KoreaShanghai (China)Taiwan Lee Han SuPeter WangSunny Wang HP: HP: HP:

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No. 1 Semiconductor Grade Chinese Manufacturer & Private Company % ~ % Ultra-High Purity Copper The Applications : Bounding Wire for IC Package Plants Semi-Conductor, Sputtering Target CIGS Thin Film PV, High-End Audio Wire … etc % ~ % Ultra-High Purity Titanium The Applications Semi-Conductor, Sputtering Targets Mass Storage, Thin Film PV, Medical Treatment, Aerospace Industry Decoration & Cutting Tool …etc. Material Specification in Details :

We Can Also Supply with Our Partner & Subcontractor in China High Purity Targets from 99.9 % to % & Applications Silver Target : Integrated Circuit, Mass Storage, Photoelectricity, Low-E Glass. Aluminum Target : TFT-LCD Back Board. Chromium Target : Flat Panel Display,, Low-E Glass, Hard Coating, Hard Disk. Cobalt Target : Integrated Circuit, Mass Storage, Photoelectricity, Aerospace Industry Tungsten Titanium Target : Semi-Conductor, Thin Film PV. Nickel Ingot : Integrated Circuit, Mass Storage. Molybdenum Target : Flat Panel Display, Thin Film PV, Medical Equipment, LED. Graphite Target : Semi-Conductor, Flat Panel Display, Mass Storage, Decoration & Cutting Tool. CIGS Target : Thin Film PV. ITO Target : Flat Panel Display, Thin Film PV. Oxides Targets, AZO/TiO2/ZnO…etc. : Flat Panel Display, Thin Film PV. Heat Exchange Power Energy … Coming Soon. Material Specification in Details :

Heat Exchanged Power Energy

Material Specification in Details : Titanium Billet 02 - Titanium Ingot, Plate, Wire, Tube 03 - Titanium Powder 04 - Titanium Pellets 05 - Copper Cathode, Ingot, Plate, Billet 06 - Copper Pellets 07 - Cobalt Ingot 08 - Nickel Ingot 09 - Chromium Target 10 - Graphite Target 11 - Molybdenum Target 12 - Tungsten Titanium Target 13 - Silver Target 14 - CIGS Target 15 - I TO Target 16- Oxides Targets (AZO, TiO2, ZnO... etc) 17- Aluminum Target

Top 10 Integrated Circuit, IC Manufacturers 世界十大積體電路製造企業 (2011) Rank 2011 Rank 2010 CompanyCountry of originRevenue (million $USD)USD 2011/2010 changes Market share 11Intel CorporationIntel Corporation(1)USA %15.9% 22Samsung ElectronicsSouth Korea %9.3% 34Texas InstrumentsTexas Instruments(2)USA %4.5% 43Toshiba Semiconductor Japan %4.3% 55Renesas ElectronicsJapan %3.6% 69QualcommQualcomm(3)USA %3.2% 77STMicroelectronicsFranceItaly %3.1% 86HynixSouth Korea %2.8% 98Micron TechnologyUSA %2.3% 10 BroadcomUSA %2.3%

Top 10 Semi-Conductor (OEM) Manufacturers 世界十大積體電路代工企業 2011 （ foundry) RankCompanyFoundry TypeCountry of originRevenue (million $USD) 1TSMCPure-play Taiwan14,600 2UMCPure-play Taiwan3,760 3GlobalfoundriesPure-play United States3,580 4Samsung SemiconductorIDM South Korea1,975 5SMICPure-play China1,315 6TowerJazzPure-play Israel610 7Vanguard (VIS)Pure-play Taiwan519 8Dongbu HiTekPure-play South Korea500 9IBMIDM United States445 10MagnaChipIDM South Korea350 11SSMCPure-play Singapore345 12Hua Hong NECPure-play China335 13Win SemiconductorsPure-play Taiwan300 14X-FabPure-play Germany285

RankCompanyCountry 2010 Million US$ 1 日月光 ASE Taiwan3875 2AmkorUSA 矽品 SPIL Taiwan 星科金朋 STATS ChipPAC Ltd. Singapore1646 5IbidenJapan1344 6ShinkoJapan 力成 Powertech Technology Inc. Taiwan 欣興 Taiwan927 9 南亞電路板 Taiwan852 10SEMCOKorea627 Top 20 IC Package Company RankCompanyCountry 2010 Million US$ 11 南茂科技 Taiwan 京元電子 Taiwan 景碩 Taiwan 福懋科技 Taiwan 頎邦 Taiwan420 16UnisemMalaysia STS 半導體 Korea 超豐電子 Taiwan 長電科技 China241 20NepesKorea134

Our Main Competitors on Bounding Wire in The World 1.GERMAN : HERAEUS – Precious metals and technology Group (HERAEUS) JAPAN : NIPPON MICROMETAL CORPORATION (NMC) JAPAN : TANAKA Kikinzoku Group (TANAKA) KOREA : MK ELECTRON CO., LTD. (MKE) Our Main Competitors on Titanium Target in the World 1.USA : Honeywell (USA) 2.JAPAN : Toho Titanium Co., Ltd. 3.JAPAN : OSAKA Titanium Technologies Co., Ltd.

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