Gy. Bognár 1, P. Fürjes 2, V. Székely 1, M. Rencz 3 TRANSIENT THERMAL CHARACTERISATION OF HOT PLATES &of MEMS MOEMS 2004 3 MicReD Ltd., Budapest, Hungary.

Slides:



Advertisements
Similar presentations
C. M. Johnson, P. H. Riley and C. R. Saha Thermo-acoustic engine converts thermal energy into sound energy by transferring heat between the working media.
Advertisements

Application of the Root-Locus Method to the Design and Sensitivity Analysis of Closed-Loop Thermoacoustic Engines C Mark Johnson.
Transient Conduction: The Lumped Capacitance Method
Nonlinear Compact Thermal Model of SiC Power Semiconductor Devices Krzysztof Górecki, Janusz Zarębski, Damian Bisewski and Jacek Dąbrowski Department of.
The nonlinear compact thermal model of power MOS transistors
Bridging Theory in Practice Transferring Technical Knowledge to Practical Applications.
Numerical modeling example A simple s teel reheat furnace model – pg Reheat furnace Hot steel slabRolling mill Final product.
© 2011 Autodesk Freely licensed for use by educational institutions. Reuse and changes require a note indicating that content has been modified from the.
Scaling of viscous shear zones with depth dependent viscosity and power law stress strain-rate dependence James Moore and Barry Parsons.
Title The Effect of Polyimide Fixation on Thermal Performance of GaAs Cantilever Based MEMS: A 3D Numerical Analysis with DEETEN Eduard Burian 1 and Tibor.
September 24-25, 2003 HAPL meeting, UW, Madison 1 Armor Configuration & Thermal Analysis 1.Parametric analysis in support of system studies 2.Preliminary.
Chapter 2: Overall Heat Transfer Coefficient
Thermal Analysis of short bake out jacket version 1 12-Nov-2013.
Applications Team Sensing Products
1 Chapter 5 Sensors and Detectors A detector is typically the first stage of a communication system. Noise in this stage may have significant effects on.
CHE/ME 109 Heat Transfer in Electronics LECTURE 12 – MULTI- DIMENSIONAL NUMERICAL MODELS.
Magnetism The density of a magnetic field (number of magnetic lines passing through a given surface) is the magnetic flux: Units of flux are Webers. Tesla/m.
WP 3: Thermal System Strictly Confidential 1 Workpackage 3: Thermal System Project Meeting, May 11, 2006.
CHE/ME 109 Heat Transfer in Electronics LECTURE 11 – ONE DIMENSIONAL NUMERICAL MODELS.
One Dimensional Steady Heat Conduction problems P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Simple ideas for complex.
Solutions of the Conduction Equation P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi An Idea Generates More Mathematics….
Transient Conduction: The Lumped Capacitance Method
CHAPTER 8 APPROXIMATE SOLUTIONS THE INTEGRAL METHOD
Budapest University of Technology & Economy Department of Electron Devices.
CHE/ME 109 Heat Transfer in Electronics LECTURE 5 – GENERAL HEAT CONDUCTION EQUATION.
“HEAR IT AND FORGET IT, SEE IT AND REMEMBER IT, DO IT AND UNDERSTAND IT” R12310: ME and ChemE Lab and Demo Hardware Development DPM – Spring 2012.
Heat Transfer Rates Conduction: Fourier’s Law
Slide # 1 Examples of pressure sensor packaging Temperature characteristics of a piezoresistive pressure sensor. Transfer function at three different temperatures.
1 QXF heater proposal M. Marchevsky, H. Felice, T. Salmi, D. Cheng, G. Sabbi, LBNL.
A method for thermal model generation of MEMS packages Márta Rencz 1 Vladimír Székely 2 Zsolt Kohári 2 Bernard Courtois 3 2 Technical University of Budapest,
Cooling design of the frequency converter for a wind power station
Tutorial 5: Numerical methods - buildings Q1. Identify three principal differences between a response function method and a numerical method when both.
STEADY HEAT TRANSFER AND THERMAL RESISTANCE NETWORKS
CPD and other imaging technics for gas sensor Mizsei, János 18-28/05/2006 Ustron Budapest University of Technology and Economics, Department of Electron.
Smart Rotor Control of Wind Turbines Using Trailing Edge Flaps Matthew A. Lackner and Gijs van Kuik January 6, 2009 Technical University of Delft University.
Easy-to-Use CFD for Electronics Design. Introduction A CFD thermal simulation tool specifically designed for the electronics industry Future Facilities.
BsysE595 Lecture Basic modeling approaches for engineering systems – Summary and Review Shulin Chen January 10, 2013.
THERMODYNAMIC PROPERTY RELATIONS
Department of Flow, Heat and Combustion Mechanics – Ghent University – UGent Linear stability analysis of a supercritical loop C.
Summary: Isolated Systems, Temperature, Free Energy Zhiyan Wei ES 241: Advanced Elasticity 5/20/2009.
Moisture impact on building rocks - the laboratory and in situ investigations FIDRÍKOVÁ D., KUBIČÁR Ľ. Institute of Physics SAS, Bratislava, Slovakia The.
Thermal Model of MEMS Thruster Apurva Varia Propulsion Branch Code 597.
An evaluation of HotSpot-3.0 block-based temperature model
INTENSIFIED HEAT TRANSFER TECHNOLOGIES FOR ENHANCED HEAT RECOVERY Project meeting July 8, 2011 Veszprem, Hungary WP1 - Enhancing understanding of heat.
Micro-Resistor Beam.
The Influence of the Selected Factors on Transient Thermal Impedance of Semiconductor Devices Krzysztof Górecki, Janusz Zarębski Gdynia Maritime University.
06-November-2013 Thermo-Mechanical Tests BE-RF-PM Review of the CLIC Two-Beam Module Program Thermo-Mechanical Tests L. Kortelainen, I. Kossyvakis, R.
Tungsten Calorimeter Model Calculations and Radiation Issues Pavel Degtiarenko Radiation Control Group, Jefferson Lab.
R.Žitný, J.Thýn Department of Process Engineering CTU in Prague, Faculty of Mechanical Engineering Acknowledgement: Research.
One-Dimensional Steady-State Conduction
Laser-Based Finger Tracking System Suitable for MOEMS Integration Stéphane Perrin, Alvaro Cassinelli and Masatoshi Ishikawa Ishikawa Hashimoto Laboratory.
Silesian University of Technology in Gliwice Inverse approach for identification of the shrinkage gap thermal resistance in continuous casting of metals.
Electricity did not become an integral Part of our daily lives until Scientists learned to control the Movement of electric charge. This is known as.
©SJA Søren Juhl Andreasen and Søren Knudsen Kær Aalborg University Institute of Energy Technology Dynamic Model of High Temperature PEM Fuel Cell.
The CNGS Target Station By L.Bruno, S.Péraire, P.Sala SL/BT Targets & Dumps Section.
THE STRESS ANALYSIS OF A BUFFER AIR HEAT EXCHANGER YONGSHENG GE a, IGOR DOKLESTIC b & STEVE HUGHES a a Serck Aviation, Oscar House, Wharfdale Road, Tyseley,
FRESCA II dipole review, 28/ 03/2012, Ph. Fazilleau, M. Durante, 1/19 FRESCA II Dipole review March 28 th, CERN Magnet protection Protection studies.
Finite-Difference Solutions Part 2
Transient thermal + fatigue analysis in ASONIKA. Specify a name for the project.
The SUNRED program: models & algorithms Equation to be solved (2D case): The structure model: Cell, center and boundary (terminal) nodes. Different colors.
Using COMSOL for Chemical Reaction Engineering Your name COMSOL.
Development of combined sensors for UHE neutrino detection Alexander Enzenhöfer ARENA 2010 Nantes,
Modelling LED Lamps with Thermal Phenomena Taken into Account Krzysztof Górecki and Przemysław Ptak Gdynia Maritime University Department of Marine Electronics.
Peter Loveridge High Power Targets Group
Power Magnetic Devices: A Multi-Objective Design Approach
Date of download: 1/2/2018 Copyright © ASME. All rights reserved.
VISUAL AIDS for instruction in VACUUM TECHNOLOGY AND APPLICATIONS
High-temperature Properties of Schottky Diodes Made of Silicon Carbide
Transient Heat Conduction
Generation of Uniform Magnetic Field for Cancer Hyperthermia Research
Presentation transcript:

Gy. Bognár 1, P. Fürjes 2, V. Székely 1, M. Rencz 3 TRANSIENT THERMAL CHARACTERISATION OF HOT PLATES &of MEMS MOEMS MicReD Ltd., Budapest, Hungary 1 BUTE, Budapest, Hungary 2 KFKI-MFA Research Institute for Technical Physics and Materials Science, Hungary

The physical structure to be characterised thermally: an integrated gas sensor Thermally isolated heater and sensing resistor filament (Pt) 100  m x 100  m x 1  m Encapsulated by reduced stress silicon rich silicon-nitride (LPCVD) Selective dissolution of electrochemically formed porous silicon (60-80  m) Mechanical support under the hotplate 100  m Mechanical support Thermal operation  needs thermal characterisation

Reasons of thermal characterisation To check the maximal operation speed of the sensor device (strongly influenced by the thermal isolation of the membrane structure) To check how to reach maximal temperature elevation with minimal heating power (e.g.: for explosion-proof detection of combustible gases)  C achieved with 10-25mW To detect the differences in the thermal behaviour of hotplates with and without mechanical support

Outline Presentation of the following studies: –Simulation: Structure without mechanical support: steady-state, transient –Measurement – thermal transient Structure with mechanical support Structure without mechanical support Comparison by means of –Time-constant spectra –Structure functions –Simple compact model created Conclusions

The simulation Simulated by the SUNRED program (without mechanical support) FD model, solved by SUccessive Network REDuction The simulation results were verified by thermal transient measurements using the T3Ster equipment and related analysis software The model:

The simulation Transient result Time evaluation of temperature is not to scale The 1µs.. 1s time range was covered on a logarithmic time-scale

The simulation Transient result The 1µs.. 1s time range was covered on a logarithmic time-scale

Max. temperature elevation is 227 o 8.5mW The simulation Steady-state result (figure is not to scale)

Steady-state result The simulation Uniform temperature distribution on the hotplate

Verification by measurements The resistor of the hotplate was used both as a heater and a temperature sensor –Sensitivity of the sensor was identified by a calibration process The thermal response was recorded by T3Ster using the 4 wire method: I drive I sense DUT U meas ~ T Force:Sense:

Verification by measurements Simulated 8.5mW Measured 8.5mW Structure without mechanical support Steady state values agree well

Verification by measurements Simulated Measured Structure without mechanical support The dominant time constants are in a good agreement 2.24 ms 1.10 ms

time [s] Temperature [  C] Simulated 8.5mW Measured 8.5mW Measured 6.5mW (with support) Verification by measurements

Simulated wo Measured w Measured wo The dominant time constant is only slightly influenced by the mechanical support

Foster type network model of the structure is constructed from the time constant spectra Equivalent Cauer type network model corresponds to the real physical structure Structure functions

The discrete RC model network in the Cauer canonic form now corresponds to the physical structure, but This is called cumulative structure function it is very hard to interpret its “meaning” Its graphical representation helps: Structure functions

The cumulative structure function is the map of the heat-conduction path: ambient heater Structure functions

Agrees well with the volume calculated from exact geometry hotplate K/W 40 nWs/K

Structure functions The thermal capacitance ~ 40 nWs/K The thermal resistance ~ K/W The structure has only one dominant time constant The simplified thermal model constructed hotplate K/W 40 nWs/K

Summary of transient characterisation Power level Thermal resistance Thermal capacitance Time constant measured w support8.5mW27000 K/W40 nWs/K1.10ms measured wo support6.5mW26000 K/W40 nWs/K1.12ms simulated wo support8.5mW30000 K/W40 nWs/K2.24ms Identified from the structure functions

The structures can be represented by one dominant time constant (  ~ 1.1ms) The time constants of the two structures are nearly the same The pillar support has small thermal capacitance and high resistance, so it hardly influences the thermal behavior of the hotplate Summary of transient characterisation

Summary The response time of the heater was investigated by time constant analysis, and the single dominant time constant of the structure was found in the range of milliseconds We identified and generated a reduced order (compact) thermal model of the structure The thermal properties (R th, C th,  ) of the structures with and without support were nearly identical Consequently the dynamic behaviour was not deteriorated significantly by the mechanical support

Acknowledgment This work was partially supported by the OTKA T project of the Hungarian National Research Fund INFOTERM NKFP 2/018/2001 project of the Hungarian Government and the SAFEGAS and the REASON FW5 Projects of the EU

Measurements: temperature calibration Surface temperature was measured by resistance calibration technique R th  26.5K/mW (with mechanical support) heat conduction in the suspending beams, conduction and convection in the surrounding gas, radiation from the hot surfaces

The complex loci – Nyquist diagram – was calculated from the measured thermal impedance curves Slight transfer effect can be observed that is due to the heat transfer between different sections of the heating meander Frequency domain behavior derived from measured transient curves

Measured without support Measured with support Frequency domain behavior derived from measured transient curves