1. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 1 WIPER PDR Stanford, CA February 9-10, 2006 9-10 FEB 06 1 TCU Mechanical Design Overview William D. Perry Southwest Research Institute (210) 522-2747 bperry@swri.org

2. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 2 9-10 FEB 06 2 TCU Mechanical Design Requirements nProvide Mounting for: n 3 Extended 6U VME Electronics ( CPU, DIG, ANA) Modules n 1 Power Supply (POW) Modules n 1 Shield (SHD) Module n 1 Backplane for Modules nWithstand Launch, Test and On-orbit Environments nRemove Waste Heat via Conduction & Radiation nMax. size: No Requirement Target size: L< (30 cm) x W <(25 cm) x H< (16.0 cm) nMass: No Requirement Target Mass < 12 kg nProvide a minimum of 5mm Aluminum Equivalent Radiation Shielding

3. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 3 9-10 FEB 06 3 TCU Dimensions 23.2 cm 14.3 cm 29.5 cm.25 cm ANA SHD DIG CPU POW

4. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 4 9-10 FEB 06 4 TCU Chassis Assembly

5. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 5 9-10 FEB 06 5 TCU Mounting Interface 29.53 0 28.74 0.79 23.18 21.91 15.03 8.15 1.27 23.18 8 Holes.714 Diameter For Mounting Screws All dimension in Centimeters (cm)

6. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 6 9-10 FEB 06 6 POW, CPU, DIG. SHD & ANA Module Mechanical Design Requirements nPackage the circuit boards in a Extended 6U VME Electronics Modules nModules designed to be installed in the TCU Chassis. nWithstand Launch, Test and On-orbit Environments nRemove Waste Heat via Conduction nProvide card retainers to secure the module and insure a low resistant thermal path to the chassis

7. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 7 9-10 FEB 06 7 SIB Chassis Design Concept nSingle Chassis with Slots are provided for: n 3 Extended 6U VME Modules ( 25.4 mm Thick) n 1 Low Voltage Power Supplies Module ( 25.4 mm Thick) n 1 Shield Module (25.4 mm Thick) nA one piece front panel is used to minimize EMI nChassis will provide conductive cooling of modules nThermal management is accomplished using conduction to the mounting plate and radiative heat transfer nPackage is fabricated from Aluminum to provide required thermal path, radiation shielding and minimal weight nThe internal volume of the enclosure is vented nVent: 44 holes 1.6 mm diameter nChassis Mounting holes are provided for 8 ¼-28 Screws

8. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 8 9-10 FEB 06 8 Module Packaging Concept nCircuitry contained in easily removed modules. nTCU Modules are modified VME 6U configuration. nIn each module the circuit board is mounted to a set of machined aluminum support rails to provide strength and a thermal path. nAn aluminum stiffener is provided in each 6U module. nModules are secured in the chassis by screws on the front panel and Wedge Lok card retainers that insure a thermal path to the chassis.

9. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 9 9-10 FEB 06 9 TCU Modules CPU DIG ANA SHDPOW

10. For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 10 9-10 FEB 06 10 TCU Mass Estimate