Sputtering Deposition System R eginald B ryant X u S un MAS 961, Spring 2004 Project Proposal

Presentation Overview I. Project Overview II. System Description III. Functionality IV. Design Process V. Hello-World Demonstration

I. Project Overview  A Gas Sputter Deposition System is proposed. Basic function is deposition of conductive and dielectric materials (including Al, SiN…) on various substrates (including Si, SiO).  The Advantage of this system over the existing technology is:

System Description  There are primarily SIX components in the system: 1. Target System target material layer to be deposited on the substrate 2. Shutter & Masks programmable deposition pattern 3. Plasma Sources plasma hitting and kicking off target particles 4. Movement Control System XYZ movement of target layer and/or shutter masks 5. Sample Holding System fixed plane to hold sample at the bottom of enclosure 6. Enclosure & Pump Entire system is enclosed in rare gas environment with temp, pressure control

1. Target System  Function: Holding target heads  Design Parameters: Quality of target layer (existing standard deposition technology) Topology of heads We plan to make only two target heads for prototyping

2. Shutter and Masks  Function: Deposition pattern one-use masks or programmable reusable shutter  Design Parameters: The complexity and resolution of the pattern

3. Plasma Source  Function: Use high microwave voltage to generate Argon plasma. Electrons in plasma heat target material and kick them out.  Design Parameters: Power level of plasma source, control electrical network.

4. Movement Control System  Function: Control the movement of deposition-head including X-Y-Z- axis.  Design Parameters: Movement precision and operation complexity Good to compatible with existing prototyping machine such as Modella, laser cutter or waterjet

5. Sample Holding System  Function: holding the sample substrate  Design Parameters: easy to operate

6. Enclosure and Pump  Function: Include all the parts of system in a vacuum enclosure to ensure a clean environment. Temperature control.  Design Parameter: Reasonable vacuum, temperature

Functionality  Deposition Scaling from 10 microns to 10 nanometers.  Monolithic Passive components  Monolithic Active components  Multilayer chip

Design Process  Physical Modeling –Theoretical analysis of required temperature, pressure, geometry –Computer simulations of deposition process  Design Optimization -- Different schemes, e.g. target heads movable or masks movable or both  Component fabrication -- Target heads, shutter/masks, enclosure, electronic parts  Component Test --  System Assembly

Hello-world demonstration  Multilayer conductive wires sandwiched between insulators.  Test the electrical quality, i.e. continuity of the wires and isolation of different layers