1. Cell Assembly Wafer connected to reinforcing aluminum plate Joined with metal epoxy and silicone thermal grease to ensure good thermal contact A small ring of epoxy around the center of the wafer ensures that there is no chance of shorting between the front and back

2. Cooling System Power output drops quickly as the cell rises in temperature Reinforcing aluminum plate is a good heat conductor and heat reservoir Reinforcing plate joined by metal epoxy and thermal paste to two conventional computer heatsinks with channels

3. Cooling System Heatsinks are partially immersed in water Heat is drawn out of wafer and reinforcing plate into water, which can store very large amounts of heat compared to aluminum Electrically isolated, so simple tap water can be used Cooling is simple and effective, using existing technology and inexpensive components