On Pb-free (solder) Interconnections for High-Temperature Applications A.A. Kodentsov Laboratory of Materials and Interface Chemistry, Eindhoven University.

Slides:

Advertisements

Similar presentations

EQUILIBRIUM DIAGRAMS HAVING INTERMEDIATE PHASES OR COMPOUNDS

Advertisements

Low-Cycle Fatigue Behavior of Lead-Free Solder

Ryan Kraft, and Rajiv Asthana, University of Wisconsin-Stout

Phase Diagrams Continued

Lecture 4 Diffusion Bonding Fabrication Technology / Prof. Eagar / Copyright Review Adhesive joints require larger surface area for strength.

Lecture 13: Phase diagrams 2 PHYS 430/603 material Laszlo Takacs UMBC Department of Physics.

Chapter 9-15 The copper-zinc phase diagram: Terminal and Intermediate Solid Solutions Terminal solid solutions intermediate solid solutions Commercial.

Diffusion Welding.

Non-Arc Welding Processes Resistive heating, chemical reactions, focused light and electrons, sound waves, and friction can also be used to join materials.

L10B: Phases in equilibrium with one another: Composition and amount of each The temperature and pressure must be the same in each phase in equilibrium.

CHAPTER 8 Phase Diagrams 8-1.

Thermal Equilibrium Diagrams

1 Thermochemical and topological studies of systems constituted by transition metals (Co, Ni) with Sn and Bi G.P. Vassilev a, K.I. Lilova b, J.C. Gachon.

1 Thermal Analysis of Sn, Cu and Ag Nanopowders Pavel Brož, Jiří Sopoušek, Jan Vřešťál Masaryk University, Faculty of Science, Department of Chemistry,

Slip Systems in FCC.

Fig. 2In-Pd-Sn: Composition of the samples and position of the sections for calorimetry at 900°C. *Corresponding Author: Tel.-No , FAX-No.

COST Action 531 Lead-free Solder Materials. Structural, physical and technological properties of lead-free solder materials on the base of tin Jaromír.

Phase Equilibria: Solubility Limit Sucrose/Water Phase Diagram Pure Sugar Temperature (°C) Co=Composition (wt% sugar) L (liquid solution.

THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.

Lead-free Solder Alloys: Enthalpies of formation of (Ag,Cu,Ni)-Sn binary alloys U. Saeed, H. Flandorfer, H. Ipser Institute of Inorganic Chemistry / Materials.

Venkatesh Sivasubramaniam - COST 531 Final Meeting, Vienna, Particle reinforced lead-free solders A Comparative study on reinforcing Sn-4Ag-0.5Cu.

Phase Equilibria in Ni-P-Sn

E. Ricci, D. Giuranno, F. Gnecco, S. Amore, T. Lanata, R. Novakovic

Introduction to Materials Science, Chapter 9, Phase Diagrams University of Virginia, Dept. of Materials Science and Engineering 1 Development of microstructure.

Transient Liquid Phase Bonding as a Potential Substitute for Soldering with High-Lead Alloys A.A. Kodentsov Laboratory of Materials and Interface Chemistry,

FE-2: Continuation of part 1 Polymers, phase diagrams, steel Carbon-based of concern here. One or more monomers joined to form giant molecules. The bonding.

Introduction The properties and behavior of metals (and alloys) depend on their: Structure Processing history and Composition Engr 241.

Silver Flip-chip Technology: The Infinitesimal Joint Possibility Integrated circuit chips are traditionally connected to the packages by tiny wires. As.

Lecture 9 Phase Diagrams 8-1.

Chapter 9 Phase Diagrams.

Copper (Cu) FCC nm atomic radii Silver (Ag) FCC nm atomic radii Mix 50% Ag + 50% Cu, gives two solid phases (  and  )  (saturated - mostly.

Element Groups (Families)

Thermal Stabilization and Mechanical Properties of nc Fe-Ni-Cr Alloys Ronald O. Scattergood, North Carolina State University, DMR A study was completed.

Thermal Equilibrium Diagrams Contain information about changes that take place in alloys.

1. Chapter 09: Phase Diagram 2 Introduction Phase Diagrams are road maps.

Introduction to Materials Science, Chapter 9, Phase Diagrams University of Virginia, Dept. of Materials Science and Engineering 1 Growth of Solid Equilibrium.

1 ISSUES TO ADDRESS... When we combine two elements... what equilibrium state do we get? In particular, if we specify... --a composition (e.g., wt% Cu.

Microstructure and Phase Transformations in Multicomponent Systems

PHASE DIAGRAMS THEORY AND APPLICATIONS. Some basic concepts u Phase A homogeneous region with distinct structure and physical properties In principle,

Study of the Sn-Zn-X alloys for solder applications in the electronic industry Study of the Sn-Zn-X alloys for solder applications in the electronic industry.

Chapter ISSUES TO ADDRESS... When we mix two elements... what equilibrium state do we get? In particular, if we specify... --a composition (e.g.,

KINETICS OF INTERMETALLIC LAYER GROWTH FOR SOLDERED COPPER AND COPPER-NICKEL ALLOYS E. K. Ohriner Metals and Ceramics Division Oak Ridge National Laboratory.

CHE 333 Class 3 Phase Diagrams.. Why Phases? Few materials used in pure state – gold, copper, platinum etc for electrical properties or coatings. Most.

1 1 Figure 10.1 Considerations for effective dispersion strengthening: (a) The precipitate phase should be hard and discontinuous. (c)2003 Brooks/Cole,

Mechanical & Aerospace Engineering West Virginia University 9 – Phase Diagram (2) (Phase Reactions)

The Structure and Dynamics of Solids

Analysis of DTA data for binary alloys

Phase Diagrams Chapter 9 4 th Edition Chapter 10 5 th Edition.

ME 330 Engineering Materials

Chapter ISSUES TO ADDRESS... When we combine two elements... what is the resulting equilibrium state? In particular, if we specify the composition.

6.1.3 In Situ Fabrication Techniques -Controlled unidirectional solidification of a eutectic alloy can result in a two-phase microstructure with one of.

Dispersion Strengthening and Eutectic Phase Diagrams

Phase Diagrams Continued

Metallic Materials-Phase Diagrams

Dynamic methods to construct phase diagrams

Material Science & Metallurgy Non Equilibrium Cooling

Materials Engineering

Date of download: 10/15/2017 Copyright © ASME. All rights reserved.

Dispersion Strengthening and Eutectic Phase Diagrams

Phase Diagrams 8-1.

Dr. Jin Liang, Dr. Nader Dariavach

Chapter 5 Phase Equilibria

© 2016 Cengage Learning Engineering. All Rights Reserved.

CHE 333 Class 5 Phase Diagrams. Prov08.

CHAPTER 8 Phase Diagrams 1.

CHAPTER 8 Phase Diagrams 1.

CHAPTER 8 Phase Diagrams 1.

Eutectic Type Phase Diagrams

Phase diagrams of pure substances

Presentation transcript:

On Pb-free (solder) Interconnections for High-Temperature Applications A.A. Kodentsov Laboratory of Materials and Interface Chemistry, Eindhoven University of Technology, The Netherlands

Cross-sectional view of flip-chip package

There is still no obvious (cost-effective) replacement for high-lead, high melting (  C) solder alloys It is not possible to adjust (to increase above 260  C) liquidus temperature of any existing Sn- based solder alloys by simple alloying with environmentally friendly and inexpensive elements Therefore, in the quest for (cost-effective) replacements of the high-lead solders, attention has to be turned towards different base metals as well as the exploration of alternative joining techniques !

Liquidus projection of the Zn-Al-Mg system Ternary eutectic at ~ 343  C

The binary Bi – Ag phase diagram

TMS 2008 Annual Meeting, New Orleans March 9-13, 2008 “Interfacial behaviour between Bi-Ag Solders and the Ni -substrates” (Hsin-Yi Chuang and Jenn-Ming Song) “Interfacial Reaction and Thermal Fatigue of Zn- 4wt.%Al-1wt.% Cu/Ni Solder Joints” by Y. Takaku, I. Ohnima, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, K. Ishida

The binary Bi – Ag phase diagram

The DSC heating curve of the eutectic Bi-Ag alloy

Solidification microstructure of the Bi-Ag eutectic alloy (BEI)

Solidification microstructure of the Bi-Ag hypo-eutectic alloy (BEI) Ag

Transient Liquid Phase (TLP) Bonding solid solid interlayer(s) The interlayers are designed to form a thin or partial layer of a transient liquid phase (TLP) to facilitate bonding via a brazing-like process in which the liquid disappears isothermally In contrast to conventional brazing, the liquid disappears, and a higher melting point phase is formed at the bonding temperature

Transient Liquid Phase (TLP) Bonding Any system wherein a liquid phase disappears by diffusion, reaction (amalgamation), volatilization, or other processes is a candidate for TLP bonding ! solid T = const liquid solid solid product T = const Diffusion, Reaction solid

The effect of Ni additives in the Cu-substrate on the interfacial reaction with Sn

The binary Cu – Sn phase diagram

215  C

Diffusion zone morphology developed between Cu and Sn after reaction at 215  C in vacuum for 225 hrs In the  -Cu 6 Sn 5 :

Reaction zone developed between Sn and Cu 1at.% Ni alloy after annealing at 215  C for 400 hrs pores !!!

Reaction zone developed between Sn and Cu 5at.% Ni alloy after annealing at 215  C for 400 hrs No pores !!! No  -Cu 3 Sn was detected!

Isothermal sections through the Sn-Cu-Ni phase diagram P. Oberndorff, 2001C.H. Lin,  C240  C

Reaction zone developed between Sn and Cu 5at.% Ni alloy after annealing at 215  C for 400 hrs No pores !!! No  -Cu 3 Sn was detected!

Diffusion zone morphology developed between Cu and Sn after reaction at 215  C in vacuum for 225 hrs In the  -Cu 6 Sn 5 :

215  C; 1600 hrs; vacuum

The binary Cu – Sn phase diagram

Part of the Cu-Sn phase diagram in the vicinity of the    / transition Long-Period Superlattice Simple Superlattice

215  C  - phase ?

Cu5Ni Sn Cu5Ni (Cu,Ni) 6 Sn  C Kirkendall plane (s) Cu5Ni Sn Cu5Ni Ag Cu5Ni (Cu,Ni) 6 Sn  C Cu5Ni

Binary phase diagram Ni-Bi 250  C

250  C; 200 hrs; vacuum

Parabolic growth of the NiBi 3 intermetallic layers in the binary diffusion couples at 250  C k p = 5.2 x m 2 /s

ComponentKnoop hardness (kgf*mm -2 ) Ni113.8 NiBi NiBi264.8 Cu79.2 Cu 3 Sn464.5 Cu 6 Sn Knoop microhardness test on Ni-Bi and Cu-Sn systems

Cu5Ni Ni Bi Ni NiBi  C Kirkendall plane (s)

250  C; 400 hrs; vacuum Kirkendall plane(s)

Cu5Ni Ni Bi Ni NiBi  C Kirkendall plane (s) Ni Bi Ni Ag Cu5Ni Ni NiBi  C Ni

Concluding Remarks Through the judicious selection of Sn- or Bi-based interlayer between under bump metallization and substrate pad, (cost-effective) Transient Liquid Phase (TLP) Bonding can be achieved at ~  C, and the resulting joints are capable of service at elevated temperatures ! Therefore, in the quest for (cost-effective) substitutes for high-lead solders, attention has to be turned towards different base metals as well as the exploration of alternative joining techniques ! It is not possible to adjust (to increase above 260  C) liquidus temperature of any existing Sn-based solder alloys by simple alloying with environmentally friendly and inexpensive elements The TLP Bonding should be taken into further consideration as substitute for the high-lead soldering !