Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Schematic diagram of four different configurations used

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Testing LED in still air box (a) and the testing configuration of AlN thin film as thermal interface material in high power LED (b)

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: K-factor calibration curve for given LED

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Transient cooling curve of 3-W green LED fixed on bare Cu and AlN thin film-coated Cu substrates with and without thermal paste measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Variation of rise in junction temperature for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Cumulative structure function curve of 3-W green LED fixed on bare Cu and AlN thin film-coated Cu substrates with and without thermal paste measured at (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Variation of LED thermal resistances for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA

Date of download: 10/5/2017 Copyright © ASME. All rights reserved. From: Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink J. Electron. Packag. 2014;136(3):034502-034502-6. doi:10.1115/1.4027379 Figure Legend: Variation of interface resistances for different boundary condition measured at various driving currents: (a) 100 mA, (b) 350 mA, and (c) 700 mA