1. M. Gilchriese Items from Talks U.S. Pixel Meeting Santa Cruz July 2003

2. M. Gilchriese 2 Overview Cost scrubbing is in our future by October. Cost increases are substantial. This will require one-on-few meetings. This includes base program support Critical path organization to get into production. I am nervous and want to initiate more frequent contact on a weekly basis at the appropriate time, but soon. How to resolve fraction of bare modules to U.S. and schedule Position on 2-hit vs 3-hit needs to documented in at least a presentation by mid-September for September 22 meeting –Technical options(eg. service panels) and decision milestones –US cost delta for 3-hit and profile –Discussion with our collaborators by September Pixel Week

3. M. Gilchriese 3 Electronics List of what will be changed in FE-I3, what will be fixed and what wont be fixed If we use FE-I2.1 for production, even of spares, what are the implications? Design tool license issue a problem in near term? Need RPDSG before end July at minimum to understand MCC-I2.1 schedule

4. M. Gilchriese 4 Opto Resolve voltage configuration of VDC by September pixel week. Need special tools for removal of optical connectors from optoboards. Who does this? Need to specify optical package loading in note/message from Eric. Develop QA plan for VCSEL(iv performance etc) and reach agreement with Taiwan. Need optical package production plan from Taiwan Temperature of optoboards not to exceed 10C. Justification not complete but we accept.

5. M. Gilchriese 5 Modules HV reliability needs more work now Resolve additional prober very soon, part of relook at single chip probing given that AMS is now larger fraction of modules. Steal? Single die rate and manpower revisit Revise yield assumptions Include the cost of H&K bonder somewhere Sort out “students”, techs, overlap with mechanics Make second sector

6. M. Gilchriese 6 Flex Impact of conductive gel on reliability Plan for encapsulation and how does this fit into getting into production, impact on FE-I2.1 work Relook at number of flex at each step needed fro 2-hit vs 3-hit system, time etc When will know that flex design is sound? FE-I2.1 modules by October? When next order with Dyconex? Follows from above?

7. M. Gilchriese 7 Mechanics From Neal’s talk –Firm up schedule for availability of SCT barrel for PST transfer jig use –Resolve cost of work done at CERN and part included in Installation MC budget From Alexis’ talk –Recost with remaking PEEK and VESPEL parts after prototype From Eric’s talk –Need to define extra sensors inside PST –Need to follow up on 2-hit service panel layout, options, decision points for 2 vs 3 hit –Need to clarify PRR for BPSS with Lissauer, release of funds –Need to get everything for dry fit, even if manpower is added –Mech tech for service panel + BPSS roughly 1.5 FTE –Labor for testing of service panels, dry fit. Extra fixturing From Ron’s talk –Get quotes for machining quadrants and coolant fitting pieces externally before October –Resolve fabrication and payment for wires/cables and connectors in PP1 region. Currently not costing wires from PP1a and connectors(even one half) at PP1b From Gil’s talk –Get an engineer! Look at costs of frame pins/fasteners, disk assembly and final assembly by October From Maurice’s talk –Update service panel numbers, get time and materials estimate Need to review manpower availability for all mechanics. Current plan(ETC03) looks light

8. M. Gilchriese 8 M&O Where does the 84 kchf C2C in 2003 go? Ask Leo. Have cables and fibers for SR building for pixels been taken care of from FY03 M&O? Coherent M&O and installation funding, update

9. M. Gilchriese 9 Upgrades 2-hi vs 3-hit – see overview Need to document in presentations technical aspects of upgrade R&D beyond the 3-hit for September 22 meeting.