Lecture 18 Chemical Engineering for Micro/Nano Fabrication.

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Presentation transcript:

Lecture 18 Chemical Engineering for Micro/Nano Fabrication

∆𝑇= 𝜆 2𝑁 ≈ 0.63μ 2(1.5 ≈0.2𝜇

Effect of Humidity on Dissolution Rate

Dissolution Rate vs Post Apply Bake Temperature

Negative Resist Characterization

Simulated Electron Beam Exposure

Radiation Induced Decomposition of Poly(methyl methacrylate), PMMA

Measuring “G” Values

“G” Values

Lithographic Sensitivity CAUTION… RESIST SENSITIVITY EXPRESSED IN TERMS OF DOSE/UNIT AREA IS LIKE AN EPA MILEAGE RATING… USE IT FOR COMPARISON ONLY. YOUR OWN MILEAGE WILL VARY DEPENDING ON…

Defocus Behavior: a 193 nm Resist 100nm (1:1.1) Trench DOF @ 38.0 mJ/cm ² 0.110µm 0.115um 0.112µm 0.116um 0.112µm 0.116µm 0.112µm 0.114µm 0.114µm - 0.40µm - 0.35µm - 0.30µm - 0.25µm - 0.2µm - 0.15µm - 0.10µm - 0.05µm 0.0µm 0.107µm 0.111µm 0.111µm 0.109µm 0.110µm 0..113µm 0.116um 0.115µm 0.115um 0.117µm 0.112µm 0.116µm 0.114µm 0.115µm +0.45µm +0.4µm +0.35µm +0.30µm +0.25µm +0.2µm +0.15µm +0.10µm +0.05µm 120 à 100 nm Isolated Trench - 0. 1 5µm - 0. 1 0µm - 0.05µm 0.00µm + 0. 05 µm +0.10µm +0.20µm +0.30µm +0.35µm 180 à 100nm Isolated LINE - 0. 15µm - 0. 1 0µm - 0.05µm 0. µm +0. 5µm +0. 10 µm +0.20µm +0.35µm +0.4 µm Exactly what does this measure???