Modified TTF3 Coupler Design and Related R&D for LCLS-II

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Presentation transcript:

Modified TTF3 Coupler Design and Related R&D for LCLS-II Chris Adolphsen Presented by Marc Ross 12/2/14 at the KEK TTC Meeting for the Coupler Team: Jeff Tice, Karen Fant, Dale Miller, Faya Wang, Chris Nantista, Liling Xiao and Zenghai Li (SLAC) and Andy Hocker, Nikolay Solyak, Ken Premo, Tug Arkan, Andrei Lunin, Ivan Gonin and Timer Khabiboulline (FNAL)

Outline Overview and Specs Shorter Antenna Thicker Plating Waveguide Assembly Coupler Results from a FNAL HTS Cavity Measurement Processing and Instrumentation Summary of Coupler Work at SLAC Summary

Cavity Power Coupler Use basic DESY 2006 TTF3 design, but Shift Qext range higher Improve cooling of warm section so can run at 7 kW with full reflection Modify waveguide assembly (use flex rings, perhaps an aluminum WG box and push-pull antenna positioner with coarse/fine manual control)

LCLS-II Coupler Technical Specs Item Spec Comment Design DESY TTF3 Defined by SLAC drawings Max Input Power 7 kW CW Max Reflected Power from Cavity Assume would be able to run with full reflection Minimum Qext Foreseen 1e7 Allows 16 MV/m with no beam and 6.6 kW input Maximum Qext Foreseen 5e7 Match for 0.3 mA beams at 16 MV/m, 26 Hz BW Reduction in Antenna Length 8.5 mm Maintain 3 mm rounding Range of Antenna Travel +/- 7.5 mm Nominal defined by bellow Predicted Qext Min Range 3.6e6 – 4.7e6 – 7.5e6 Includes +/- 5 mm transverse offsets Predicted Qext Max Range 1.0e8 – 1.1e8 – 1.5e8 Warm Section Outer Cond Plating 10 um +/- 5 um, RRR = 10-100 Nominal EuXFEL Warm Section Inner Cond Plating 150 um +/- 10 um, RRR = 10-100 Increase to limit temp rise < 150 degC for 7 kW, full ref. Cold Section Outer Cond Plating 10 um +/- 5 um, RRR = 30-80 Center Conductor HV Bias Optional Use flex copper rings that can be replaced with existing capacitor rings if HV bias needed Warm and Cold e-Probe Ports Yes Will not instrument – do not expect MP Warm Light Port Will not instrument – do not expect arcs Motorized Antenna No Adjust manually Cold Test and RF Processing With 7 kW input, low fields and no multipacting bands – will instead process in-situ

Shorter Coupler Antenna Qext ~ 4e7 Shortened Antenna Qmin Qmid Qmax Original coupler* 1E6 4.0E6 2.0E7 Tip cut by 10 mm 8E6 4.0E7 2.0E8 Tip cut by 8.5 mm 6E6 2.5E7 1.4E8

Coupler Heating Inner conductor temperature for 15 kW TW operation for various thicknesses of the warm section inner conductor copper plating Plating Thickness Limit to 450 K (bake temp)

Effective location of the short (mm) 7 kW Full Reflection Simulations Simulations assume 100 um inner conductor plating and no resistivity increase with plating roughness 3D case includes heating in the warm window Location = 33 mm corresponds to on-resonance operation (no beam) Effective location of the short (mm) 2D 3D

Effect of Copper Roughness on Resistivity –Empirical formula used by circuit board designers Rs = Rs_ideal (T,RRR) * Ksr (roughness, skin depth(Rs_ideal(T,RRR))) Wrong Empirical, Max = 2 1.3 GHz Skin Depth (um) RRR = 10 RRR = 100 T = 300 K 1.8 T = 70 K 0.8 0.6 T < 20 K 0.2

Theoretical Approach at SLAC Developing better theory that depends on feature height to separation ratio – expect this ratio to be << 1, which plot below shows will have a minor effect on heating G. Stupakov

Thicker Copper Plating Qualification Increase copper plating thickness on warm section inner conductor from 30 um to 150 um Recently had 3 ILC sections modified in this way – two will be used in HTS tests at FNAL Cross section of inner conductor bellow in a test section: measure 120-180 um copper thickness variation

FNAL HTS Test Schedule

Calibration of IR sensor on Warm Section at FNAL T1 T2 thermocouplers Nitrogen

Calibration of IR Sensor on Modified Warm Section Emissivity of Cu plated SS tube heated at 900 C is 0.62 ± 0.03. A 10% emissivity error produces a systematic error of 2.10 C.

Arcing at Waveguide Contact When processing ILC couplers, discovered that the waveguide ‘capacitor’ mating surface had arced in some of the warm sections

Copper Flex Rings Made plug-compatible copper flex rings to replace non-flexible HV capacitance rings to get better WG-to-Window contact Adopted by EuXFEL for CPI couplers

Aluminum Waveguide Box (Not in Baseline) Serge Prat, TTC08

Setting Qext Will use manual knob, not motor to move antenna Need to set antenna to 0.5 mm accuracy to get Qext in the 4.0- 4.5e7 range Probably send people into SLAC tunnel to iterate on Qext during commissioning (i.e. can’t rely on mechanical tolerances)

First 6 kW CW Operation at FNAL HTS Used shorter antenna and warm section with 150 um plating Found coupler temp higher than expected due to poor thermal tie-down Will add a SS split-ring washer (a la XFEL) to make the thermal contract between the copper plate and 70 flange better - also increase the number of braids from 2 to 4 Andy Hocker, FNAL

Expected Inner Conductor Temps with Ideal and Measured Boundary Temps 2D Simulations (blue and green lines) and IR measurement (red dot) with 3D Prediction (purple star)

Measured Qext Range Found Qext range shifted lower as if antenna location ~ 3 mm closer to beam line – perhaps 300 K to 2K flange length in the HTS shorter than that in a CM Nominal = either 1 mm or 1.25 mm per turn Andy Hocker, FNAL

Production Coupler RF Processing and Instrumentation Will not low-power test couplers Will not pulse power process the couplers Will not CW process the couplers Will not instrument e-probe ports Will not instrument light port Will monitor coupler vacuum manifold pressure Time (hr) Power (MW) Only high power pulsed rf sources currently available at SLAC. For the couplers needed for the two LCLS-II prototype CMs, do not process as above, but run only at 40 kW (below the lowest multipacting band at 50 kW) with 1.1 ms pulses at 1% duty – do not see change in vacuum pressure with rf on or off.

Summary of 2014 Coupler Work at SLAC Thus Far Increased inner conductor plating thickness in three ILC warm sections – CPI is modifying two more Five pairs of ILC cold sections have had antenna shortened, and have been baked and rf processed. Have contract with CPI to clean, assembly, bake and rf process 8 couplers for EuXFEL Four coupler pairs received at SLAC All pairs cleaned and assembled – CPI visited to learn techniques Two pairs baked + RGA scanned One pair fully processed RFQ for new couplers out soon – already posted on US Federal Business Opportunities web page.

Summary Modified TTF3 coupler design for CW operation appears to work, but thermal anchoring is an issue in the HTS setup. Still considering whether to cold and/or hot test production couplers for LCLS-II