1. Process Control during Wafer Design and Production

2. The development and implementation of the Reliability Rule Checker tools stating from the basic process technology assessment through automated tool.

3. ASIC Part Evaluation (1 of 2) ASIC Design Vendor Selection Dominated by Analog Design Transfer of ASIC Design Files (GDS) to Vendor ASIC Fabrication (Wafers) Package PEM parts Characterize Packaged parts as per PEM flow Evaluate and Survey Packaging Part Supplier Test vectors over specified Temp. and Voltage extremes Electrical Characterization Performance Tests Specification and Data Verification DPA (Sample Only)

4. ASIC Part Evaluation (2 of 2) Package Flight Parts as per SCD Qualify Flight Packaged Parts as per modified PEM test flow (samples only) Evaluation and Selection of a Screening Supplier 100% Screen all parts, using test vectors. Perform functional test, etc Failure may require failure analysis Parts to the Controlled Storage Modify design if required and repeat previous steps

5. QUALIFICATION OF PLASTIC ENCAPSULATED MICROCIRCUITS (1 of 2) Receiving Inspection Review Suppliers’ Qualification and Reliability Data Supplier Selection Review Performance History Review Reliability Monitoring Details Statistical Process Control (SPC) Procure Parts Visual Inspection Scanning Acoustic Microscopy Destructive Physical Analysis (DPA) Review Data Pre-Conditioning (5 pieces max.) SMD to be machine soldered Temp. Cycling 20 cycles Scanning Acoustic Microscopy Bake-out 16 hrs Scanning Acoustic Microscopy Moisture Soak 85  C / 85% RH Reflow Phase 220  C, 1 Pass Pre-Conditioning Sequence Final Visual Examination

6. PLASTIC ENCAPSULATED MICROCIRCUITS (2 of 2) Scanning Acoustic Microscopy Destructive Physical Analysis, Sample Temperature Cycling, (100%), 883, Method 1010, 10 Cycles Initial Electrical 883, Method 5005, Subgroup 2 Burn-In 72 / 160 hrs. max. Interim Electrical 883, Method 5005, Subgroup 1 Calculate Percentage Defects Allowable (PDA)  10% Final Electrical 883, Method 5005, Subgroups 2 - 7 Scanning Acoustic Microscopy External Visual