1. Status of Stripixel Sensor + SVX4 Test Junji Tojo RIKEN VTX Meeting June 1 st, 2004

2. R&D Goals Evaluation of the detector technology used for the outer barrel strip layers The primary candidate is the stripixel sensor + SVX4 chip. R&D items –Measure S/N w/ the v2 prototype sensor (400um/500um) + SVX4 chip. –Study of charge sharing property : principle of single-sided 2- dim sensitivity. –Matching test w/ DC-coupling and AC-coupling (SVX4 is design for AC-coupling sensor).

3. The Current Detector Setup The 400um thick v2 prototype sensor CDF SVX4 hybrid DC-coupling btw sensor and SVX4 ORNL SVX4 readout board (PHENIX DAQ mimic) Laser test bench

4. Snapshot of DAQ Operation Serial parameter configuration Operation w/ LabVIEW DAQ designed by ORNL Timing configuration DAQ GUI

5. SVX4 Operation

6. Timing diagram for the acquire cycle

7. Serial configuration parameters

9. Status Towards measurement of S/N w/ the DC-coupled 400um sensor+SVX4 Laser tests at RIKEN –Laser pulse synchronized with (internal) 10MHz beam clock –External Trigger (L1A) input made from scaled down beam clock –Timing scan (timing btw laser pulse and L1A) –Laser spot focusing (possible up to 10um dia.) –Serial parameter adjustment in SVX4 ← We are here now. –Absolute calibration to obtain S/N Charge injection to SVX4 and/or a radioactive source

10. Laser Signals L1A timing scanned –Adjustable in 30 clocks in SVX4 Laser focusing –Profile showed sharp peak –There is still a room to improve (up to ~10um dia.) Laser intensity corresponding to the ADC channels of the signal can be adjustable. To be adjusted to 1 MIP equivalent. Need to understand the noise. ADC (ch) # SVX4 ch ADC (ch)

11. Detectors to Be Tested What we have in our hands –V2 prototype sensor : 3×400um (QAed), 4×500um (not QAed), 2×500um –Eight CDF SVX4 hybrids –Pitch adaptors for DC/AC-coupling and one-dim readout –One ORNL SVX4 readout board Possible detector configuration –Selection in 400/500um thick, DC/AC-coupling and one/two-dim readout –Note : Pre-production sensors are 500um thickness. –Save SVX4 hybrids to be used for both this R&D and pre-production sensor evaluation –Save the man power in ORNL ROC development Detectors to be made and tested in minimum requirement –[400um thick sensor, DC-coupling, one-dim readout (the current detector)] –500um thick sensor, AC-coupling, one-dim readout –500um thick sensor, DC-coupling, two-dim readout (w/ new pitch adaptor)

12. Schedule S/N w/ 400um thick sensor, DC-coupling and one-dim readout by late June. Two QAed 500um sensors ready around the middle of June. Wire-bonder will be ready at RIKEN by the end of June. New pitch adaptor for 2-dim readout will be ready in early July. Fabrication of 500um thick sensor, AC-coupling and one-dim readout and measurement of S/N from early July to the middle of July. Fabrication of 500um thick sensor, DC-coupling and two-dim readout and measurement of S/N from the middle of July to the end of July.

13. Stripixel Sensor + SVX4 Chip Test Goals –Show enough S/N (>10) with stripixel sensor + SVX4 chip. Tests –DC-coupling scheme as the 1 st step. If fails, AC-coupling scheme will be tested. –DC-coupling test by resetting SVX4 during RHIC abort gap. –AC-coupling test by decoupling sensor with SVX4. Cu/PI flex on SMD (R&C) will be used. –AC-coupling test by decoupling sensor with SVX4. “RC chip” will be used. Stripixel sensor v2 –400μm thick sensor : 4 sensors were fabricated. 2 sensors are available and 2 sensors are before QA and laser-dicing. –500μm thick sensor : 4 sensors are under processing and will be fabricated by the end of March. SVX4 hybrid –CDF SVX4 4-chip hybrid is used. –One hybrid in RIKEN : Used for DC-coupling test. –One hybrid in ORNL : Used for SVX4 readout board development. –Eight hybrids for R&D : Used for AC-coupling & 2D readout tests. Under nego. with FNAL. Detector –Gluing & Wire-bonding for DC-coupling detector at a company (Hara-Seiki in Japan). –Completed. SVX4 readout board –Readout of CDF SVX4 4-chip hybrid w/ PHENIX DAQ mimic –Used for Sensor+SVX4 tests. –Sent to RIKEN soon. The slide shown at the Upgrade DC Meeting on March 10 th. Arrived at RIKEN from Vince on March 15 th. Under testing at RIKEN. Response received from FNAL (Ed&Yasuyuki).