductor technology. Outline –4 Excitation of semiconductors Optical absorption and excitation Luminescence Recombination Diffusion.
1 SCT Lorentz angle & Cluster Width Simulations From first principles Guang Hao Low (Summer Student) In consultation with Steve McMahon, Shaun Roe, Taka.
P*-n-n* diode CV characteristics changes at various contact and body doping concentrations. TCAD simulation Ernestas Zasinas, Rokas Bondzinskas, Juozas.
Yuri Arestov, IHEPPrague, April 17, GaAs:Cr for HEP – radiation tests IHEP, Protvino NCPHEP, Minsk SIPT, Tomsk ICBP, Puschino.
Charge Collection and Trapping in Epitaxial Silicon Detectors after Neutron-Irradiation Thomas Pöhlsen, Julian Becker, Eckhart Fretwurst, Robert Klanner,
Introduction to Semiconductor Technology. Outline 3 Energy Bands and Charge Carriers in Semiconductors.
ELECTRONICS II VLSI DESIGN Fall 2013
3D Event reconstruction in ArgoNeuT Maddalena Antonello and Ornella Palamara 11 gennaio 20161M.Antonello - INFN, LNGS.
TCT measurements with SCP slim edge strip detectors Igor Mandić 1, Vladimir Cindro 1, Andrej Gorišek 1, Gregor Kramberger 1, Marko Milovanović 1, Marko.
Chapter 4 Excess Carriers in Semiconductors
Waveguide Ge-PD Simulation
10/25/2007Nick Sinev, ALCPG07, FNAL, October Simulation of charge collection in chronopixel device Nick Sinev, University of Oregon.
Infrared Laser Test System Silicon Diode Testing 29 May 2007 Fadmar Osmić Contents: Setup modifications new amplifier (Agilent MSA-0886) new pulse generator.
CdTe prototype detector testing Anja Schubert The University of Melbourne 9 May 2011 Updates.
Deep Level Transient Spectroscopy study of 3D silicon Mahfuza Ahmed.
RD05 Florence CVD Diamond Radiation Sensors For Application In Very High Radiation Environments 7 th International Conference on Large Scale Applications.
3D Diamond Detectors: Update on Current Work Steven A. Murphy 16 th July 2014.
TCT measurements with strip detectors Igor Mandić 1, Vladimir Cindro 1, Andrej Gorišek 1, Gregor Kramberger 1, Marko Milovanović 1, Marko Mikuž 1,2, Marko.
PHYSICAL ELECTRONICS ECX 5239 PRESENTATION 01 PRESENTATION 01 Name : A.T.U.N Senevirathna. Reg, No : Center : Kandy.
June T-CAD Simulations of 3D Microstrip detectors a) Richard Bates b) J.P. Balbuena,C. Fleta, G. Pellegrini, M. Lozano c) U. Parzefall, M. Kohler,
N.Kimmel, the MPI Halbleiterlabor team and PNSensor References: H. Tsunemi et al., NIM A 421 (1999), H. Tsunemi et al., NIM A 436 (1999), Characterization.
Simulation of the Time Response of a VPT
Characterization and modelling of signal dynamics in 3D-DDTC detectors
silicon drift detectors
Radiation hardness tests of GaAs and Si sensors at JINR S. M
Graeme Stewarta, R. Batesa, G. Pellegrinib, G. Krambergerc, M
M. C. Veale1, S. J. Bell1,2, D. D. Duarte1,2, M. J. French1, M
PTI results on I(T) and E(x) simulations with two midgap energy levels
Modeling Vacancy-Interstitial Clusters and Their Effect on Carrier Transport in Silicon E. Žąsinas, J. Vaitkus, E. Gaubas, Vilnius University Institute.
Time-sensitive CMOS MAPS
Review of semiconductor physics
Testbeam Results for GaAs and Radiation-hard Si Sensors
Beam Test Results for the CMS Forward Pixel Detector
Why silicon detectors? Main characteristics of silicon detectors:
Presentation transcript:

Charge collection in X-ray pixel detectors based on SI-GaAs doped with Cr G.I.Ayzenshtat a, M.V.Bimatov b, O.P.Tolbanov c, A.P.Vorobiev d a Science & Production Enterprise “Semicond. Dev. Research Inst”, Tomsk, Russia b Tomsk State University, Tomsk, Russia c Siberian Physical Technical Institute, Tomsk, Russia d State Science Center “High-Energy Physics Institute”, Protvino, Russia

Introduction The charge collection in a pixel detector and output current shape were investigated for LEC SI-GaAs in the works by P.J.Sellin, M.G.Bisogni and others. The purpose of our work is to simulate a current and charge signal in the pixel detector after X-ray absorption at various positions in the detector for GaAs compensated by Cr. This material distinctive features are: an uniform electric field distribution through the detector; much longer lifetime of an electron than of a hole (τ e >> τ h ). The material characteristics: The mobility and lifetime values of charge carriers are: µ h = 200 cm 2 /Vs, µ e = 1500 cm 2 /Vs τ h  0.2 ns, τ e  10 ns, The electron velocity depends nonlinearly on the electric field strength: v e = µ e E when E 5 kV/cm

A Formula for the pixel current The following formula was obtained for calculation of the current induced on a pixel by a moving charge: where R=D/2 is half pixel size, x and y are the horizontal coordinates, q and v are the charge value and the charge velocity respectively; function f is:, k=0,±1,±2,… where z is the perpendicular coordinate, h is the detector thickness. (1) (2) D=100µm thickness=500µm z x y x

The currents induced on irradiated and neighbouring pixels (the capture was neglected) µ e = 1500 cm 2 /Vs, µ h = 200 cm 2 /Vs The conclusion: The negative current pulse arises in the neighbouring pixel thickness=500µm D=100µm The side view of the detector: the irradiated pixel the neighbouring pixel z

Pixel contacts should be anodes (for SI – GaAs:Cr) lifetimes of the charge carriers: τ h  0.2 ns τ e  10 ns The current induced on the pixel tacking into account the capture

Dependences of CCE on the photon absorption depth for events occurring under the pixel center Pixel contacts should be anodes (for SI – GaAs:Cr) z 0 500µm

Signal induced on the next nearest pixel is negligible. The dependences of CCE on the photon absorption depth for events occurring at various distances from the pixel center the examined pixel z x=50µm x 0 the examined pixel z x=100µm x 0

There is an optimal detector thickness for the mean collected charge. Its value is determined by the photon energy and the drift length of charge carriers. Mean charge collected on the pixel as a function of the detector thickness The charge averaged over all photons incident on the detector cell

Conclusions The formula for the current induced on the square pixel by a moving charge was obtained. The negative current pulse arises in the neighbouring pixel. The pixel contacts should be anodes in the detector based on SI-GaAs compensated by Cr. There is an optimal detector thickness for the mean collected charge. Its value is determined by the photon energy and the drift length of charge carriers.