CAF Resistant, Low CTE FR-4 Dielectric Substrate

N4000-7 Application Customers aware of limitations of standard 140°C FR4 and would like a material with higher thermal resistance, CAF resistance, and better dimensional stability. Customers who are currently using high Tg product but are not tied down by the 165°C Tg minimum requirement. Customers who want to maintain high PTH reliability at a lower overall manufacturing cost. Customers haunted by excessive resin recession, z-axis expansion, hole roughness, wicking or drilling problems.

N4000-7 Product Attributes

N4000-7 CAF Resistance CAF Resistance Test Methodology Test Site - PAPDC Laboratories, Fullerton, CA Test Duration - 500 Hours # of Coupons Tested = 3 Test Method - Tellabs GR-78-CORE PAR. 13.1.5. Test Vehicle - Sun Microsystems Test Vehicle #1, CAF TV1 6/15/00. Test Voltage - 10 volts and 50 volts Stabilization Period - 96 Hours Results Show all Coupons Pass with < One Decade of Resistance Drop (both voltages)

Low Tg FR-4 (competitor mtl.) N4000-7 CAF Test Test Condition: 85°C / 85% RH / 50 volts for 10 days Hole diameter: 13 mil (0.33mm) Hole-to-hole spacing: 25 mil (0.64mm) Glass-to-glass thickness: 56 mil (1.4 mm) 8 layer MLB Results: Product did not meet min.OEM requirement Performance superior to Std. FR-4 Low Tg FR-4 (competitor mtl.) N4000-7 FR-4

Other Mtl. (140°C Tg FR4) N4000-7 (155°C Tg FR4)

FR4 Property Comparison High Tg vs. N4000-7 High Tg N4000-7 Tg DSC [oC] 175 155 TMA [oC] 165 145 Z-axis CTE [ppm/ oC] (Before Tg) 75.7 53.6 (-29%) (After Tg) 340 276 (-14%) T-260 [minutes] 5.77 12.3 (+2.0x) Water Absorption [%] 0.142 0.074 (-1.9x) Time to delam. [minutes] 1.64 3.71 (+ 2.3x) by solder dip @ 288oC 0.062” bare laminate properties Compared to High Tg (Pressure cooker @ 15 psi for 1 hour)

Z-Axis CTE Comparison High Tg vs. N4000-7 0.062” core (8 x 7628 43% RC) 0.07 [ppm /oC] Before Tg After Tg High Tg 75.7 340 N4000-7 53.6 276 Low Tg 0.06 High Tg N4000-7 0.05 0.04 Dimension change (um/m) Expansion rate (slope) of Std. Tg (140oC) is similar to High Tg (175oC) 0.03 0.02 Expansion rate (slope) of N4000-7 (155oC) is less than High Tg (175oC) 0.01 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 270 280 290 300 Temperature [ °C ]

Z-Axis CTE Comparison High Tg vs. N4000-7 Calculate total Z -CTE in [%] @ 260C = CTE before Tg + CTE after Tg = (Tg – 30C)1 + (260C - Tg)2 Tg [oC] 1 2 260 oC 288 oC 300 oC High Tg 165 75.7 340 4.25 5.20 5.61 N4000-7 140 53.6 276 3.90 4.67 5.01 where ’s in [ppm/C] Before Tg After Tg TMA Total z-axis CTE in % at Material 0.062” core

Decomposition Temperature Comparison (TGA) Std. Tg 300 °C High Tg 325 °C N4000-7 330 °C N4000-13 336 °C

Physical Appearance High Tg N4000-7 50 x magnification

Physical Appearance N4000-7 500 X 1000 X 3000 X PTH before desmear Optimum desmear Over desmear (smooth)

N4000-7 Q1000 Thermal Cycling Test requirements: 1) Thermal cycling for 1000 cycle @ -40°C to +125°C 2) Less than 10% change in resistance of original value 3) No 100% crack over copper barrel after cross-section 13 mil hole after 1000 hour cycling 0 % failure

N4000-7 European Automotive Application (K8) Test Requirements: Pre-bake sample in oven at 120°C for 8 hours Place sample in humidity chamber for 72 hours at 40°C and 92% RH Thermal shock sample within 1 hour after removal from chamber (solder float 1 x 20 seconds @ 288°C) Objective: 0 - 15% resin recession

European Automotive High Tg after test N4000-7 after test (+30% r.r) Passed resin recession requirement

N4000-7 on 28 Layer Network Backpanel (280 mils, 7.11 mm thick) Actual PCB Properties High Tg N4000-7 Z-CTE [ppm/oC] (50 -120oC) 74.8 65.7 (-12%) (210 -250oC) 393 342 (-13%) T-260 [minutes] 2.38 7.41 (+ 3.1x) Pass 2x solder dip @ 288°C Pass 6x solder float @ 288°C

Lower CTE for N4000-7 62 mils bare laminate 280 mils 28-layer MLB 1 2 260oC 288oC 300oC High Tg 75.7 340 4.25 5.20 5.61 N4000-7 53.6 276 3.90 4.67 5.01 1 2 260oC 288oC 300oC High Tg 74.8 393 4.74 5.84 6.32 N4000-7 65.7 342 4.83 5.78 6.19 Z-axis CTE in % at 280 mils 28-layer MLB Z-axis CTE in % at High Tg N4000-7

Major OEM Applications Network Backpanel Mobile Phone Automotive Rambus™

N4000-7 Field Applications Layer Application Thickness Panel Size 4 - 6 Automotive 62 mils 18 x 24” 6-8 Rambus 48 mils 18 x 24” 6+1+1 Mobile phone 48 mils 18 x 21” 16 Backpanel 200 mils 21 x 24” 20 Backpanel 220 mils 22 x 24” 28 Backpanel 280 mils 21 x 27” 42 Backpanel 360 mils 22 x 25”

N4000-7 Processing Characteristics Process very similar to standard 140°C Tg FR4 material. [similar scaled factor, lamination cycle, drilling, and desmear]. Requires only standard low Tg lamination cycle. 45 minutes at 340°F (175°C) vs. 60-90 minutes at 360°F (182°C) for typical high Tg products. Similar and/or even better chemical, thermal and mechanical characteristics than +170°C high Tg material. Improved drill hole (roughness) quality and capacity. No UL qualification needed if already qualified with any N4105- ## and N4205- ## material.