SPiDeR  SPIDER DECAL SPIDER Digital calorimetry TPAC –Deep Pwell DECAL Future beam tests Wishlist J.J. Velthuis for the.

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SPiDeR  SPIDER DECAL SPIDER Digital calorimetry TPAC –Deep Pwell DECAL Future beam tests Wishlist J.J. Velthuis for the SPIDER collaboration

SPiDeR  SPIDER UK Collaboration working on Silicon Pixel R&D for future colliders. –Demonstrate a new improved technique for EM calorimetry –Develop a MAPS sensor with in-pixel data processing for tracking applications In principle funded until end of 2012

SPiDeR  TPAC: Digital Calorimetry Average number of charged particles in EM shower  incident energy –Fluctuations due to statistical nature of shower Average energy in sensitive layers  number of charged particles –Fluctuations due to angle of incidence, velocity and Landau spread Hence, number of charged particles is an intrinsically better measure than the energy deposited –Clearest with ideal calorimeter; no experimental effects –Energy deposited (“analogue” ECAL) resolution ~50% worse than number of particles (“digital” ECAL) resolution

SPiDeR  Digital Calorimetry: Concept Can we measure the number of charged particles? –Possible to get close to the analogue ideal resolution with low noise electronics Can we get anywhere near the ideal resolution for the digital case? –Make pixellated detector with small pixels Probability of more than one charged particle per pixel can be made small Allows binary readout = hit/no hit EM shower density ~100/mm 2 in core –Need pixels ~ 50  m –Results in huge number of pixels in a real ECAL ~ pixels –Need readout integrated into pixel Implement as CMOS MAPS sensor

SPiDeR  Deep Pwell Problem in MAPS: –PMOS electronics need Nwell –Nwell acts as charge collection diode –So can’t make PMOS without losing huge amount of Q New development: make deep pwell with Nwell inside  can do CMOS –Road to data processing in pixel

SPiDeR  TPAC sensor 1cm 168x168 pixels=28k, each 50×50  m 2 –0.18  m CMOS Every pixel has 4 diodes, Q-preamp, mask and 4-bit pedestal trim, asynchronous comparator and monostable to give hit/no hit response Pixel hits stored with 13-bit timestamp on- sensor until end of bunch train Memory for data storage inactive; 11% dead area in four columns

SPiDeR  TPAC Fe55 Primary 55 Fe peak gives calibrated gain of 128µV/e- Width of 55 Fe peak gives noise of 27e- See K α and K β clearly separated

SPiDeR  TPAC beam test TPAC in beam tests –120 GeV π & GeV e - –6 TPAC sensors (layers) in stack –170k pixels in total –1cm x 1cm active area –Three scintillators/PMTs installed – Used to tag time of particles within bunch trains Data seems good –Scintillators/PMTs give good time tags for particles –Events were seen in all layers (including high resistivity) USB-based DAQ setup on H6B beam line at CERN X-X correlation plot for two layers (back-to-back) 8 high res epi standard epi

SPiDeR  DECAL chip TPAC too small for real EM shower containment; make large scale sensor SPIDER will develop a new chip for calorimetry: DECAL –Chip fabricated in 2011 Will build proof-of-principle stack from DECAL –6×6 cm2 planes –30 layers –24 X 0 deep –Beam test stack in 2012 –Part of CALICE collaboration

SPiDeR  Future beam tests TPAC: beam test at DESY in Feb 2010 –Electron scan done at CERN, GeV but no tracking –Need telescope to reconstruct start of shower –DESY 1-6GeV with tracking to locate shower centre Testing large DECAL sensor stack in 2012 –Major sample needed for full proof-of-principle –CERN electrons GeV ~ 6 weeks –DESY electrons 1-6 GeV ~ 3 weeks –Also some pion runs for calibration –All with tracking telescope

SPiDeR  Our needs/wishes Beam time! Need for telescope –Really like EUDET concept: Know the TLU; no big interfacing problems to be solved onsite Tracking and alignment software provided Essentially get the tracks Would like patch panels (bnc and fiber optic) between hut and area –Cabling is pain Would like large XY-stage If possible could arrange many user beam tests –Remote shifts; saves lots of travel money

SPiDeR  Nice example Tested 4 different devices at the same time 2 Bonn telescope modules ATLAS 3D module Diamond ATLAS pixel module ATLAS BCM modules DEPFET modules 2 Bonn telescope modules

SPiDeR  Summary SPIDER is developing a digital calorimeter proof- of-principle device. –New MAPS chip will be developed –Stack complete in 2012 Would be great to have common infrastructure: patch panels, large XY stage & TLU Very interested in collaborating with many other users