1. Status FEE-DAQ Walter F.J. Müller, GSI, Darmstadt for the CBM Collaboration 13 th CBM Collaboration Meeting Friday, 13 March 2009

2. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 2 FEE-DAQ for Detector R&D... n-XYTER...

3. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 3 n-XYTER: profile & perspectives Profile:  the n-XYTER is currently used for detector R&D  the chip is available, and has for many applications (STS, GEM, RICH) at least acceptable characteristics  key asset: self-triggered architecture Perspectives:  new readout ASICs are planned for all CBM subsystems  some go by the name CBM-XYTER  CBM-XYTER != n-XYTER !!!  The demonstrators planned for 2009 and early 2010 will use the n-XYTER for proof-of-principle studies & getting used to self-triggered systems.  after mid-2010 we'll see a transition to demonstrators using the prototypes of the CBM readout ASICs.

4. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 n-XYTER FEB Rev. C In spite of bonding difficulties, managed to realize 10 Rev. C boards, fully functional 4 rev. B boards with 64 channels functional (the other 64 may be employed for direct silicon det. tests) We are striving to get the entire system (FEB, SysCore, software) packaged to allow shipment. Volker Kleipa is on board at GSI since January. Slide: C.Schmidtn-XYTER

5. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 Complex Multilayer Data Chain Detector n-XYTER-FEB n-XYTER FEB and Bonding Technology Documentation (Manual) ADC Interconnect SysCore Firmware Embedded software Soft configuration Ethernet-Interconnect PC and DAQ KNUT GUI DAQ System Realize software design freeze to be packaged Missing still: diagnostic toolbox for system analysis to make successful deployment in other labs feasible Slide: C.Schmidtn-XYTER

6. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 n-XYTER FEBs – next steps FEB-Rev D: next version to implement all learnings Relieve PCB specs by tightening bonding necessities and challenge Targeted 125µm pitch, ILFA insists on 140 µm (gap + copper shoulders + 70 µm landing width for bonding) Chip-In-Board, two layer bonding and metal in-lay cooling contact GEM-TPC FEB: ongoing dual n-XYTER for PANDA GEM-TPC n-XYTER Quattro: STS-Baby-Sensor double sided readout  towards a beam telescope Slide: C.Schmidtn-XYTER

7. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 n-XYTER Quatro: Double Sided Silicon Readout Read-Out of double sided Si, 256 x 256 channels First setup to occupy complete capacities of one SysCore Several Modules may be set- up to make a beam telescope FEE of both sides live on one potential!  Rely upon readout-caps! Slide: C.Schmidtn-XYTER

8. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 n-XYTER Energy Output Channel (preliminary) Pulse height spectra with internal test pulse scanned, indetermined C det so far (5-10 pF) peak to peak distance: 5560 e -, FWHM ~ 1000e,  ~ 425e 2780e (CAL = 10) Pedestal tests done as is on the table Slide: C.Schmidtn-XYTER

9. 9 Timestamp – calibration example - random input signals (noise) - delay registers are set to achive the same probability for all counter values - example: four patterns used for bit 0 calibration Slide: R.Szczygieln-XYTER

10. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 10 n-XYTER Engineering Run How many n-XYTER's are available:  about 200, of those 100 are owned by the CBM collaboration Planed systems with n-XYTER's:  starter kits  a lot of small scale detetor R&D  CBM Beam trackers  CBM Demonstrator 1  several other projects outside CBM (PANDA GEM TPC,.....) Not all can be realized with the available chips  plan to produce more  plan for engineering run  cost ~ 110 kEUR, shared by CBM, PANDA, and others  will give many thousand chips  opportunity for fixes, e.g. baseline temperature coefficient  Timelines: Review: end April; Submit: end June

11. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 11 FEE for the Real Thing: UMC 018 Process

12. Experiment Electronics UMC 0.18µm radiation hardness studies - Update - Sven Löchner 13 th CBM Collaboration Meeting GSI Darmstadt March 12th, 2009 Slide: S.LöchnerRadHard

13. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 13 GRISU test ASIC Test structures for TID measurements Test structures for SEU measurements Test structures for SET measurements, Q crit Ring oscillator for TID / SEU measurements GRISU chip UMC 0.18µm process 1.5 x 1.5 mm² 64 pads 28 core pads 36 pads Slide: S.LöchnerRadHard

14. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 14 X6 cave at GSI Low Energy testing site (SEU Tests) Installation of a test facility for ASIC irradiation with heavy ions at X6 cave at GSI (in cooperation with bio physics group) Beam monitoring via ionisation chamber Dosimetry setup available Irradiation of DUT in air Easy access Disadvantages of setup: Only one ion source during beam time “Fixed” LET range for ion source Slide: S.LöchnerRadHard

15. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 15 LET testing range Overview of the LET testing range for the applied heavy ions test Slide: S.LöchnerRadHard

16. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 16 Cross-section (Weibull-Fit) C-12 Ar-40Ni-58Ru-96Xe-132  LET crit = 1.93 MeV cm²/mg  σ sat = 1.48·10 -8 cm²/bit Slide: S.LöchnerRadHard Test with Ru beam running

17. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 17 Total Ionizing Dose (TID) tests TID testing with X-rays Irradiation facility at Institute for Experimental Nuclear Physics, University of Karlsruhe 60keV X-ray 100... 600krad/h 9 GRISU chips tested Total dose between 800krad and 2500krad(SiO 2 ) Operating dose rate between 200krad/h and 580krad/h Two radiation test modes single transistor test structure measurements leakage current, threshold shift, characteristics complete chip measurements transition times, total power consumption Slide: S.LöchnerRadHard

18. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 18 TID tests – single transistors Measurements of the transistor characteristics and calculation of the threshold voltages for different dose levels In total 6 chips are irradiated Total dose up to 2.5Mrad Dose rate between 200krad/h and 580krad/h Slide: S.LöchnerRadHard

19. Experiment Electronics 13 March 200913th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 19 TID summary UMC process shows good annealing at room temperature (at least at high dose rates) Simulation models slightly differs from measured characteristics (especially between small and large Ugs) Still to be done Second irradiation campaign with low dose rates Long term test with a gamma source Slide: S.LöchnerRadHard

20. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 20 FEE for the Real Thing: TOF - RPC

21. Harald Deppe Holger Flemming GSI Event-driven TDC with 4 Channels GET4 Harald Deppe, EE-ASIC Holger Flemming, EE-ASIC Slide: H.FlemmingRPC-GET4

22. Harald Deppe Holger Flemming Requirements for the CBM ToF Very high time resolution < 25ps Double hit resolution < 5ns Event rate up to 50 kHz per channel Capability to measure time over threshold Low power consumption with less than 30 mW per channel Number of Channels: ~ 65.000 Triggerless operation: Each event combined with a timestamp Epoche event on timestamp counter overflow Timestamp counters of all chips have to run synchronously Slide: H.FlemmingRPC-GET4

23. Harald Deppe Holger Flemming GET4 Prototype PCB Bottom side view Top side view Slide: H.FlemmingRPC-GET4

24. Harald Deppe Holger Flemming Summary and Outlook First full scale TDC Prototype GET4 was submitted In Oct. 2008 Token ring readout and serialiser are fully operational DNL of TDC core worse than on DANTE test chip Time resolution: 20 ps … 25 ps Double hit resolution > 3.2 ns With GET4 a first TDC Prototype for ToF detector test is available Next Steps: Investigation on reasons for nonlinearity Upgrading of Linearity => Improve the Resolution Slow control, etc. Slide: H.FlemmingRPC-GET4

25. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 25 FEE for the Real Thing: CBM-XYTER

26. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 26 Slide: T.ArmbrusterCBM-XYTER

27. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 27 Slide: T.ArmbrusterCBM-XYTER PreAmp Tests

28. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 28 Slide: T.ArmbrusterCBM-XYTER PreAmp Tests

29. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 29 Slide: T.ArmbrusterCBM-XYTER PreAmp Tests

30. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 30 Slide: T.ArmbrusterCBM-XYTER ADC Tests

31. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 31 Slide: E.AtkinCBM-XYTER

32. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 32 Slide: K.KasinskiCBM-XYTER

33. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 33 Slide: K.KasinskiCBM-XYTER Time-over-Threshold Proposal

34. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 34 Slide: K.KasinskiCBM-XYTER Time-over-Threshold Proposal

35. XYTER Family Planning, FEE for Tracking Detector Applications Christian J. Schmidt, GSI Darmstadt 13. CBM Collaboration Meeting, GSI, Darmstadt, March 10 – 13, 2009 Slide: C.J.SchmidtCBM-XYTER

36. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Collection of Tracking Detector Specifications Slide: C.J.SchmidtCBM-XYTER Family Planning

37. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Comparison: Tentative Silicon/Gas XYTER Specs Slide: C.J.SchmidtCBM-XYTER Family Planning

38. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Silicon-XYTER proposal Lowest possible power Average signal rate per channel: 150kHz 128 ch Noise: 800 enc at 25pF Average signal: MIP in Si(300) = 25ke Assume signal degradation to 13ke over det. life time ADC res: 5 bit for MIPs (25ke) gives 4 bit for MIP in aged detector = 780e Dynamic range: 4 to 7 MIPs (100 to 169 ke) but not necessarily linear over its range specials: both polarities, switchable bandwidth ( g m ) optimizes power to needs allow DC couppling Time resolution 2 ns TOT solution promises very low power and architectural simplicity Slide: C.J.SchmidtCBM-XYTER Family Planning

39. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Gas Detector XYTER Proposal Dual shapers for timing and energy resolution, energy determination through ADC (similar to n-XYTER) Distinguish discrimination needs and data resolution! More advanced signal conditioning desired. (baseline restoration etc.) Alternate or integrated front-end filtering for wire read-out Large necessary dynamic range may be addressed through a dual realm amplification: 0 to 1000ke and 1000 to 3000 ke Linear interval up to 1000ke needed for TRD applications PANDA TPC application imposes special needs with low mean signal height (25 ke with a dynamic range of 30 times the average (750 ke)). This should however be congruent with TRD needs. Slide: C.J.SchmidtCBM-XYTER Family Planning

40. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 40 CBM-XYTER: Summary Process:  UMC018 very promising. Building Blocks:  CSA, ADC,... in work and converging "Silicon-XYTER"  ToT proposal on the table  needs feedback from simulation (resolution, dead time)  clear path for system prototype "Gas-XYTER"  requirements have more spread  what is 'good to have', what has 'physics performance impact' ?  not yet decided whether all can be accommodated in one ASIC

41. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 41 A Note on FEE So far the FEE sessions were essentially ASIC Designers meetings FEE is more than just read-out ASIC's ! FEE is the whole chain from detector signal to DAQ interface, including the first data aggregation stages and all the cabling up to the detector perimeter We urgently need a 'strawman' FEE design for all CBM sub- systems.

42. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 42 DAQ for Demonstrators

43. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 43 Slide: U.KebschullROC

44. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 44 Slide: U.KebschullROC

45. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 45 Slide: S.ManzROC GET4 Readout

46. Frank Lemke 46 Demonstrator I ROC = Readout Controller DCB = Data Combiner Board ABB = Active Buffer Board * Thanks to Walter F.J. Mueller for this picture. Slide: F.LemkeDCB-CBMnet

47. Frank Lemke 47 Current Status  Basic Communication tested between:  DCB – DCB  DCB – ROC  ABB – DCB  Deterministic Latency for MGTs and GTPs proved with new designs  All existing coded parts are directly implemented in a clean modular way for reusability in later design phases  First version of Protocol implemented in Verilog  Test setup for first protocol version is in preparation => Next step is the first hierarchical communication test with CBM protocol Slide: F.LemkeDCB-CBMnet

48. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 48 Slide: Wenxue GaoABB

49. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 49 Slide: Wenxue GaoABB

50. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 50 Slide: U.Kebschull FPGA - Framework

51. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 51 Slide: U.Kebschull FPGA - Framework

52. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 52 Slide: J.Gebelein FPGA - RadTollerance

53. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 53 Slide: J.Gebelein FPGA - RadTollerance Test with Ru beam running

54. DABCDABC CBM DAQ D ata A cquisition B ackbone C ore http://dabc.gsi.de Work supported by EU RP6 project JRA1 FutureDAQ RII3-CT-2004-506078 Data Acquisition Backbone Core library Jörn Adamczewski-Musch, Hans G.Essel, Nikolaus Kurz, Sergey Linev GSI, Experiment Electronics: Data Processing group Release V1.0 Use cases Slide: H.EsselDABC

55. DABCDABC CBM DAQ D ata A cquisition B ackbone C ore http://dabc.gsi.de 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 55 DABC release v1.0.01 Controls bnet-mbs mbs ROC ABB bnet-test core-test net-test SlimDIM* Java GUI*ApplicationsPlugins bnet-mbs mbs ROC* ABB* ROOT verbs Core Controls: No more XDAQ Plugins: Implementation of applications (programmers) Applications: Mainly setup or testing programs (users) * external packages needed DABCDABC Download via dabc.gsi.de Slide: H.EsselDABC

56. DABCDABC CBM DAQ D ata A cquisition B ackbone C ore http://dabc.gsi.de data input sorting tagging filter analysis data input sorting tagging filter analysis IB Linux PCs GE analysis archive Linux PCs GE: Gigabit Ethernet IB: InfiniBand frontend sender DABC DABC design: global overview TCP PCIe UDP frontend Slide: H.EsselDABC

57. DABCDABC CBM DAQ D ata A cquisition B ackbone C ore http://dabc.gsi.de 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 57 Ethernet Access layer – current view ROClib (KNUT) nXYTER gui DABCDABC ROC plugin ROC PowerPC ROC PowerPC ROC PowerPC file output online monitor Slide: S.LinevDABC

58. DABCDABC CBM DAQ D ata A cquisition B ackbone C ore http://dabc.gsi.de 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 58 optic Ethernet DABC as common access layer nXYTER gui ROC PowerPC ROC PowerPC ROC SFP file output online monitor PCIe/mprace TDC gui + control API remains the same + UDP socket can be served by DABC directly + buffer, thread and configuration management provided + same software stack for tests and beamtime DABCDABC ROC/Ethr plugin ROC/mprace plugin ROC access layer Slide: S.LinevDABC

59. CBM slow control strategy 11.03.2009 CBM collaboration meeting DAQ work group 11.03.2009 CBM collaboration meeting DAQ work group Slide: B.KolbDCS/ECS

60. 13 March 200913th CBM Collaboration Meeting - - Walter F.J. Müller, GSI 60 What it should provide  Safe operation of the experiment  Set up, control and monitoring of detectors, DAQ/trigger and environment  Alarm handling  Archiving  Safe operation of the experiment  Set up, control and monitoring of detectors, DAQ/trigger and environment  Alarm handling  Archiving Slide: B.KolbDCS/ECS

61. 13 March 200913th CBM Collaboration Meeting - - Walter F.J. Müller, GSI 61 Strategy (2)  Use  existing  well tested  supported solutions  Use  Open Source wherever possible  Join  existing development collaborations  Use  existing  well tested  supported solutions  Use  Open Source wherever possible  Join  existing development collaborations Slide: B.KolbDCS/ECS

62. 13 March 200913th CBM Collaboration Meeting - - Walter F.J. Müller, GSI 62 Strategy (3)  Choose EPICS!  Why?  It works!  We have in house experience  It provides solutions for all common hardware (HV, LV, gas, …)  It‘s for free  It‘s scalable  Huge collaboration  Choose EPICS!  Why?  It works!  We have in house experience  It provides solutions for all common hardware (HV, LV, gas, …)  It‘s for free  It‘s scalable  Huge collaboration Slide: B.KolbDCS/ECS

63. 13 March 200913th CBM Collaboration Meeting - - Walter F.J. Müller, GSI 63 Requirements DB  In collaboration with PANDA we have set up a database with web access  http://nuclear.gla.ac.uk/CBM-DCS/ http://nuclear.gla.ac.uk/CBM-DCS/  Register  Then enter requirements:  Process variables  Common hardware  …  In collaboration with PANDA we have set up a database with web access  http://nuclear.gla.ac.uk/CBM-DCS/ http://nuclear.gla.ac.uk/CBM-DCS/  Register  Then enter requirements:  Process variables  Common hardware  … Slide: B.KolbDCS/ECS

64. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 64 The End Thanks for your attention

65. 13 March 2009 13th CBM Collaboration Meeting -- Walter F.J. Müller, GSI 65 Backup's

66. 13th CBM Collaboration Meeting, GSI, March 9-13th 2009 TEMPERATURE SENSITIVITY FAST-SHAPER OUTPUT DC-LEVEL TEMP(°C) Old TEMP.COEFF. ~29 mV/°C Config for negative input signals NEW: TEMP.COEFF. ~0.7 mV/°C Config. for positive input signals NEW: TEMP.COEFF. ~0.5 mV/°C Hans K.Soltveit, Physik. Inst. Heidelberg Slide: C.Schmidtn-XYTER

67. Harald Deppe Holger Flemming Schematic Overview of GET4 Prototype Slide: H.FlemmingRPC-GET4

68. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Silicon-XYTER Distillate Slide: C.J.SchmidfCBM-XYTER Family Planning

69. 13th CBM Collaboration Meeting, GSI, March 10-13th 2009 Gas-XYTER Distillate Slide: C.J.SchmidfCBM-XYTER Family Planning